Four-scanning attack on hierarchical digital watermarking method for image tamper detection and recovery

In a recent paper presented by Lin et al., a block-based hierarchical watermarking algorithm for digital images is proposed. It adopts parity check and the intensity-relation check to conduct the experiment of image tamper detection. Their experimental results indicate that the precision of tamper detection and localization is 99.6% and 100% after level-2 and level-3 inspections, respectively. The proposed attacks demonstrate that this watermarking algorithm is fundamentally flawed in that the attacker can tamper a watermarked image easily without being detected. In this paper, a four-scanning attack aimed to Lin et al.'s watermarking method is presented to create tampered images. Furthermore, in case they use encryption to protect their 3-tuple-watermark, we proposed a blind attack to tamper watermarked images without being detected. Experimental results are given to support and enhance our conclusions, and demonstrate that our attacks are successful in tampering watermarked images.     

Replication of nanostructures on microstructures by intermediate film mold inserted hot embossing process

The present study proposes a simple method to replicate nano/micro combined multiscale structures using an intermediate film mold and anodic aluminum oxide (AAO) nanomold in hot embossing process. The proposed method is simply to add an intermediate film mold with microscale thru-hole patterns to the ordinary mold system, on which nanostructures are patterned, in the hot embossing process. The intermediate film mold is inserted between polymer substrate and AAO nanomold. During the hot embossing process, the polymer first fills microscale thru-hole patterns in the intermediate film mold and subsequently fills nanopores in AAO nanomold, resulting in the nano/micro combined structures. The intermediate film molds, which have microscale thru-hole patterns were fabricated by micro-milling, laser ablation, etching methods and/or LIGA process. The nano/micro combined structures were successfully replicated by the proposed method.     

Collapse-free thermal bonding technique for large area microchambers in plastic lab-on-a-chip applications

Bonding is an essential step to form microchannels or microchambers in lab-on-a-chip applications. In this paper, we present a novel plastic thermal bonding technique to seal and form large area microchambers (planar characteristic width and length on the order of 1 mm and characteristic thickness on the order of 10–100 μm) without collapse by introducing a holed pressure equalizing plate (HPEP) that includes holes of the same size and shape as the microchambers. To demonstrate the proposed technique, two types of large area microchambers [(1) 20 × 10 mm and 40 μm thick and (2) 12 × 2.5 mm and 120 μm thick] with microchannels were designed and replicated on plastic substrates by means of hot embossing and injection molding processes with prepared two nickel mold inserts. The replicated large area microchambers as well as the microchannels in the plastic lab-on-a-chip were successfully sealed (i.e., no leakage) and formed without any collapse by the proposed thermal bonding technique with the help of the HPEP.     

A neural network-based approach for dynamic quality prediction in a plastic injection molding process

This paper presents an innovative neural network-based quality prediction system for a plastic injection molding process. A self-organizing map plus a back-propagation neural network (SOM-BPNN) model is proposed for creating a dynamic quality predictor. Three SOM-based dynamic extraction parameters with six manufacturing process parameters and one level of product quality were dedicated to training and testing the proposed system. In addition, Taguchi’s parameter design method was also applied to enhance the neural network performance. For comparison, an additional back-propagation neural network (BPNN) model was constructed for which six process parameters were used for training and testing. The training and testing data for the two models respectively consisted of 120 and 40 samples. Experimental results showed that such a SOM-BPNN-based model can accurately predict the product quality (weight) and can likely be used for various practical applications.     

基于SOPC的通用图像处理系统设计

本文介绍了基于SOPC的通用嵌入式图像处理系统的实现方法.其中叙述了SOPC及Nios Ⅱ嵌入式处理器的特点和使用,分别具体说明了系统的硬件结构设计和图像处理算法的流程及软件实现,采用此系统可以大大简化图像处理系统的硬件和软件设计,优化系统设计.     

UHF RFID读写器零中频解调方式的研究与实现

在对UHF RFID读写器工作原理进行分析的基础上,介绍一种工作在UHF频段下的读写器的射频接口电路,并确定读写器的解调方式,重点对正交零中频解调方式进行研究,并给出读写器的实现方案.     

协同办公自动化系统的设计与研究

本文从介绍办公自动化的概念入手,通过对OA应用现实困境的分析,就协同办公自动化系统的需求分析、设计思想和总体设计(包括信息集成平台和OA应用平台)、技术平台进行阐述、分析和比较,并对未来OA的发展趋势作以预测。     

Two-dimensional optical wavelet transform in space domain and its performance analysis

A new architecture of an optical wavelet transform system with a lenslet array is proposed, and its optical performance and optical limits are analyzed.     

预歧化处理的高性能锂离子电池SiO/C负极材料

以SiO和蔗糖为原料,SiO经高温歧化反应处理后,通过机械球磨、喷雾干燥、高温热解工艺制备出具有优异电化学性能的锂离子电池SiO/C负极材料。经XRD、FTIR、XPS、SEM、TEM结构分析表明,歧化反应处理的片状SiO包含非晶态SiO和纳米晶相Si、SiO_2,蔗糖热解形成的无定形碳包覆在细片状SiO的表面,组成球形SiO/C颗粒。电化学测试结果表明,预歧化处理的SiO/C复合材料的首次放电容量为1 314.6mAh/g,首次库伦效率达到71%;100周循环后的放电容量为851.2mAh/g,容量保持率达到78.5%,循环稳定性远高于未经歧化处理的SiO/C复合材料。电化学性能的提高归因于SiO预歧化反应及热解碳包覆。