聚合物改性水玻璃均相杂化液对速生杨木的改性

将丙烯酰胺单体在钠水玻璃溶液中聚合制成水玻璃-聚丙烯酰胺均相杂化液,通过浸渍法使杂化液与速生杨木材复合,制成无机/有机木材复合材。SEM、FT-IR表征了速生杨木与杂化前驱液复合前后的结构和形貌变化,研究了复合木材的热稳定性及力学性能的变化,结果表明,用该均相杂化液改性的复合木材WPG为31.6%时,其氧指数为50.3%;并且与素材的力学性能相比,复合木材的抗弯曲强度较素材提高了11.2%,弹性模量提高了18.2%,其径面、弦面和端面的硬度分别提高了15.6%、17.3%和26.2%。     

存储器硬X射线损伤效应实验

文章给出了大规模集成电路浮栅ROM,SRAM器件在钴源和北京同步辐射装置BSRF(Beijing Synchrotron Radiation Facility)3W1白光束线辐照的实验结果;比较了其两种辐照源的实验结果及其损伤异同性.通过实验在线测得位错误数随总剂量的变,给出基相同累积剂量时X射线辐照和γ射线辐照的总剂量效应损伤等关系.获得了浮栅ROM器件X射线剂量增强因子,给出不同集成度SRAM器件的X射线辐射加固技术研究有重要价值.     

定积分的物理应用举例

一般情况下许多物理量都需用定积分来计算.本文列举了常见的一些并举例进行了计算.     

静态单粒子翻转截面的获取及分类

 为了评估静态随机访问存储器(SRAM)型现场可编程门阵列(FPGA)器件的单粒子效应,寻求单粒子翻转敏感部位,以XCV300PQ240为实验样品,利用重离子辐照装置详细测试了该器件的静态翻转截面,并根据配置存储单元用途的不同,对翻转数据进行了分类。结果表明：SRAM型FPGA的内部存储单元对单粒子翻转效应十分敏感;配置存储器翻转主要由查找表(LUT)及互连线资控制位造成,这两者的翻转占总翻转数的97.46%;配置存储器中各类资源的单粒子翻转(SEU)敏感性并不一致,输入输出端口(IOB)控制位和LUT的单粒子翻转的敏感性远高于其它几类资源,但LUT在配置存储器中占有很大比例,在加固时应予以重点考虑。     

Lattice damage in InGaN induced by swift heavy ion irradiation

The microstructural responses of In_0.32Ga_0.68N and In_0.9Ga_0.1N films to 2.25 GeV Xe ion irradiation have been investigated using x-ray diffraction, Raman scattering, ion channeling and transmission electron microscopy. It was found that the In-rich In_0.9Ga_0.1N is more susceptible to irradiation than the Ga-rich In_0.32Ga_0.68N. Xe ion irradiation with a fluence of 7× 10¹¹ ions·cm^-2 leads to little damage in In_0.32Ga_0.68N but an obvious lattice expansion in In_0.9Ga_0.1N. The level of lattice disorder in In_0.9Ga_0.1N increases after irradiation, due to the huge electronic energy deposition of the incident Xe ions. However, no Xe ion tracks were observed to be formed, which is attributed to the very high velocity of 2.25 GeV Xe ions. Point defects and/or small defect clusters are probably the dominant defect type in Xe-irradiated In_0.9Ga_0.1N.     

累积剂量影响静态随机存储器单粒子效应敏感性研究

本文利用60Coγ源和兰州重离子加速器,开展不同累积剂量下,静态随机存储器(static random access memory,SRAM)单粒子效应敏感性研究,获取不同累积剂量下SRAM器件单粒子效应敏感性的变化趋势,分析其辐照损伤机理.研究表明,随着累积剂量的增加,SRAM器件漏电流增大,影响存储单元低电平保持电压、高电平下降时间等参数,导致"反印记效应".研究结果为空间辐射环境中宇航器件的可靠性分析提供技术支持.     

Analysis of multiple cell upset sensitivity in bulk CMOS SRAM after neutron irradiation

In our previous studies, we have proved that neutron irradiation can decrease the single event latch-up(SEL) sensitivity of CMOS SRAM. And one of the key contributions to the multiple cell upset(MCU) is the parasitic bipolar amplification,it bring us to study the impact of neutron irradiation on the SRAM's MCU sensitivity. After the neutron experiment, we test the devices' function and electrical parameters. Then, we use the heavy ion fluence to examine the changes on the devices' MCU sensitivity pre-and post-neutron-irradiation. Unfortunately, neutron irradiation makes the MCU phenomenon worse.Finally, we use the electric static discharge(ESD) testing technology to deduce the experimental results and find that the changes on the WPM region take the lead rather than the changes on the parasitic bipolar amplification for the 90 nm process.     

Ionizing radiation effect on single event upset sensitivity of ferroelectric random access memory

The impact of ionizing radiation effect on single event upset(SEU) sensitivity of ferroelectric random access memory(FRAM) is studied in this work. The test specimens were firstly subjected to ~(60)Co γ-ray and then the SEU evaluation was conducted using ~(209)Bi ions. As a result of TID-induced fatigue-like and imprint-like phenomena of the ferroelectric material, the SEU cross sections of the post-irradiated devices shift substantially. Different trends of SEU cross section with elevated dose were also found, depending on whether the same or complementary test pattern was employed during the TID exposure and the SEU measurement.     

An investigation of ionizing radiation damage in different SiGe processes

Different SiGe processes and device designs are the critical influences of ionizing radiation damage. Based on the different ionizing radiation damage in SiGe HBTs fabricated by Huajie and an IBM SiGe process, quantitatively numerical simulation of ionizing radiation damage was carried out to explicate the distribution of radiation-induced charges buildup in KT9041 and IBM SiGe HBTs. The sensitive areas of the EB-spacer and isolation oxide of KT9041 are much larger than those of the IBM SiGe HBT, and the distribution of charge buildup in KT9041 is several orders of magnitude greater than that of the IBM SiGe HBT. The result suggests that the simulations are consistent with the experiment, and indicates that the geometry of the EB-spacer, the area of the Si/SiO_2 interface and the isolation structure could be contributing to the different ionizing radiation damage.     

选择性埋氧层上硅器件的单粒子瞬态响应的温度相关性

本文建立了90 nm工艺下的绝缘体上硅浮体器件和选择性埋氧层上硅器件模型,通过器件电路混合仿真探究了工作温度对上述两种结构的多级反相器链单粒子瞬态脉冲宽度以及器件内部电荷收集过程的影响.研究表明, N型选择性埋氧层上硅器件相较于浮体器件具有更好的抗单粒子能力,但P型选择性埋氧层上硅器件的抗单粒子能力在高线性能量转移值下与浮体器件基本相同.同时电荷收集的温度相关性分析表明,N型选择性埋氧层上硅器件只存在漂移扩散过程,当温度升高时其电荷收集量变化很小,而N型浮体器件存在双极放大过程,电荷收集量随着温度的升高而显著增加;另外, P型选择性埋氧层上硅器件和浮体器件均存在双极放大过程,当温度升高时P型选择性埋氧层上硅器件衬底中的双极放大过程越来越严重,由于局部埋氧层的存在,反而抑制了其源极的双极放大过程,导致它的电荷收集量要明显少于P型浮体器件.因此选择性埋氧层上硅器件比浮体器件更好地抑制了温度对单粒子瞬态脉冲的影响.