Exposed Die-Top Encapsulation Molding for an Improved High- Performance Flip Chip BGA Package

The recent advancement in high- performance semiconductor packages has been driven by the need for higher pin count and superior heat dissipation. A one-piece cavity lid flip chip ball grid array (BGA) package with high pin count and targeted reliability has emerged as a popular choice. The flip chip technology can accommodate an I/O count of more than five hundreds500, and the die junction temperature can be reduced to a minimum level by a metal heat spreader attachment. None the less, greater expectations on these high-performance packages arose such as better substrate real estate utilization for multiple chips, ease in handling for thinner core substrates, and improved board- level solder joint reliability. A new design of the flip chip BGA package has been looked into for meeting such requirements. By encapsulating the flip chip with molding compound leaving the die top exposed, a planar top surface can be formed. A, and a flat lid can then be mounted on the planar mold/die top surface. In this manner the direct interaction of the metal lid with the substrate can be removed. The new package is thus less rigid under thermal loading and solder joint reliability enhancement is expected. This paper discusses the process development of the new package and its advantages for improved solder joint fatigue life, and being a multichip package and thin core substrate options. Finite-element simulations have been employed for the study of its structural integrity, thermal, and electrical performances. Detailed package and board-level reliability test results will also be reported     

Magnetically induced non-Faraday nonreciprocity in a fiber-optic gyroscope

Optical phase nonreciprocity is found to appear in fiber-optic gyroscopes as a result of a magnetically induced distortion of a propagating fiber mode. It is shown that this nonreciprocity places a limitation on the magnetic stability of a gyroscope.     

Routing Correlated Data with Fusion Cost in Wireless Sensor Networks

In this paper, we propose a routing algorithm called minimum fusion Steiner tree (MFST) for energy efficient data gathering with aggregation (fusion) in wireless sensor networks. Different from existing schemes, MFST not only optimizes over the data transmission cost, but also incorporates the cost for data fusion, which can be significant for emerging sensor networks with vectorial data and/or security requirements. By employing a randomized algorithm that allows fusion points to be chosen according to the nodes' data amounts, MFST achieves an approximation ratio of 5/4log(k + 1), where k denotes the number of source nodes, to the optimal solution for extremely general system setups, provided that fusion cost and data aggregation are nondecreasing against the total input data. Consequently, in contrast to algorithms that only excel in full or nonaggregation scenarios without considering fusion cost, MFST can thrive in a wide range of applications     

Nonlinear crack dynamics and scaling aspects of fracture (experimental and theoretical study)

Nonlinear dynamics of crack propagation are investigated experimentally and theoretically with the goal of clarifying the nature of limiting crack velocity, the transition from steady state to branching regimes of crack dynamics, and the dynamics of crack arrest. The theoretical explanation of limiting steady-state crack velocity and the transition to a branching regime was proposed due to the study of collective behavior of a microcrack ensemble at the crack tip area. The experimental study of crack dynamics was carried out in a preloaded plate PMMA specimen using the high-speed camera coupled with the photo-elasticity method, the point stress recording with a laser system, and the failure surface roughness measurement.     

Progressive damage modelling of SMC composite materials

The present work deals with the modelling of damage behaviour for sheet moulding compound (SMC) composite materials using a finite element analysis package. Specifically, a comparison is made between the results obtained experimentally for a three-point bending test, and those obtained from numerical simulation using a material model already implemented. The simulation has been performed for the material models available within the PAM-CRASH software. The simulation results are compared and validated with respect to experimentation.     

Nanoscale Crystallization in Amorphous Fe–P–Mn Alloys

Mössbauer effect measurements and physicochemical analysis demonstrate that annealing of amorphous Fe–P–Mn alloys leads to the formation of a nanocrystalline structure.     

TEM Studies of High Temperature Corrosion Behaviour of TiAl Intermetallics with Surface Modifications

The oxidation/sulphidation behaviour of a Ti‐46.7Al‐1.9W‐0.5Si alloy with a TiAl₃ diffusion coating was studied in an environment of H₂/H₂S/H₂O at 850^oC. The kinetic results demonstrate that the TiAl₃ coating significantly increased the high temperature corrosion resistance of Ti‐46.7Al‐1.9W‐0.5Si. The SEM, EDX, XRD and TEM analysis reveals that the formation of an Al₂O₃ scale on the surface of the TiAl₃‐coated sample was responsible for the enhancement of the corroison resistance. The Ti‐46.7Al‐1.9W‐0.5Si alloy was also modified by Nb ion implantation. The Nb ion implanted and as received sampels were subjected to cyclic oxidation in an open air at 800^oC. The Nb ion implantation not only increased the oxidation resistance but also substantially improved the adhesion of scale to the substrate.     

用动态规划神经网络模型研究多水库系统的水量分配(下)

为了分析多水库系统中两座水库之间灌溉用水的分配问题，建立了基到动态规划的神经网络模型。为了研究从一座上游水库取水在下游两座之库之间进行水量分配的问题，提出了3个状态变量和4个决策变量的改进的动态规划算法。采用神经网络模型，用3个状态变量动态规划算法得出调度原则，就所研究的多水库系统实例来说，新的动态规划神经网络模型的性能很好，将该模型的性能与临时凑合的标准调度原则和以前推荐使用的约束动态规划神经网络模型进行了比较。