热分析在PVA纤维预处理中的应用

用差热、热重法对原丝的热性能及由不同预处理方法所引起的PVA纤维的热行为变化进行了研究;并通过模拟脱水条件,用不同升温速率,求出了经不同预处理纤维的脱水反应活化能。结果表明,PVA原丝在230℃有一软化点,三种预处理都不同程度地影响了原丝的热效应变化;纤维在180～340℃主要为脱水反应;原丝及经脱水剂、O_3和O_3综合脱水剂处理的纤维,其脱水反应的表观活化能分别为:164.3kJ/mol,92.9kJ/mol,130.5kJ/mol和117.6kJ/mol。     

Critical building separation distance in reducing pounding risk under earthquake excitation

A separation distance between adjacent buildings is provided to reduce the risk of pounding of adjacent buildings under seismic excitations. It should be recognized that the evaluation of the critical separation distance is a one-sided barrier crossing problem while the problem of structural design under seismic excitations is a two-sided crossing problem. A procedure for assessing the required separation distance with or without considering possible uncertainty in structural properties was presented based on the reliability methods and random vibration theory. The procedure was used to carry out parametric analyses. It is shown that use of the complete quadratic combination (CQC) rule with the modal responses employed for designing structures may over- or underestimate the critical separation distance, depending on the damping ratios and the closeness of the natural vibration periods of adjacent buildings. This is due to not only one-sided versus two-sided crossing problem but also the approximation in the CQC rule. Further, the effect of the uncertainty in structural properties on the estimated separation is investigated. The results indicate that this uncertainty tends to increase the required critical separation distance.     

基于虚拟仪器技术的多线程数据采集系统

本文论述了如何利用虚拟仪器技术以及多线程技术来进行数据采集，并介绍了在工业中的实际应用。     

非接触型光外差轮廓仪

本文介绍一种纳米级非接触型高精度光外差轮廓仪,它是基于普通光路的光外差干涉仪。工件表面被两束有微小频差的激光束所照射,其中一束经聚焦后用作测量光探针来扫描工件表面,另一束则用作参考光束。两束光经表面反射后产生干涉。测量信号和参考信号的相位差与表面的微不平值成正比。仪器的横向分辨率为2μm,高度分辨率为1 nm,它不需要对试样作大范围的调整,且可用试样自身作参考面。信号经光电转换后由微型计算机进行处理,它能快速完成测量、计算、显示及打印出各种参数和曲线。     

Structural reliability optimization using an efficient safety index calculation procedure

The objective of this paper is to conduct reliability-based structural optimization in a multidisciplinary environment. An efficient reliability analysis is developed by expanding the limit functions in terms of intermediate design variables. The design constraints are approximated using multivariate splines in searching for the optimum. The reduction in computational cost realized in safety index calculation and optimization are demonstrated through several structural problems. This paper presents safety index computation, analytical sensitivity analysis of reliability constraints and optimization using truss, frame and plate examples.     

On the optimum design of unitary cyclic group space-time codes

In this letter, based on the exact pairwise-error probability, we derive the union bound on the symbol-error probability (SEP) of the differential unitary space-time (DUST) modulation employing group codes. Instead of using the rank-and-determinant or Euclidean distance criteria, we optimize the cyclic group codes such that the union bound on the SEP is minimized for a predetermined scenario, taking into account the number of transmit and receive antennas and the operating signal-to-noise ratio (SNR). Our simulation results show that for a wide range of SNRs, the codes with the minimum union bound for a particular SNR outperform the codes designed based on rank-and-determinant or Euclidean distance criteria.     

Self-aligning planarization and passivation for integration applications in III-V semiconductor devices

This work reports an easy planarization and passivation approach for the integration of III-V semiconductor devices. Vertically etched III-V semiconductor devices typically require sidewall passivation to suppress leakage currents and planarization of the passivation material for metal interconnection and device integration. It is, however, challenging to planarize all devices at once. This technique offers wafer-scale passivation and planarization that is automatically leveled to the device top in the 1-3-/spl mu/m vicinity surrounding each device. In this method, a dielectric hard mask is used to define the device area. An undercut structure is intentionally created below the hard mask, which is retained during the subsequent polymer spinning and anisotropic polymer etch back. The spin-on polymer that fills in the undercut seals the sidewalls for all the devices across the wafer. After the polymer etch back, the dielectric mask is removed leaving the polymer surrounding each device level with its device top to atomic scale flatness. This integration method is robust and is insensitive to spin-on polymer thickness, polymer etch nonuniformity, and device height difference. It prevents the polymer under the hard mask from etch-induced damage and creates a polymer-free device surface for metallization upon removal of the dielectric mask. We applied this integration technique in fabricating an InP-based photonic switch that consists of a mesa photodiode and a quantum-well waveguide modulator using benzocyclobutene (BCB) polymer. We demonstrated functional integrated photonic switches with high process yield of >90%, high breakdown voltage of >25 V, and low ohmic contact resistance of /spl sim/10 /spl Omega/. To the best of our knowledge, such an integration of a surface-normal photodiode and a lumped electroabsorption modulator with the use of BCB is the first to be implemented on a single substrate.     

60Co辐照预处理对苹果片脱水特性和品质的影响

进行了不同辐照剂量、热风温度、切片厚度对苹果脱水速率及品质的影响试验,结果表明该三因子影响苹果片的脱水速率和外观质量.辐照剂量增加,热风温度增高,脱水速率高,VC含量和复水比下降.辐照剂量、热风温度、切片厚度三因素对脱水速率和干制品的外观质量、VC含量、复水比等四指标大都呈显著影响.     

Structure evolution of conductive polymer composites revealed by solvent vapor induced time-dependent percolation

The authors of this paper synthesized a series of amphiphilic triblock copolymers of polystyrene-b-poly(ethylene glycol)-b-polystyrene (PS-PEG-PS) having different PEG/PS ratios with nearly identical molecular weights of the entire copolymers. The interfacial interactions in the composites consisting of carbon black and the copolymers can thus be tailored. When these conducting composites are exposed to certain solvent vapors, their electrical resistances greatly increase, showing the gas sensitivity. The present work indicated that this switching behavior is controlled by the structural relaxation of the composites because matrix swelling acts as the main mechanism. The response time has been correlated with absolute temperature by Arrhenius equation, and the estimated activation energy reflects mobility of the fillers involved in the solvent induced expansion of the surrounding polymer. Therefore, by using the gas sensibility of the conductive composites, the structure evolution of the composite materials in solid state and the effect of filler/matrix interfacial interaction on the relaxation property of the matrix polymer has been inspected. It was found that lower activation energy represents stronger interfacial interaction in case good solvent of the matrix was used for the test.     

单片机系统的动态加密技术

单片机系统产品的加密和解密技术永远是一个矛盾的统一体。然而 ,为了更好的保护好自己的单片机技术成果和知识产权 ,加大解密成本 ,研究新型加密技术仍是保护成果的主要手段之一。文中在讨论了传统的单片机系统加密和解密技术的基础上 ,提出一种实用而有效的动态加密技术的实现方案。