Fracture behavior of Cu-cored solder joints

Copper-cored solder can be regarded as the next-generation solder for microelectronic semiconductors exposed to harsh operating conditions owing to its excellent sustainability under extreme thermal conditions, e.g., in microelectronic semiconductors used in transportation systems. Cu-cored solder joints with two different coating layers, Sn–3.0Ag and Sn–1.0In, were compared with the baseline Sn–3.0Ag–0.5Cu solder. The fracture strength and failure mode were examined using the high-speed ball-pull and normal-speed shear tests. The Cu-cored solder joint with the Sn–1.0In plating layer exhibited the highest ball-pull and shear strengths. In addition, it showed a much lower percentage of interface fracture between the Cu-core and plating layer than the interface fracture percentage in the Sn–3.0Ag plating layer due to the improved wettability between the Cu-core and Sn–1.0In plating layer.     

Control of serial sampling systems

In industrial multivariable plants, it is often the case that the plant outputs are detected not simultaneously but serially. The problem of estimating the state vector of the plant based on the data obtained from such a detection scheme is considered, and a special type of observer (referred to as a serial-sampling type) which renews its internal state whenever new data are obtained is proposed. The constructability of a serial-sampling observer and the stability of the closed-loop system which includes such an observer are theoretically studied     

Cloning and sequencing of the pyrG encoding cytidine 5''-triphosphate synthetase from Mycobacterium bovis BCG

Treatment of estrogen receptor (ER)-negative MDA-MB-468 human breast cancer cells with 10 nM 2,3,7,8-tetrachlorodibenzo-p-dioxin (TCDD) induced formation of a nuclear aryl hydrocarbon (Ah) receptor complex as determined by ligand-binding and gel electrophoretic mobility shift assays. TCDD also induced CYP1A1-dependent activity in MDA-MB-468 cells, which represents the first ER-negative Ah receptor-positive human breast cancer cell line that has been identified. Treatment of this cell line with TCDD and related compounds also caused a 50% inhibition of cell growth, which resembled the growth inhibitory effects previously reported for epidermal growth factor (EGF). However, EGF expression is minimal in this cell line and is not induced by TCDD; moreover, EGF and TCDD induced a different pattern of oncogene expression and apoptosis in MDA-MB-468 cells. In contrast, TCDD caused a rapid and sustained induction of transforming growth factor alpha (TGF alpha) gene expression and secreted protein (nearly 2-fold); moreover, the growth-inhibitory effects of TCDD could be blocked by antibodies to the EGF receptor. In a separate experiment, it was shown that TGF alpha also inhibited growth of MDA-MB-468 cells. The results of this study indicate that the mechanism of growth inhibition of MDA-MB-468 cells by TCDD is due to induction of TGF alpha, which is a potent antimitogen in this cell breast cancer line.     

The evolution of cluster network structure and firm growth: a study of industrial software clusters

Since the cluster began to receive attention as a critical environmental factor in geographical economics, it has provided a major research methodology across multiple disciplines from industrial organization, strategic management, regional innovation system, and Triple Helix to virtual clusters. Network structure analysis (NSA) offers a common framework to observe clusters that have been studied separately from the viewpoint of industrial organization and strategic management. Industrial structure analysis, is based on the externality of a network and the resource-based view, focused on the inherent network capacity, have been combined with the study of structural changes through cluster NSA, to create a new direction for the growth of industry and individual firms. This study aims to analyze the correlation between the networking of structural change and a firm’s performance by selecting a software industrial cluster as a representative case for the knowledge industry. We examine the network structural positions of each node during the cluster evolution process. This empirical study has significance for establishing a firm’s growth strategy as well as supporting the policy about clusters, through outlining the dynamic evolution process of the networking activities in a knowledge industry cluster.     

Synthesis of copper nanoparticles by solid-state plasma-induced dewetting

Copper nanoparticles were prepared by the plasma treatment of Cu thin films without extra heating. The Cu nanoparticles were formed through a solid-state dewetting process at temperatures of less than 450 K. The particle sizes, from 10 to 80 nm, were controlled by changing the thickness of the Cu film; the particle size increased linearly with the film thickness. The Cu nanoparticles produced by plasma treatment showed an excellent size uniformity compared to those prepared by heat treatment. In the early stage of the dewetting of the Cu film, uniformly distributed holes nucleated, and the holes grew and coalesced until the Cu nanoparticles were formed. The low operating temperatures used contributed to the production of uniform Cu nanoparticles.     

Control of domain wall pinning in ferromagnetic nanowires by magnetic stray fields

We have found that the depinning field of domain walls (DWs) in permalloy (Ni(81)Fe(19)) nanowires can be experimentally controlled by interactions between magnetic stray fields and artificial constrictions. A pinning geometry that consists of a notch and a nanobar is considered, where a DW traveling in the nanowire is pinned by the notch with a nanobar vertical to it. We have found that the direction of magnetization of the nanobar affects the shape and local energy minimum of the potential landscape experienced by the DW; therefore, the pinning strength strongly depends on the interaction of the magnetic stray field from the nanobar with the external pinning force of the notch. The mechanism of this pinning behavior is applied for the instant and flexible control of the pinning strength with respect to various DW motions in DW-mediated magnetic memory devices.