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101.
Metallurgical and Materials Transactions A - The effect of 0.03 and 0.08 at. pct Fe additions on the formation of secondary phases in an Al–1.1Mg–0.5Cu–0.3Si at. pct alloy was...  相似文献   
102.
The reliability of InP-based HEMTs is studied, focussing on how it is affected by the doped layer material and gate recess structure. Bias-and-temperature stress tests reveal that fluorine-induced donor passivation in the recess region, formed adjacent to the gate electrode, causes the source resistance (Rs) to increase at large drain bias voltages. The increase in Rs can be prevented by using InP or InAlP as the carrier supply layer material instead of InAlAs. On the other hand, the increase in the drain resistance (Rd) does not depend on the material of the carrier supply layer, which suggests that a mechanism different from that in the case of Rs should be considered. It is also found that a deep gate recess suppresses the increase in Rd after long-term stressing.  相似文献   
103.
We investigated the irradiation properties of the components of a T0 chopper. The organic materials in the rotor bearing grease, the magnetic fluids in seals, and the rubber in the timing belt, as well as the semiconductor materials in the rotation sensor and motor encoder, were all irradiated with high-energy γ-rays up to 100 kGy. No significant damage that shortens the lifetime of a T0 chopper was observed for the mechanical components. However, the semiconductor components were damaged by the irradiation. For the rotation sensor system detecting the rotor phase, the signal from a marker on the rotor shaft was transmitted outside the shielding by an optical fiber with radiation-proofing and the electrical circuits were removed from the beamline shielding. The lifetime of the motor encoder possibly meets the requirement for the maintenance period of the T0 chopper.  相似文献   
104.
This study gives fundamental knowledge on the particle classification performance by centrifugal separator.It is found that the cut size of a centrifugal separator decreases as the rotational speed increases and the liquid flow rate decreases. Fitting our experimental results with the theory, they agree with each other at high flow rate. However, the difference between them generates at low flow rate. This is because dead spaces are generated in the centrifugal separator at the low flow rate. Also, the computer simulation of the fluid behavior in the centrifugal separator can find the decrease of the velocity near the wall under the low flow rate, which suggests the possibility of the formation of dead spaces in the separator.  相似文献   
105.
Phase relationship of a BaO-ZrO2-YO1.5 system at 1500 and 1600 °C was examined in order to determine whether a phase separation at the composition of 15% yttrium-doped barium zirconate exists. According to a pseudoternary phase diagram of the BaO-ZrO2-YO1.5 system established by this work, the solubility of yttria into cubic barium zirconate at 1600 °C is 0.25 in a mole fraction of yttria (X\textYO1.5 ) (X_{{{\text{YO}}_{1.5} }} ) . Thus, we confirmed that there is no phase separation at the composition of 15% yttrium-doped barium zirconate at 1600 °C. On the other hand, at 1500 °C, there might be a phase separation at the composition of 15% yttrium-doped barium zirconate into yttrium-doped barium zirconate where quite small amount of yttrium is doped and a new phase whose composition is close to reported BZ(II) phase.  相似文献   
106.
The relationship between the activities of endogenous enzymes in milled rice and accumulation of chemical components in the rice grains during cooking was investigated. Maltose and soluble starch were optimally hydrolyzed around 60 °C by both crude extracts and purified α-glucosidases of milled rice. Gelatinization onset temperature of rice flour was determined to be 63 °C with DSC analysis under usual cooking condition. Hydrolytic activities on carbohydrates and proteolytic activities of milled rice were enhanced at pH 5 compared to pH 7 at the range of 4–80 °C. When rice was cooked at pH 5, glucose and amino acids highly accumulated with soaking for 16 h before heating. We propose a new method of cooking with prolonged soaking at acidic pH, which is effective for increasing the amounts of chemical components in cooked rice.  相似文献   
107.
In heterojunction solar cells consisting of hydrogenated amorphous silicon (a-Si:H) and crystalline silicon (c-Si), suppression of epitaxial growth at the heterointerface is found to be crucial to achieve high solar cell efficiencies. In order to avoid the epitaxial growth, wide-gap hydrogenated amorphous silicon oxide (a-SiO:H) has been applied to the heterojunction solar cells. We have fabricated a-SiO:H/c-Si solar cells using n-type and p-type c-Si substrates and demonstrated that incorporation of the a-SiO:H i layer prevents the harmful epitaxial growth at the heterointerface completely.  相似文献   
108.
Asymmetric four-point bending tests of agathis specimens with a short crack along the neutral axis in a tangential–longitudinal system were conducted onto analyse the failure behaviour of wood with a short crack. The nominal shear strength and Mode II critical stress intensity factors of the specimens with various crack lengths were measured, and the influence of crack length on these properties was examined. The nominal shear strength of the cracked specimens was significantly lower than the strength of a crack-free specimen, even when the crack was extremely short. This finding suggests that the fracture mechanics theory is effective for analysing the failure behaviour of wood with a very short crack in this loading condition. However, the Mode II critical stress intensity factor still depends on the crack length. When the crack length was corrected with considering the formation of fracture process zone ahead of the crack tip, the critical intensity factor could be predicted effectively as well as the nominal shear strength.  相似文献   
109.
As electronic devices become more highly integrated, the demand for small, high pin count packages has been increasing. We have developed two new types of IC packages in response to this demand. One is an ultra thin small outline package (TSOP) which has been reduced in size from the standard SOP and the other, which uses Tape Automated Bonding (TAB) technology, is a super thin, high pin count TAB in cap (T.I.C.) package. In this paper, we present these packages and their features along with the technologies used to improve package reliability and TAB. Thin packages are vulnerable to high humidity exposure, especially after heat shock.1 The following items were therefore investigated in order to improve humidity resistance: (1) The molding compound thermal stress, (2) Water absorption into the molding compound and its effect on package cracking during solder dipping, (3) Chip attach pad area and its affect on package cracking, (4) Adhesion between molding resin and chip attach pad and its affect on humidity resistance. With the improvements made as a result of these investigations, the reliability of the new thin packages is similar to that of the standard thicker plastic packages.  相似文献   
110.
Given a network where each element has a small number of connected elements, the randomization of connections with small probabilities results in networks with a high broadcast speed. Such networks belong to the class of so-called small-world networks. Analyses indicate that broadcast to all elements of the network is fundamentally different from the average transmission speed. Networks with 10% randomness give the fastest broadcast speeds with no dependence on the position of the initial transmission source. This work was presented in part at the Sixth International Symposium on Artificial Life and Robotics, Tokyo, January 15–17, 2001  相似文献   
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