首页 | 官方网站   微博 | 高级检索  
文章检索
  按 检索   检索词:      
出版年份:   被引次数:   他引次数: 提示:输入*表示无穷大
  收费全文   58658篇
  免费   2549篇
  国内免费   202篇
工业技术   61409篇
  2023年   541篇
  2022年   855篇
  2021年   1430篇
  2020年   1011篇
  2019年   1030篇
  2018年   1367篇
  2017年   1363篇
  2016年   1684篇
  2015年   1346篇
  2014年   2098篇
  2013年   3607篇
  2012年   3284篇
  2011年   4037篇
  2010年   3069篇
  2009年   3262篇
  2008年   3021篇
  2007年   2550篇
  2006年   2353篇
  2005年   2019篇
  2004年   1939篇
  2003年   1766篇
  2002年   1715篇
  2001年   1321篇
  2000年   1230篇
  1999年   1214篇
  1998年   2219篇
  1997年   1460篇
  1996年   1237篇
  1995年   986篇
  1994年   743篇
  1993年   713篇
  1992年   515篇
  1991年   515篇
  1990年   431篇
  1989年   423篇
  1988年   328篇
  1987年   287篇
  1986年   263篇
  1985年   249篇
  1984年   215篇
  1983年   157篇
  1982年   169篇
  1981年   140篇
  1980年   136篇
  1979年   114篇
  1978年   102篇
  1977年   130篇
  1976年   171篇
  1975年   86篇
  1974年   79篇
排序方式: 共有10000条查询结果,搜索用时 0 毫秒
991.
The electromigration behavior of low-melting temperature Sn-58Bi (in wt%) solder joints was investigated with a high current density between 3 and 4.5 × 103 A/cm2 between 80 and 110 °C. In order to analyze the impact of various substrate metallizations on the electromigration performance of the Sn-58Bi joint, we used representative substrate metallizations including electroless nickel immersion gold (ENIG), electroless nickel electroless palladium immersion gold (ENEPIG), and organic solderability preservatives (OSP). As the applied current density increased, the time to failure (TTF) for electromigration decreased regardless of the temperature or substrate metallizations. In addition, the TTF slightly decreased with increasing temperature. The substrate metallization significantly affected the TTF for the electromigration behavior of the Sn-58Bi solder joints. The substrate metallizations for electromigration performance of the Sn-58Bi solder are ranked in the following order: OSP-Cu, ENEPIG, and ENIG. Due to the polarity effect, current stressing enhanced the fast growth of intermetallic compounds (IMCs) at the anode interface. Cracks occurred at the Ni3Sn4 + Ni3P IMC/Cu interfaces on the cathode sides in the Sn-58Bi/ENIG joint and the Sn-58Bi/ENEPIG joint; this was caused by the complete consumption of the Ni(P) layer. Alternatively, failure occurred via deformation of the bulk solder in the Sn-58Bi/OSP-Cu joint. The experimental results confirmed that the electromigration reliability of the Sn-58Bi/OSP-Cu joint was superior to those of the Sn-58Bi/ENIG or Sn-58Bi/ENEPIG joints.  相似文献   
992.
993.
994.
Trace amount (0.3?wt%) of scandium is added to Al–5.6Mg–0.7Mn alloy to form uniformly distributed Al3Sc precipitates for producing a fine-grained and stable microstructure at high temperature through cross-channel extrusion process. Superplasticity and hot workability of the Sc-containing Al–5.6Mg–0.7Mn alloy, after extrusion, are also examined. The result indicates that Al–5.6Mg–0.7Mn alloys with and without 0.3?wt% Sc after extrusion of six passes at 300°C, fine-grained structures were observed with grain sizes of 1–2?µm and improvement of mechanical properties. Furthermore, Al3Sc phase can effectively retard recrystallization to increase the thermal stability and remain equiaxed. The elongation of Al–5.6Mg–0.7Mn alloy with Sc addition to failure is extended to 873% maximum at high temperature of 450°C at strain rate of 1?×?10?1?s?1after six passes in the CCEP.  相似文献   
995.
Biologically and environmentally resorbable electronic devices support application possibilities that cannot be addressed with conventional technologies. This paper presents highly conductive, water-soluble composites that can be printed to form contacts, interconnects, antennas, and other important features that are essential to nearly all systems of this type. An optimized material formulation involves in situ polymerization to yield a polyanhydride containing a dispersion of molybdenum microparticles at appropriate concentrations. Comparisons of essential physical and electrical properties of these materials to those of composites formed with other polymers and other metal microparticles reveal the relevant considerations. Various functional demonstrations of screen-printed test structures and devices illustrate the suitability of these conductive inks for use in water-soluble electronic devices. A key advantage of the material introduced here compared to alternatives is its ability to maintain conductance over significant periods of time while immersed in relevant aqueous solutions. Studies involving live animal models establish the biocompatibility.  相似文献   
996.
Magneto-mechanical resonators—magnetically-driven vibration devices—are used in many mechanical and electrical devices. We develop topology optimization (TO) to configure the magnetic fields of such resonators to enable large vibrations under specified current input to be attained. A dynamic magneto-mechanical analysis in the frequency domain is considered where we introduce the surface magnetic force calculated from the Maxwell stress tensor. The optimization problem is then formulated involving specifically the maximization of the dynamic compliance. This formulation is implemented using the solid-isotropic-material-with-penalization method for TO by taking into account the relative permeability, Young’s modulus, and the mass density of the magnetic material as functions of the density function. Through the 2D numerical studies, we confirm that this TO method works well in designing magnetic field patterns and providing matching between the external current frequency and eigenfrequency of the vibrating structure.  相似文献   
997.
Soft electronic systems are emerging that are heralded to bring revolution and a frontier for the interactions between human beings and machines. Interactive interfaces enable integrated bidirectional functionalities of sensing the external stimulus and providing interactive response to the users. Human body is considerably soft and stretchable; this characteristic puts forward the need for good mechanical conformabilities for the interfacing electronic devices. As a vital and indispensable component in electronic systems, soft and deformable conductor is of great importance to establish the enabling technologies. Significant progresses have been developed with new strategies and materials being exploited to improve the performance of elastic conductors. In this article, we review the latest advances in deformable conductors and their applications to enable soft electronic devices for human–machine interfaces. We first focus on the important characteristics of the deformable conductors in their stretchability, conductivity, and transparency. Representative soft electronic systems that are categorized into “receptive devices” and “responsive devices” are then reviewed.  相似文献   
998.
In this work, CsPbBr3 and PbSe nanocomposites were synthesized to protect perovskite material from self-enlargement during reaction. UV absorption and photoluminescence (PL) spectra indicate that the addition of Se into CsPbBr3 quantum dots modified the electronic structure of CsPbBr3, increasing the band gap from 2.38 to 2.48 eV as the Cs:Se ratio increased to 1:3. Thus, the emission color of CsPbBr3 perovskite quantum dots was modified from green to blue by increasing the Se ratio in composites. According to X-ray diffraction patterns, the structure of CsPbBr3 quantum dots changed from cubic to orthorhombic due to the introduction of PbSe at the surface. Transmission electron microscopy and X-ray photoemission spectroscopy confirmed that the atomic distribution in CsPbBr3/PbSe composite clusters is uniform and the composite materials were well formed. The PL intensity of a CsPbBr3/PbSe sample with a 1:1 Cs:Se ratio maintained 50% of its initial intensity after keeping the sample for 81 h in air, while the PL intensity of CsPbBr3 reduced to 20% of its initial intensity. Therefore, it is considered that low amounts of Se could improve the stability of CsPbBr3 quantum dots.  相似文献   
999.
Growth factors are potent stimuli for regulating cell function in tissue engineering strategies, but spatially patterning their presentation in 3D in a facile manner using a single material is challenging. Micropatterning is an attractive tool to modulate the cellular microenvironment with various biochemical and physical cues and study their effects on stem cell behaviors. Implementing heparin's ability to immobilize growth factors, dual‐crosslinkable alginate hydrogels are micropatterned in 3D with photocrosslinkable heparin substrates with various geometries and micropattern sizes, and their capability to establish 3D micropatterns of growth factors within the hydrogels is confirmed. This 3D micropatterning method could be applied to various heparin binding growth factors, such as fibroblast growth factor‐2, vascular endothelial growth factor, transforming growth factor‐betas and bone morphogenetic proteins while retaining the hydrogel's natural degradability and cytocompability. Stem cells encapsulated within these micropatterned hydrogels have exhibited spatially localized growth and differentiation responses corresponding to various growth factor patterns, demonstrating the versatility of the approach in controlling stem cell behavior for tissue engineering and regenerative medicine applications.  相似文献   
1000.
Statistics is essential to design experiments and interpret experimental results. Inappropriate use of the statistical analysis, however, often leads to a wrong conclusion. This concept article revisits basic concepts of statistics and provides a brief guideline of applying the statistical analysis for scientific research from designing experiments to analyzing and presenting the data.  相似文献   
设为首页 | 免责声明 | 关于勤云 | 加入收藏

Copyright©北京勤云科技发展有限公司    京ICP备09084417号-23

京公网安备 11010802026262号