基于p-GaN结构的GaN HEMT功率电子器件和数字电路单片集成技术

基于含p-GaN帽层的Si基GaN材料,实现了增强型GaN功率电子器件与数字电路单片集成技术的开发。在同一片晶圆上实现了增强型高压GaN器件、DCFL结构反相器和17级环形振荡器。高压GaN功率电子器件阈值电压VTH达到1.2 V,击穿电压V_(BD)达到700 V,输出电流I_D达到8 A,导通电阻R_(ON)为300 mΩ。基于E/D集成技术的DCFL结构反相器低噪声和高噪声容限分别为0.63 V和0.95 V;所研制17级环形振荡器在输入6 V条件下振荡频率345 MHz,级延时为85 ps。     

金刚石 MISFET 器件的研究

Based on the hydrogen-terminated surface channel diamond material,a 1μm gate length diamond metal-insulator-semiconductor field-effect transistor（MISFET） was fabricated.The gate dielectric Al₂O₃ was formed by naturally oxidated thin Al metal layer,and a less than 2 pA gate leakage current was obtained at gate bias between -4 V and 4 V.The DC characteristic of the diamond MISFET showed a drain-current density of 80 mA/mm at drain voltage of -5 V,and a maximum transconductance of 22 mS/mm at gate-source voltage of -3 V.With the small signal measurement,a current gain cutoff frequency of 2.1 GHz was also obtained.     

自对准栅金刚石MESFET器件研究

基于表面氢化处理的金刚石材料,利用自对准栅工艺技术研制了p型金刚石肖特基栅场效应晶体管(MESFET)。利用AFM和Raman测试方法对材料的特性进行了测试及分析。同时,对研制的金刚石MESFET器件进行了TLM以及直流特性测试及性能分析。利用TLM方法测试获得的表面氢化处理金刚石材料的方阻和Au欧姆接触比接触电阻率分别为4kΩ/□和5.24×10-4Ω.cm2。研制的1μm栅长金刚石MESFET器件的最大电流在-5V偏压下达到10mA/mm以上。     

High-performance enhancement-mode AlGaN/GaN MOS-HEMTs with fluorinated stack gate dielectrics and thin barrier layer

We present high-performance enhancement-mode AlGaN/GaN metal-oxide-semiconductor high-electron mobility transistors (MOS-HEMTs) by a fluorinated gate dielectric technique. A nanolaminate of an Al₂O₃/La_xAl_1-xO₃/Al₂O₃ stack (x≈0.33) grown by atomic layer deposition is employed to avoid fluorine ions implantation into the scaled barrier layer. Fabricated enhancement-mode MOS-HEMTs exhibit an excellent performance as compared to those with the conventional dielectric-last technique, delivering a large maximum drain current of 916 mA/mm and simultaneously a high peak transconductance of 342 mS/mm. The balanced DC characteristics indicate that advanced gate stack dielectrics combined with buffered fluorine ions implantation have a great potential for high speed GaN E/D-mode integrated circuit applications.     

0.15μm栅长Ka波段GaN功率HEMT器件

<正>宽带隙GaN基材料具有临界击穿场强高、峰值电子漂移速度高以及抗腐蚀、耐高温等优异的物理、化学性质,是研制高性能的固态毫米波器件的优选材料。AlGaN/GaN HEMT器件由于高浓度的二维电子气以及高的电子迁移率特性