Syntheses of Spinon Thermal Conductivity Materials in Sr–Cu–O System by Glass‐Ceramics Technique

We have synthesized spinon thermal conductivity materials in Sr–Cu–O system by glass‐ceramics technique. The materials are promising for active control of thermal energy in microelectronic devices because of high and anisotropic thermal conduction, its controllability, and electric insulation. Nevertheless, research on these materials has been limited to that concerning theoretical perspectives and investigation of physical properties using large single crystals. In this study, we adopt glass‐ceramics technique to synthesize these materials: We prepared melt‐quenched multicomponent oxides including SrO and CuO, and checked its glass‐forming ability and crystallization behaviors by heating. As a result, we have found that SrCuO₂ and Sr₁₄Cu₂₄O₄₁, known as the spinon thermal conductivity materials, are synthesized using SrO–CuO–?Li₂O–?Al₂O₃?–Ga₂O₃ system. This synthesis process for the system will provide practical application of the spinon thermal conductivity materials.     

Cerebral Hyperperfusion after Revascularization Inhibits Development of Cerebral Ischemic Lesions Due to Artery-to-Artery Emboli during Carotid Exposure in Endarterectomy for Patients with Preoperative Cerebral Hemodynamic Insufficiency: Revisiting the “Impaired Clearance of Emboli” Concept

The purpose of the present study was to determine whether cerebral hyperperfusion after revascularization inhibits development of cerebral ischemic lesions due to artery-to-artery emboli during exposure of the carotid arteries in carotid endarterectomy (CEA). In patients undergoing CEA for internal carotid artery stenosis (≥70%), cerebral blood flow (CBF) was measured using single-photon emission computed tomography (SPECT) before and immediately after CEA. Microembolic signals (MES) were identified using transcranial Doppler during carotid exposure. Diffusion-weighted magnetic resonance imaging (DWI) was performed within 24 h after surgery. Of 32 patients with a combination of reduced cerebrovascular reactivity to acetazolamide on preoperative brain perfusion SPECT and MES during carotid exposure, 14 (44%) showed cerebral hyperperfusion (defined as postoperative CBF increase ≥100% compared with preoperative values), and 16 (50%) developed DWI-characterized postoperative cerebral ischemic lesions. Postoperative cerebral hyperperfusion was significantly associated with the absence of DWI-characterized postoperative cerebral ischemic lesions (95% confidence interval, 0.001–0.179; p = 0.0009). These data suggest that cerebral hyperperfusion after revascularization inhibits development of cerebral ischemic lesions due to artery-to-artery emboli during carotid exposure in CEA, supporting the “impaired clearance of emboli” concept. Blood pressure elevation following carotid declamping would be effective when embolism not accompanied by cerebral hyperperfusion occurs during CEA.     

Reactive processing of thermoset/thermoplastic blends: A potential for injection molding

Poly(2,6-dimethyl-1,4-phenylene ether) (PPE) is an engineering plastic with high heat distortion temperature. Melt processing of neat PPE is usually accompanied with thermal degradation. The degradation problem is solved by blending with polystyrene to reduce the processing temperature. We propose an alternative using triallylisocyanurate (TAIC). TAIC is a low viscosity liquid that can be cured by peroxide, e.g. α,α′-bis(t-butylperoxy-m-isopropyl)benzene (PBP), to provide a thermoset. The PPE/TAIC mixture was shown to have the upper critical solution temperature (UCST) type phase behavior. At the single-phase regime above UCST and below the cure temperature (∼180°C for PBP), the mixture had a low viscosity, less viscous than a conventional thermoplastic such as PC and PP. That is, a nice window for injection molding was available, e.g., at 100°C to 160°C for a 50/50 blend. After injecting into a hot mold set at cure temperature, the blend cured in a short time (∼80% conversion in 5 min). Then the molded and partly cured material kept its shape and dimensions during post-cure in a hot chamber at higher temperature (e.g. 250°C). Using transmission electron microscopy and dynamic mechanical analyses, it was shown that the cured blend had a bicontinuous two-phase structure with periodic spacings of ∼30 nm, suggesting a structure formation via a spinodal decomposition driven by the increase in molecular weight of TAIC during cure. The cured material showed excellent flexural strength and high chemical resistance.     

Photoacoustic Spectroscopy of Some Energetic Materials

To find an effective laser source to ignite energetic materials, the absorption spectra of some energetic materials are obtained by means of a photoacoustic spectroscopy (PAS). In this experiment, PAS covers the wavelength region of 400 nm-1600 nm in which no other conventional method can take absorption spectra for powdered energetic materials. Photoacoustic spectra of 18 energetic materials are reported. In general, energetic materials tested showed peaks in 600 nm–800 nm and 1400 nm–1600 nm ranges. It is found that the energy required to initiate explosives in the case of ruby laser initiation were correlated with their photoacoustic signal intensities.     

Genetic Study of Four Candidate Holliday Junction Processing Proteins in the Thermophilic Crenarchaeon Sulfolobus acidocaldarius

Homologous recombination (HR) is thought to be important for the repair of stalled replication forks in hyperthermophilic archaea. Previous biochemical studies identified two branch migration helicases (Hjm and PINA) and two Holliday junction (HJ) resolvases (Hjc and Hje) as HJ-processing proteins; however, due to the lack of genetic evidence, it is still unclear whether these proteins are actually involved in HR in vivo and how their functional relation is associated with the process. To address the above questions, we constructed hjc-, hje-, hjm-, and pina single-knockout strains and double-knockout strains of the thermophilic crenarchaeon Sulfolobus acidocaldarius and characterized the mutant phenotypes. Notably, we succeeded in isolating the hjm- and/or pina-deleted strains, suggesting that the functions of Hjm and PINA are not essential for cellular growth in this archaeon, as they were previously thought to be essential. Growth retardation in Δpina was observed at low temperatures (cold sensitivity). When deletion of the HJ resolvase genes was combined, Δpina Δhjc and Δpina Δhje exhibited severe cold sensitivity. Δhjm exhibited severe sensitivity to interstrand crosslinkers, suggesting that Hjm is involved in repairing stalled replication forks, as previously demonstrated in euryarchaea. Our findings suggest that the function of PINA and HJ resolvases is functionally related at lower temperatures to support robust cellular growth, and Hjm is important for the repair of stalled replication forks in vivo.     

Compositional Dependence of Normal Spectral Emissivity of Molten Cu-Fe Alloy

Metallurgical and Materials Transactions B - Normal spectral emissivity of molten Cu-Fe alloy with different compositions was measured at the wavelength of 807 nm using an electromagnetic...     

Direct Reprogramming and Induction of Human Dermal Fibroblasts to Differentiate into iPS-Derived Nucleus Pulposus-like Cells in 3D Culture

Intervertebral disc (IVD) diseases are common spinal disorders that cause neck or back pain in the presence or absence of an underlying neurological disorder. IVD diseases develop on the basis of degeneration, and there are no established treatments for degeneration. IVD diseases may therefore represent a candidate for the application of regenerative medicine, potentially employing normal human dermal fibroblasts (NHDFs) induced to differentiate into nucleus pulposus (NP) cells. Here, we used a three-dimensional culture system to demonstrate that ectopic expression of MYC, KLF4, NOTO, SOX5, SOX6, and SOX9 in NHDFs generated NP-like cells, detected using Safranin-O staining. Quantitative PCR, microarray analysis, and fluorescence-activated cell sorting revealed that the induced NP cells exhibited a fully differentiated phenotype. These findings may significantly contribute to the development of effective strategies for treating IVD diseases.     

Interconnection reliability and interfacial structure between Au alloy bump and Al pad using ultrasonic bonding*

Flip chip technology with Au bumps on a substrace has been widely applied to electronic equipment such as smart phones. The purposes of this study are to examine the effect of Al pad thickness on the bondability of flip chip using ultrasonic bonding and to clarify interfacial structures between Au alloy bumps and Al pads by ultrasonic bonding compared before and after a thermal cycle test. Suitable Al thickness for excellent initial Au/Al bonding without chip cracking are 0.8 μm because a thin Al layer could not reduce stress to a chip under an Al pad during the ultrasonic bonding process. Intermetallic compounds between the Au alloy bump and chip after reflows consisted of five Au-Al layers, and a pure Al layer remained. On the other hand, after the temperature cycle test at 218/423 K, intermetallic compounds between the Au alloy bump and chip were changed into two kinds of Au-Al layers, so a pure Al layer did not exist. In addition, if thick intermetallic compound layers existed around the bonding region, bondability deteriorated easily by thermal stress due to a thermal cycle test, therefore the open failure rate was rising when the Au thickness was 1.2 μm.