A replication process of metallic micro-mold by using parylene embossing and electroplating

This study demonstrated a replication process for metallic micro-mold that combines the parylene-C (poly-chloro-p-xylylene C) hot-embossing and electroplating techniques. A nickel original master was fabricated using the deep RIE silicon etching followed by the electroplating process. Then, the patterned fields composed of arrays of 25 μm-high, 10 μm-wide and 1 mm-long lines with 10 μm spacing in nickel molds were successfully replicated on the 60 μm-thick parylene-C films by the hot-emboss process. Under complete filling conditions, the deviation of the replicated micropattern was less than 2.4%. The electroplated copper successfully filled parylene-C replica master patterns with the aspect ratio of 2.5 without the void formation by both adding organic addictives and controlling the seed layer thickness. After electroplating, the copper micro-mold could be successfully separated from the parylene-C replica master.     

Microstructuring of SU-8 photoresist by UV-assisted thermal imprinting with non-transparent mold

In this study, we explored a rapid and low-cost process for patterning in a SU-8 photoresist by thermal imprinting with a non-transparent mold such as Ni mold. One of major obstacles in the process is that the extremely good formability of uncured SU-8 even near room temperature causes the collapse of imprinted patterns during and after de-molding because a sample cannot be exposed to UV light during imprinting owing to the non-transparency of a mold. To overcome this problem, un-cured SU-8 resists were pre-treated with UV light, heat, and O₂ plasma for controlling their formability, and applied to thermal imprint tests to be compared each other in terms of the replication fidelity. As a result, a SU-8 sample pre-treated with UV light for 8 s resulted in the best replication quality for given imprint conditions and mold dimensions, and we could successfully replicate micro patterns in SU-8 resist without a quartz mold. As compared with conventional UV-imprint processes, this process has potential merits such as a lower mold cost, an easier mold release and a less air-entrapment.     

Large area micro hot embossing of Pyrex glass with GC mold machined by dicing

Micro/Nano imprinting or hot embossing is currently a target of interest for industrial production of micro and Nano devices for the low cost aspect. In Fluidic MEMS (Micro Electromechanical Systems) applications, polymer materials have been widely employed for their low cost to fabricate the economical products (Becker and Heim in Sens Acuators A 83:120–135, 2000; Becker and Gaertner in Mol Biotechnol 82:89–99, 2001). However glasses are much more suitable for the higher temperature applications or under the stronger chemical environments. Moreover UV absorption of glass materials is much less than that of polymers, which is the advantage for bio-analysis. In Optical MEMS as well, glasses are good candidate materials for the better optical properties, such as high refractive index, low UV absorption and others. Although wet etching of glasses is widely employed for fabrication of fluidic MEMS devices, the wet etching is not satisfactory for the low machining resolution, the isotropic etched profile and poor roughness of the fabricated structures. Dry etching of glasses is then an alternative for Micro/Nano structuring, but the etching rate is extremely low (order of 0.1 μm/min) and the cost is too high because of the expensive RIE (Reactive Ion Etching) facility. Above mentioned is the reason why we are interested in hot embossing or imprinting of glasses of Micro/Nano scale. In our previous study, Micro/Nano imprinting was developed for Pyrex glasses using GC (Glassy Carbon) mold prepared by FIB machining (Takahashi et al. in Symposium on DTIP 2004 pp 441–446, 2004). The disadvantage of FIB machining is limited area of etching. The typical area of FIB is less than several hundreds micrometer square. This is the reason why we tried the large area of embossing using GC mold fabricated by dicing machine. Micro hot embossed test structures were successfully demonstrated with good fidelity. Fabricated micro structures can be applied for fabrication of microchamber array for PCR (Akagi et al. in Sci Techol Adv Mater 5:343–349, 2004; Nagai et al. in Anal Chem 73:1043–1047, 2001).     

Long-term effects of immunosuppressants in steroid-dependent nephrotic syndrome

In order to elucidate long-term effects of immunosuppressants, we studied 60 children with steroid-dependent nephrotic syndrome who were treated with three immunosuppressants: cyclophosphamide (n=34), chlorambucil (n=11), and cyclosporin A (n=15). Each relapse before and after the administration of immunosuppressants was evaluated longitudinally in terms of the relapse-free period and the maintenance dose of prednisolone required. The median follow-up period after immunosuppressants was 5.2 years (range 0.5-20.3 years). The relapse-free period was significantly longer in all groups after the initiation of immunosuppressants. However, the relapse-free period after subsequent relapses as compared with the previous relapse was longer in the cyclophosphamide group, similar in the chlorambucil group, and shorter in the cyclosporin A group. The prednisolone dosage at relapse was reduced in subsequent relapses after cyclophosphamide and chlorambucil treatment, but tended to be higher in later relapses after the initiation of cyclosporin A. These findings suggest that the effects of cyclophosphamide are long lasting, while those of chlorambucil and cyclosporin A are of short duration. Children who relapse after cyclosporin A treatment may experience a worse relapsing course.     

Passive piezoelectric DC sensor applicable to one-wire or two-wire DC electric appliances for end-use monitoring of DC power supply

A passive, non-contact piezoelectric DC electric current sensor to satisfy the increasing needs of DC power supply for monitoring the electricity consumption by either one-wire or two-wire appliance cord was proposed, and the sensing principle was schematically described and experimentally verified. A micro magnet was integrated into the proposed DC sensor and the appropriate position for locating the micro magnet was theoretically pinpointed. A prototype DC sensor was fabricated, and an impulse piezoelectric voltage output was detected when a DC electric current was applied to a two-wire electrical appliance cord, by using the constructed measurement setup for demonstration. A linear relationship between the detected peak value of the impulse output voltage and the applied DC electric current was further obtained based on the empirical measurements. In light of the above preliminary results, the proposed piezoelectric DC sensor is thus believed to be useful to various kinds of DC electricity end-use monitoring systems without consuming power electricity and using cord separators even in the case of the two-wire appliances.     

Evaluation of annular pupil for scanning transmission electron microscope formed by focused ion beam technique

Annular pupils for electron optics were developed using a focused ion beam (FIB) technique to realize an increase in the depth of focus, aberration-free imaging and separation of amplitude and phase images under scanning transmission electron microscopy (STEM). A tantalum plate 30 μm thick was used as the annular pupil material in the present experiment. The annular pupils were designed with various outer diameters from ?120 μm to ?40 μm. The inner diameter was designed at 60 to 80% of the outer diameter. The fabricated annular pupils were inspected by scanning ion beam microscopy and scanning electron microscopy. Annular pupils were successfully obtained at the designed size, although the slits of the pupils were slightly tapered by the ion beam etching process. These annular pupils were loaded on a STEM and confirmed to display no charge-up phenomenon by observation of the projection image on a scintillator using a CCD camera. We confirmed the image taken by annular pupil with narrow width was able to suppress the influence of the normal illumination.     

Development and Continuous Operation of a Bench-Scale System for the Production of O3 + O2 + CO2 Hydrates

Ozone (O₃) has many industrial applications such as in sterilization. One of the long-term O₃ preservation methods is molecular storage in clathrate hydrate. In this study, an experimental system was developed for continuously forming O₃ + O₂ + CO₂ hydrates. The parameters that affect the continuous operation of the system and that lead to increases in the concentration of O₃ in the hydrates were also experimentally evaluated, implementing the method of quality engineering. After optimizing these operating parameters, the O₃ storage capacity in the hydrates was measured to be 0.26 wt % at 2 h of total operation time. By X-ray diffraction, it was found that the produced sample contained hydrates, and long-term preservation for 6 months was possible at the temperature of general freezing warehouses.     

Glacier changes in Glacier Bay,Alaska, during 2000–2012

This article presents measurements of glacier surface areas, mean snow line altitude (MSLA) values, mean snow accumulation area ratio (MAAR) values, and elevation changes in the Glacier Bay, Alaska, using Landsat Thematic Mapper (TM)/Landsat Enhanced Thematic Mapper Plus (ETM+) images and digital elevation models (DEMs) from Shuttle Radar Topography Mission (SRTM) and interferometric synthetic aperture radar (IFSAR) data during 2000–2012. Glacier area estimation results showed that Desolation glacier and Fairweather glacier have lost 2.6% and 2.2% of the glacier area, respectively. Only minor surface area changes were seen in Cascade glacier, Crillon glacier, and Lituya glacier during the study period. The results of MSLA and MAAR showed that the MSLA of Fairweather glacier, Lituya glacier, and Desolation glacier increased by about 120–289 m and the MAAR of Fairweather glacier, Lituya glacier, and Desolation glacier decreased by about 3–6%. In contrast, MSLA and MAAR of Crillon glacier decreased by about 70 m and increased by about 1%, respectively. Glacier elevation change results showed that 7.7 m, 4.6 m and 1.5 m of mean thinning change were observed, respectively, on Fairweather glacier, Lituya glacier, and Desolation glacier. However, 7 m and 0.65 m of mean thickening were, respectively, experienced on Cascade glacier and Crillon glacier in the same period. Results from the study indicated that glacier retreat (Fairweather glacier, Lituya glacier, and Desolation glacier) affected by higher temperatures probably dominates with over-increased precipitation. However, increasing debris cover on the glacier surface can also modify the glacier dynamic, resulting in a different response to global warming.     

Fat H-Tree: A Cost-Efficient Tree-Based On-Chip Network

The topological explorations of on-chip networks are important for efficiently using their enormous wire resources for low-latency and high-throughput communications using a modest silicon budget. In this paper, we propose a novel tree-based interconnection network called Fat H-Tree that meets these requirements. A Fat H-Tree provides a torus structure by combining two folded H-Tree networks and is an attractive alternative to tree-based networks such as the Fat Trees in a microarchitecture domain. We introduce its chip layout schemes based on a folding technique for 2D and 3D ICs. Three deadlock-free routing schemes are proposed for Fat H-Tree. We evaluate the performance of Fat H-Tree and other tree-based networks using real application traces. In addition, the network logic area, wire resource, and energy consumption of Fat H-Tree are compared with other topologies, based on a typical implementation of on-chip routers synthesized with a 90-nm standard cell library. The results show that 1) a Fat H-Tree outperforms a Fat Tree with two upward and four downward connections in terms of the throughput and average hop count, 2) a Fat H-Tree requires 19.8 percent-27.8 percent smaller network logic area than the Fat Tree, 3) a Fat H-Tree consumes slightly less energy than the Fat Tree does, and 4) a Fat H-Tree uses slightly more wire resources than the Fat Tree, but the current process technology can provide sufficient wire resources for implementing Fat-H-Tree-based on-chip networks.