The thermal ignition of lignocellulosics in infinite slab and cubic geometries

Wood shaving samples were heated in both cubic baskets and in a previously described system realising the conditions of the ‘infinite slab’ in thermal ignition. Results from the two sets of experiment were found to be totally consistent with each other.     

复合材料压缩破坏模式的缺陷敏感性

本文基于弹塑性分叉理论研究单向纤维增强复合材料的压缩破坏模式和压缩强度对缺陷的敏感性问题。对于常见复合材料,所得结论是:无缺陷或者小缺陷情况的破坏模式为倾斜破坏带;大缺陷情况的破坏模式为水平破坏带;形成水平破坏带的压力值小于形成倾斜破坏带的压力。     

Output probability from a general combinational network

In this paper, we present the method which calculates the probability of the output of a general combinational network being 1, when the probabilities is given for each input being 1. Also we present the method which derives the output probability expression in terms of a given set of input probabilities.The method is based on a basic probability axiom and Binary Decision Diagrams. A Boolean function for a combinational network is transformed into a Binary Decision Diagram and the output probability expression is derived from it. Therefore a derivation of the output probability for a combinational network can be straightforward. Some examples are showed that the method using Binary Decision Diagrams is simple and efficient. We can see a variation of the output probability for a combinational network according to the given set of input probabilities.     

Two-level optimal output feedback stabilizer design

Design of two-level system stabilizers is considered using an optimal reduced-order model whose state variables are torque angles and speeds. The reduced-order model retains their physical meaning and is used to design a two-level linear feedback controller that takes into account the realities and constraints of the electrical power systems. The two-level control strategy is used, and a global control signal is generated from the output variables to minimize the effect of interaction. The effectiveness of this controller is evaluated, and an example, the multimachine system, is given to illustrate the advantages of the proposed method. The responses of the system with the two-level scheme and optimal reduced order scheme are included for comparative analyses     

An Analog Front‐End Circuit for ISO/IEC 14443‐Compatible RFID Interrogators

An analog front‐end circuit for ISO/IEC 14443‐compatible radio frequency identification (RFID) interrogators was designed and fabricated by using a 0.25 µm double‐poly CMOS process. The fabricated chip was operated using a 3.3 Volt single‐voltage supply. The results of this work could be provided as reusable IPs in the form of hard or firm IPs for designing single‐chip ISO/IEC 14443‐compatible RFID interrogators.     

Effect of the Liquid-Phase Characteristic on the Microstructures and Dielectric Properties of Donor- (Niobium) and Acceptor- (Magnesium) Doped Barium Titanate

Changes in the microstructure and dielectric properties with the variation of the donor/acceptor ratio in BaTiO₃ ceramics were investigated. In donor-rich specimens, a liquid that appeared during sintering did not penetrate into grain boundaries. However, in the acceptor-rich specimens, the grains were separated by a liquid film during sintering. The much higher mobility of the liquid film than that of the grain boundaries was suggested to cause extensive grain growth in acceptor-rich BaTiO₃. The macroscopic homogenization of dopants because of grain growth in acceptor-rich specimens resulted in changes in the dielectric properties.     

Scaling laws and internal structure for characterizing electrospun poly[(R)-3-hydroxybutyrate] fibers

Using chloroform/dimethylformamide (CF/DMF) co-solvent, electrospinning of poly[(R)-3-hydroxybutyrate] (PHB) solutions was carried out at ambient temperature. The effects of the applied voltage (V), flow-rate (Q), and solution viscoelastic properties on the Taylor cone, electrified jet, and fiber morphology were investigated. In addition, the electric field developed by the needle-plate electrode configuration was calculated using a finite element analysis to reveal the tip-to-collector (H) effect. Among the processing parameters (V, Q and H), it was found that Q played a key role in determining the jet diameter (d_j) and electrospun fiber diameter (d_f), and scaling laws existed between them, i.e., d_j-Q^0.61 and d_f-Q^0.33. The diameter reduction ratios of D_o/d_j (D_o is the needle diameter) and d_j/d_f were measured as 50-120 and 5-10, respectively; it suggested that major jet stretching took place in the straight electrified jet region, and further chain orientation could be gained by the subsequent process of jet whipping. By changing PHB concentrations from 5 to 15 wt%, the solution viscosity (η_o) was increased from 100 to 4900 cP, whereas the surface tension and solution conductivity remained unchanged; it provided a good model solution to exclusively reveal the η_o effect on the electrospinning process. Our results showed that the η_o-dependence of d_j and d_f also followed simple scaling laws: d_j-η_o^0.06, and d_f-η_o^0.39, with a prefactor depending on the processing variables, mainly the flow-rate. Regardless of the PHB concentrations used, the obtained PHB fibers showed a similar crystallinity fraction of ca. 0.63 and possession of major α-crystals together with a small amount of β-crystals with zigzag chain conformation.     

The Fabrication and Characterization of Single‐Component Polymeric White‐Light‐Emitting Diodes

By using Ni⁰‐mediated polymerization, we have systematically synthesized a series of fluorene‐based copolymers composed of blue‐, green‐, and red‐light‐emitting comonomers with a view to producing polymers with white‐light emission. 2,7‐Dibromo‐9,9‐dihexylfluorene, {4‐(2‐[2,5‐dibromo‐4‐{2‐(4‐diphenylamino‐phenyl)‐vinyl}‐phenyl]‐vinyl)‐phenyl}‐diphenylamine (DTPA), and 2‐{2‐(2‐[4‐{bis(4‐bromo‐phenyl)amino}‐phenyl]‐vinyl)‐6‐tert‐butyl‐pyran‐4‐ylidene}‐malononitrile (TPDCM) were used as the blue‐, green‐, and red‐light‐emitting comonomers, respectively. It was found that the emission spectra of the resulting copolymers could easily be tuned by varying their DTPA and TPDCM content. Thus with the appropriate red/green/blue (RGB) unit ratio, we were able to obtain white‐light emission from these copolymers. A white‐light‐emitting diode using the polyfluorene copolymer containing 3 % green‐emitting DTPA and 2 % red‐emitting TPDCM (PG3R2) with a structure of indium tin oxide/poly(3,4‐ethylenedioxythiophene):poly(styrene sulfonic acid)/PG3R2/Ca/Al was found to exhibit a maximum brightness of 820 cd m^–2 at 11 V with Commission Internationale de L'Eclairage (CIE) coordinates of (0.33,0.35), which are close to the standard CIE coordinates for white‐light emission (0.33,0.33).     

Pioneering e-supply chain integration in semiconductor industry: a case study

Taiwan Semiconductor Manufacturing Company (TSMC) is the largest semiconductor foundry in the world. Advanced Semiconductor Engineering Inc. (ASE) is the world’s leader in semiconductor assembly and testing. From 1998 to 2004, the two companies completed electronic integration of 11 key business processes through the Internet. The result is a seamless interface between TSMC, ASE and their joint customers. They can now obtain accurate, timely information on their product status and respond appropriately when needed. While the direct economic benefits are estimated to be around US$ 10 million through productivity increase over a total investment of about US$ 2 million, the indirect benefits of this initiative could be on the order of US $100 million if the joint customers’ benefits are considered. In collaboration with the RosettaNet organization, TSMC and ASE leveraged their pioneering experiences to define three data exchange standards which can then be widely adopted in the semiconductor industry. This case study is a demonstration of how two leading companies in their respective fields can join forces to make a difference in creating value for the entire semiconductor industry, which in turn benefits society at large. With the momentum continuing to build and the sphere of influence continuing to expand, it is anticipated that TSMC, ASE and the entire sector will upgrade their competitiveness in terms of cost, quality, responsiveness and customer orientation.