长距离曲线顶管在杭州河坊街工程中的应用

对杭州市重点工程—杭州河坊街长距离曲线顶管进行了总结和介绍 ,可为同类工程借鉴和参考     

Effect of microporosity on tensile properties of as-cast AZ91D magnesium alloy

In the present study, the effect of microporosity on the tensile properties of as-cast AZ91D magnesium alloy was investigated through experimental observation and numerical prediction. The test specimens were fabricated by die-casting and gravity-casting. For gravity-casting, the inoculation and use of various metallic moulds were applied to obtain a wide range of microporosity. The deficiency of the interdendritic feeding of the liquid phase acted as a dominant mechanism on the formation of the micropores in the Mg?Al-alloys, rather than the evolution of hydrogen gas. Although tensile strength and elongation has a nonlinear and very intensive dependence upon microporosity, the yield strength appeared to have a linear relationship with microporosity. However, it was possible to quantitatively estimate the linear contribution of microporosity on the individual tensile property for a range of microporosity, which was below about 1%. The numerical prediction suggests that the effect of microporosity on fractured strength and elongation decreased as the strain hardening exponent increased. Furthermore, the shape and distribution of micropores may play a more dominant role than local plastic deformation on the tensile behavior of AZ91D alloy.     

超声波处理和染料结晶性能对粒度分布的影响

超声波是一种频率超越人类听觉范围的声波 ,主要分为动力超声波 ( 1 8ｋＨｚ～ 1ＭＨｚ)和用于诊断的超声波 ( 1ＭＨｚ以上 )。多年以来 ,超声波作为一种辅助工具广泛应用于许多领域 ,从而引起了化学家的极大兴趣。研究表明 ,在纺织品染色过程中 ,超声波能提高反应速率可能归因于超声波的能量 ,有关超声波的应用潜力已有许多文献报道。超声波能提高染色效率主要归因于液体介质中的空化现象 ,这一点已被一致认可。所谓空化现象是指微气泡增长、崩溃、爆炸。Ｍａｓｏｎ指出 ,经超声波辐射的固体粒度显著减小。Ｔｏｍｌｉｓｏｍ和其他工作者也…     

Smart TDI readout circuit for long-wavelength IR detector

A smart time delay and integration (TDI) readout circuit is suggested which performs background suppression, cell-to-cell non-uniformity compensation, and dead pixel correction. Using the smart TDI readout circuit, the integration capacitor area occupying almost the whole area of a unit-cell can be reduced to one-fifth and transimpedance gain can increase by five times. From measurement results, it is found that the skimming current error for a few hundred nA background current is < 1.25 nA corresponding to LSB/2 of ADC and the non-uniformity introduced by cell-to-cell background current variation is reduced to 1.02 nA     

Improvement of RCA transistor using RTA annealing after theformation of interfacial oxide

A polysilicon emitter RCA transistor (an ultra-thin interfacial oxide layer exists between polysilicon and silicon emitter) is presented which can operate at 77 K for the first time. An ultra-thin (1.5 nm) interfacial oxide layer is grown deliberately between polysilicon and silicon emitter using RCA oxidation and excellent device stability is obtained after rapid thermal annealing (RTA) treatment in nitrogen atmosphere. The RCA transistor exhibits good electrical performance at very low temperature for an emitter area of 3 × 8 μm². The maximum toggle frequency of a 1:2 static divider is 1.2 GHz and 732 MHz at 300 K and 77 K, respectively     

Effects of solidification structure on fatigue crack initiation and fatigue strength in Al−Si−Mg cast alloys

Rotating-bending uniaxial fatigue tests and micro-fatigue crack initiation tests were carried out using a permanent mold cast (PMC) and semi-solid die cast (SDC) with Al−7%Si−0.35%Mg composition in order to examine the relationship between solidification structures and fatigue behaviors. The crack length was measured using a replication method. Fatigue strength was improved in SDC, which was almost consistent with the predicted fatigue strength using the size of Si particle cluster. Resistance to fatigue crack initiation and fatigue strength were improved in SDC owing to the finer Si cluster and to higher ultimate tensile strength. Fatigue crack in PMC was preferentially initiated at pores. For SDC, the fatigue crack was initiated at the Si particle/matrix interface, and then sucessively grew along eutectic cell boundaries.     

探讨缩聚催化剂对聚酯切片质量的影响

通过试验，分析比较了江西Sb2O3、南宁Sb2O3和大连Sb(Ac)3三种缩聚催化剂对聚酯切片质量的影响。试验结果表明，Sb(Ac)3是优良的缩聚催化剂。     

Laboratory study of property-modified prebaked carbon anode and application in large aluminum electrolysis cells

A kind of complex additive mainly containing Al, Mg, F, and O was prepared. The synthetical performances of the property-modified prebaked anodes containing additives were tested in laboratory. On the basis of ideal testing results obtained, a large number of industrial prebaked property-modified anodes are prepared in a large-scale aluminum company. Further more, they are all used in 160 kA prebaked anode aluminum electrolysis cells. The statistic result show that, compared with common anodes, the property-modified ones enhance current by 11.6 kg per ton aluminum averagely.     

Analysis on the effectiveness of the 20-H rule for printed-circuit-board layout to reduce edge-radiated coupling

This paper presents the quantified study of the electromagnetic radiation mechanism of the 20-H rule using a numerical approach that has not yet been systematically addressed. The 20-H rule is a rule-of-thumb layout technique recommended to minimize radiated fields propagating from the edges of a printed circuit board (PCB) coupling onto nearby structures. Propagating electromagnetic fields may corrupt adjacent cable assemblies, sheet metal enclosures, and aperture openings. The magnitude of this design rule is investigated using the full-wave finite-difference time-domain (FDTD) method. An analysis on whether benefits exist from use of this rule is examined and under what conditions the rule is valid when correctly implemented. The purpose of this paper is to provide insight into the validity of the 20-H rule, recognizing that every PCB will have different simulation results. FDTD is used to capture a snapshot view of field propagation. This view allows one to determine the validity of the 20-H rule at a single point of time within a dynamic structure and what may be expected when digital components are finally added to a PCB assembly, which generally negates simulated results.