Thermoplastische Hybridlaminate mit variabler Metallkomponente

Hybrid laminates combine the positive properties of the metal and fibre reinforced plastic (FRP) components. Advantages of the FRP, like formability, recyclability as well as suitability for mass production, provide an outstanding advantage over thermosetting matrices. For the production of the hybrid laminates, at first continuous fibers and thermoplastic films are pre‐consolidated to fibre‐reinforced unidirectional tapes. Subsequently, these are pressed together with the metal component in a loadcapable optimized arrangement. Thereby the interface between the FRP and the metal foils is of crucial importance. This paper focuses on hybrid laminates with carbon‐fiber reinforced polyamide (CF‐PA6) functioning as core layers and glass‐fiber reinforced polyamide (GF‐PA6) as intermediate layers between the centre and metal component. Laminates in 2/1 and 3/2 structure with two respectively three metal layers and one respectively two FRP layers are examined. For the metal foil, the aluminium alloy EN AW‐6082 and the titanium alloy Ti3Al2.5V (Grade 9) are used. The production of these laminates, development and adjustment of the interface and the evaluation of mechanical properties are investigated in this article.     

Three‐Dimensional Nanofabrication by Block Copolymer Self‐Assembly

Thin films of block copolymers are widely seen as enablers for nanoscale fabrication of semiconductor devices, membranes, and other structures, taking advantage of microphase separation to produce well‐organized nanostructures with periods of a few nm and above. However, the inherently three‐dimensional structure of block copolymer microdomains could enable them to make 3D devices and structures directly, which could lead to efficient fabrication of complex heterogeneous structures. This article reviews recent progress in developing 3D nanofabrication processes based on block copolymers.     

Effect of Pd thickness on wettability and interfacial reaction of Sn-1.0Ag-Ce solders on ENEPIG surface finish

The wetting balance test was used to study the wettability of Sn-1.0Ag-Ce (Ce content = 0, 0.1, 0.3, and 0.5 wt%) solder alloys on electroless nickel/electroless palladium/immersion gold (ENEPIG) surface finishes with Pd thicknesses of 0, 0.05, 0.1, and 0.15 μm. Scanning electron microscopy was used to evaluate the interfacial reaction between the molten solders and surface finish materials during the wetting test. The Ni₃Sn₄ intermetallic compound (IMC) plays an important role in promoting wetting properties. The Pd layer retards formation of the Ni₃Sn₄ IMC and changes its morphology, thereby affecting the wettability of the surface finish/solder systems. ENEPIG surface finishes seem to be suitable for use with cerium-containing solders.