时效对7050铝合金预拉伸板抗腐蚀性能的影响

采用硬度、腐蚀速率、剥落腐蚀、慢应变速率拉伸测试及透射电镜和差示扫描量热法研究预拉伸后时效制度对7050铝合金板材显微组织、硬度和抗腐蚀性能的影响。结果表明:峰时效合金硬度最大,抗腐蚀性能最差;过时效和回归再时效与峰时效相比,合金的硬度值减小,抗腐蚀性能变好;在高温+峰时效中的高温时效阶段,GP区发生回溶,有利于η′和η相的直接形核析出,晶内析出相长大、不均匀分布,合金硬度减小;晶界析出相粗化、断续分布,合金抗腐蚀性能提高。     

微量Sc对7085铝合金淬火敏感性的影响

采用末端淬火实验、光学显微镜、差热分析、能谱仪和透射电镜研究微量Sc对7085铝合金淬火敏感性的影响。结果表明:在7085铝合金中添加Sc会提高该合金的淬火敏感性。添加Sc后,会在基体中形成弥散分布的Al3(Sc,Zr)粒子,该粒子能够稳定亚晶,强烈抑制再结晶,增加晶界数量;在淬火过程中,随着冷却速度的降低,粗大的平衡η相以Al3(Sc,Zr)粒子为异质形核核心析出,同时也在亚晶界上大量析出长大;η相的析出,降低了基体固溶体的过饱和度,提高了合金的淬火敏感性。     

7085铝合金剥落腐蚀的淬火敏感性

采用末端淬火实验、剥落腐蚀实验结合扫描和透射电镜分析,研究了7085铝合金剥落腐蚀的淬火敏感性。结果表明:7085铝合金的耐剥落腐蚀性能随淬火速率的降低而下降,腐蚀等级由EA级变为EB级,最大腐蚀深度从135μm增加至315μm,腐蚀深度与淬火速率的对数呈线性关系。淬火速率降低导致晶界析出相尺寸增加、无沉淀析出带宽化和在亚晶处也有η相析出,是造成剥落腐蚀淬火敏感性的主要原因。     

Mn含量对6061铝合金组织与力学性能的影响

研究了Mn含量对含0.15%Fe的6061铝合金的均匀化组织、再结晶分数、时效析出相和力学性能的影响。结果表明:未添加Mn的合金均匀化后组织以β-Al9Fe2Si2相为主,Mn含量大于0.1%的合金均匀化后的组织以α-Al8(FeMnCr)2Si相为主;同时一种块状的Al9(MnFe)3Si结晶相随着Mn含量的增加开始出现,并随之增多;时效处理时,Mn优先与Mg,Si元素结合形成的AlMnSi和AlFeMnSi相,减少了主要时效析出相,使强化效果减弱;Mn的添加量为0.2%时σb=390 MPa,σ0.2=330 MPa,δ=22.2%,比AA6061铝合金的标准力学性能分别提高90 MPa,55 MPa,延伸率提高10%。     

航空铝合金及其材料加工

为了满足飞机不同部位对结构材料服役性能的苛刻要求,面对被复合材料等其他结构材料替代的激烈竞争局面,铝合金材料不断发展新的合金及其材料的加工技术,设法提高其综合性能及其均匀性,发展大规格材料及材料/构件一体化加工原理与技术.简介了飞机的发展对铝合金高综合性能及大规格材料的要求,阐述了航空铝合金材料由单一高静强度向高强高韧耐蚀抗疲劳高综合性能以及向大型规格发展的状况,概述了适应飞机发展的高性能铝合金材料的成分、组织与性能关系的相应调控原理与技术,并对高强铝合金厚板加工的一些创新技术关键进行了简要介绍、分析与讨论.     

钻屑瓦斯解吸指标K_1值测定误差的影响因素

分析了工作面突出危险预测中影响钻屑瓦斯解吸指标K1值测定误差的常见因素,并在此基础上提出了一些测定中应该注意的事项和减少误差的措施。     

Reliability test and failure analysis of high power LED packages

A new type application specific light emitting diode (LED) package (ASLP) with freeform polycarbonate lens for street lighting is developed, whose manufacturing processes are compatible with a typical LED packaging process. The reliability test methods and failure criterions from different vendors are reviewed and compared. It is found that test methods and failure criterions are quite different. The rapid reliability assessment standards are urgently needed for the LED industry. 85 ℃/85 RH with 700 mA is used to test our LED modules with three other vendors for 1000 h, showing no visible degradation in optical performance for our modules, with two other vendors showing significant degradation. Some failure analysis methods such as C-SAM, Nano X-ray CT and optical microscope are used for LED packages. Some failure mechanisms such as delaminations and cracks are detected in the LED packages after the accelerated reliability testing. The finite element simulation method is helpful for the failure analysis and design of the reliability of the LED packaging. One example is used to show one currently used module in industry is vulnerable and may not easily pass the harsh thermal cycle testing.     

Comparison of the copper and gold wire bonding processes for LED packaging

Wire bonding is one of the main processes of the LED packaging which provides electrical interconnection between the LED chip and lead frame.The gold wire bonding process has been widely used in LED packaging industry currently.However,due to the high cost of gold wire,copper wire bonding is a good substitute for the gold wire bonding which can lead to significant cost saving.In this paper,the copper and gold wire bonding processes on the high power LED chip are compared and analyzed with finite element simulation.This modeling work may provide guidelines for the parameter optimization of copper wire bonding process on the high power LED packaging.     

城区特大型障碍物变观三维观测系统设计及应用——以德阳三维为例

在过德阳城区的地震勘探施工中,采用多种技术相结合的变观设计方法,在城区加密接收线和使用固定排列,城区周边根据“束内调整”和“束间调整”相结合的原则进行炮点布设,并对观测系统进行反复调整和属性分析,设计出适用的变观方案,弥补炮点不足造成的小炮检距缺失。同时采用新设备,压制城区内的部分环境噪声,取得较好的地震采集效果。     

轧制变形速率对7050铝合金板材淬火敏感性的影响

通过光学显微镜、扫描电镜、透射电镜、电子背散射衍射以及硬度测试研究轧制变形速率对7050铝合金微观组织演变的影响,分析轧制变形速率影响合金淬火敏感性的微观机理。结果表明:变形速率较小时(5 s?1和8 s?1),合金再结晶分数低,试样中存在大量的亚组织结构,亚晶粒的尺寸较小,晶界较难分辨,为小角度晶界,固溶慢速淬火的试样中少量η平衡相在亚晶界上形核析出;随着变形速率的增加,亚晶长大,晶界平直逐渐向大角度晶界转变,η平衡相在晶界上析出增加,在亚晶内部亦有明显析出;当变形速率升高至15 s?1时,固溶后试样的再结晶百分数明显增加,在大角度晶界处以及再结晶晶粒内出现大量非均匀形核析出,同时,在亚晶区域观察到较多析出,与微观组织演变对应,合金时效态硬度性能测试结果表明:随着轧制变形速率增加,慢速淬火的试样力学性能损失变大,合金淬火敏感性增加。