Mixed coordination mechanisms for scheduling games on hierarchical machines

In this paper, we study scheduling games under mixed coordination mechanisms on hierarchical machines. The two scheduling policies involved are ‐ and ‐, where ‐ (resp., ‐) policy sequences jobs in nondecreasing order of their hierarchies, and jobs of the same hierarchy in nonincreasing (resp., nondecreasing) order of their processing times. We first show the existence of a Nash equilibrium. Then we present the price of anarchy and the price of stability for the games with social costs of minimizing the makespan and maximizing the minimum machine load. All the bounds given in this paper are tight.     

Corrosion morphology of AZ91D exposed in an atmospheric environment

The focused ion beam technique was employed to investigate the atmospheric corrosion morphology of AZ91D. It was found that the α matrix of the alloy was preferentially corroded in the areas adjacent to intermetallic phases. The most interesting finding was that the corrosion products in corrosion cavities were pelletlike, which has never been reported before.     

变频器调速装置节能浅析

1概述 近十多年来,随着电力电子技术、微电子技术及现代控制理论的发展,变频调速技术已经广泛地用于交流电动机的速度控制,其最主要的特点是具有高效率的驱动性能及良好的控制特性.它是一种高新技术电力节能装置,它通过改变（降低）电源工作频率,来降低动力设备（电机）的转速,减少设备的输出功率,达到输出功率与工作负荷的最佳匹配,实现节能目的,有效地提高了经济效益和产品质量.几乎可以说,有电动机的地方就有变频器,在一切需要进行速度控制的场合,变频器以其操作方便、体积小、控制性能高而获得广泛应用.     

Synthesis of amphiphilic magnetic microspheres by dispersion copolymerization of styrene and poly(ethylene oxide) macromonomer

Amphiphilic magnetic microspheres ranging in diameter from 5 to 100 µm were prepared by dispersion copolymerization of styrene and poly(ethylene oxide) vinylbenzyl (PEO‐VB) macromonomer (MPEO) in the presence of Fe₃O₄ magnetic fluid. The effects of various polymerization parameters on the average particle size were systematically investigated. The average particle size was found to increase with increasing styrene concentration and initiator concentration. It also increased with decreasing stabilizer concentration and molecular weight of MPEO. The content of the hydroxyl groups localized in the microspheres ranged from 0.01 to 0.2 mmol g^?1. © 2003 Society of Chemical Industry     

产出水处理设备的腐蚀和机械磨损

提供了能够延长与产出水举升、加工、处置和注入有关的油气生产设备使用寿命的成功经验和技术,并按照产出水的处理程序进行介绍,即从油藏中的液体进入井筒到举升到地面(井筒管理),地面生产/加工设备和处理/注入设备的整个处理过程.由于井筒是最主要的设备,多数作业成本都与将液体举升到地面有直接关系,因此要重点强调井筒的管理.通过减少井的事故(抽油杆、油管和泵)可以大大降低操作成本,延长边缘井的生产时间.地面处理成本包括如何使泄漏、漏出物清洗及原油携带量降到最低的费用.上述经验来源于2002年8月对Permian盆地上成功优化水处理成本的作业商进行的采访;已发表的油气技术文献;本文作者在油气作业领域的个人经验(31年以上).     

P(DBF-VA)型柴油低温流动性改进剂的研制

针对新疆地产柴油蜡含量较高的特点,以游离基聚合法合成了富马酸双链混合酯和醋酸乙烯酯共聚物型[P(DBF-VA)]柴油低温流动改进剂,利用正交实验研究了单体配比,引发剂用量,溶剂用量,聚合温度对聚合物降冷滤效果的影响。共聚物用IR进行表征,利用XRD初步探讨了该降凝剂的降凝机理。结果表明:该剂能使吐哈—10~#、0~#柴油冷滤点降低10℃和7℃;使独山子0~#柴油冷滤点下降12℃;使石化0~#柴油冷滤点下降8℃;使克拉玛依0~#柴油的冷滤点下降8℃。     

炼油厂全流程优化建模方法研究

为了克服使用线性规划和单处理单元非线性规划进行生产优化的内在缺点，在建立原油单元、催化裂化、催化重整和汽油调合等4个重要处理单元详细模型的基础上，将单处理单元非线性过程模型集成到一个全流程优化非线性模型中。优化的目标函数是使炼油厂全厂利润最大。决策变量是那些显著影响全厂效益的变量，约束条件是单个处理单元约束条件的集合。对某炼油厂进行实例研究，结果表明该全流程模型能有效处理全厂优化问题，所得利润在线性规划的基础上提高4．5％。     

Exposed Die-Top Encapsulation Molding for an Improved High- Performance Flip Chip BGA Package

The recent advancement in high- performance semiconductor packages has been driven by the need for higher pin count and superior heat dissipation. A one-piece cavity lid flip chip ball grid array (BGA) package with high pin count and targeted reliability has emerged as a popular choice. The flip chip technology can accommodate an I/O count of more than five hundreds500, and the die junction temperature can be reduced to a minimum level by a metal heat spreader attachment. None the less, greater expectations on these high-performance packages arose such as better substrate real estate utilization for multiple chips, ease in handling for thinner core substrates, and improved board- level solder joint reliability. A new design of the flip chip BGA package has been looked into for meeting such requirements. By encapsulating the flip chip with molding compound leaving the die top exposed, a planar top surface can be formed. A, and a flat lid can then be mounted on the planar mold/die top surface. In this manner the direct interaction of the metal lid with the substrate can be removed. The new package is thus less rigid under thermal loading and solder joint reliability enhancement is expected. This paper discusses the process development of the new package and its advantages for improved solder joint fatigue life, and being a multichip package and thin core substrate options. Finite-element simulations have been employed for the study of its structural integrity, thermal, and electrical performances. Detailed package and board-level reliability test results will also be reported