Medium access protocol design for delay-guaranteed multicode CDMA multimedia networks

To enable multimedia real-time applications over next-generation wireless code-division multiple access (CDMA) packet-switching networks, previous efforts show a proper scheduling policy is the key to provide delay-guaranteed access services to various traffic types with different bit error rate (BER) requirements. Considering the support of the prevailing Internet protocol (IP) with variable-length packets in future mobile networks, we develop a mathematically delay-optimal medium access control (MAC) protocol over multicode CDMA (MC-CDMA) environments under the continuous-time assumption. From our investigations, we suggest that a good MAC protocol should be designed by using a proper single-server scheduling policy to guarantee packet-delay, and controlling the maximal number of simultaneous spreading-code transmissions to maintain the required BER. We further evaluate the performance of some MC-CDMA MAC protocols supporting QoS on BER and packet-delay, and show that MAC schemes conforming to our design rules give better performance on packet-delay when maintaining acceptable BER of various traffic types.     

Catalytic dehydrogenation of ethylbenzene with carbon dioxide: promotional effect of antimony in supported vanadium–antimony oxide catalyst

Alumina-supported vanadium oxide, VO_x/Al₂O₃, and binary vanadium–antimony oxides, VSbO_x/Al₂O₃, have been tested in the ethylbenzene dehydrogenation with carbon dioxide and characterized by S_BET, X-ray diffraction, X-ray photoelectron spectroscopy, hydrogen temperature-programmed reduction and CO₂ pulse methods. VSbO_x/Al₂O₃ exhibited enhanced catalytic activity and especially on-stream stability compared to VO_x/Al₂O₃ catalyst. Incorporation of antimony into VO_x/Al₂O₃ increased dispersion of active VO_x species, enhanced redox properties of the systems and formed a new mixed vanadium–antimony oxide phase in the most catalytically efficient V_0.43Sb_0.57O_x/Al₂O₃ system.     

Obtaining shorter regular expressions from finite-state automata

We consider the use of state elimination to construct shorter regular expressions from finite-state automata (FAs). Although state elimination is an intuitive method for computing regular expressions from FAs, the resulting regular expressions are often very long and complicated. We examine the minimization of FAs to obtain shorter expressions first. Then, we introduce vertical chopping based on bridge states and horizontal chopping based on the structural properties of given FAs. We prove that we should not eliminate bridge states until we eliminate all non-bridge states to obtain shorter regular expressions. In addition, we suggest heuristics for state elimination that leads to shorter regular expressions based on vertical chopping and horizontal chopping.     

Numerical modelling for scattering of waves in three-dimensional cracked material

In this paper, a mathematical model is proposed for the problem of the scattering of plane waves in a three-dimensional cracked materials. Instead of obtaining closed-form solutions as in conventional theoretical analysis methods, this approach, called the Equivalent Nodal Force (ENF) method formulates the mechanical effects of cracks as an equivalent nodal force in a numerical procedure, and physically translates cracked material into an equivalent continuous one. Several mechanical relations between waves and cracks are evident from this method. Also the results of several numerical calculations are presented and these are compared with those obtained by the conventional methods.     

An electrooptic intensity modulator with improved linearity

A highly linear electrooptic modulator has been designed, fabricated, and evaluated. The design of this modulator consists of only a simple modification to the directional coupler. Two-tone testing has demonstrated that, for an optical modulation depth of 30% per channel, the third-order intermodulation distortion is more than 30 dB lower than that of the conventional directional coupler or Mach-Zehnder modulators. This improvement was not observed to be accompanied by any increase in second harmonic distortion. Also included are results of two-tone computer simulations which predict the improvement in linearity of this device for a range of modulation depths.<>     

Two schemes for detecting CMOS analog faults

A design-for-testability scheme for detecting CMOS analog faults was reported by Favalli et al. (see ibid., vol.25, no.5, p.1239-46, 1990). The authors propose two alternative designs, one for small circuits and another for large circuits, which require significantly less area overhead (about 1/4 to 1/3) than that of Favalli's design. With the proposed modification in the first design, the untestable problem, which occurred in Favalli's design, can be alleviated. Furthermore, the proposed schemes are also fit to be implemented in VLSI circuits     

部分种子成分的特征X射线在等效生物材料中衰减的测定

用Ｓｉ（Ｌｉ）探测器实现了Ｎａ、Ｍｇ、Ｓ、Ｃｌ的特征Ｘ射线在有机膜中的相对衰减以及与Ｏ、Ｋ元素的特征Ｘ射线能量相当的Ｘ射线或轫致辐射在有机膜中的相对衰减，分别得出了它们减的数学描述，并把实验得到不同能量的Ｘ射线在有机膜中的质量吸收系数与Ｂｅｒｋｅｌｅｙ的ＯＣＧ软件计算出的结果相比，相关都小于３０％。     

Microstrip reflectarray antenna with offset feed

The authors derive and verify the concept of antenna focusing by a planar 'microstrip reflectarray' antenna. Experimental results from schematically distributed patch radiators with microstrip delay lines are consistent with the simulation results. The advantages and disadvantages of such an antenna are described. The measured overall antenna efficiency is approximately 48% at scan angles up to 30 degrees . These results demonstrate the feasibility of such an antenna.<>     

A hybrid wafer-dicing process for GaAs MMIC production

A dicing process for GaAs MMIC (monolithic microwave integrated circuit) wafers using spin-on wax for wafer mounting and a hybrid process of wet chemical etching/mechanical sawing for chip dicing is described. This process minimizes ragged chip edges and reduces generation of microcracks in addition to the elimination of the plated gold burrs on the backside of the diced MMIC chips. This process gives a uniformity of -3 μm across a 2-in wafer following the completion of the whole backside process. This GaAs chip dicing technique is amenable to production because it exhibits both a very high chip yield (>90%) and nearly flawless edges