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91.
92.
93.
Shear ductility and toughenability study of highly cross-linked epoxy/polyethersulphone 总被引:1,自引:0,他引:1
The objective of the present study was to determine whether the ductility and toughenability of a highly cross-linked epoxy
resin, which has a high glass transition temperature, T
g, can be enhanced by the incorporation of a ductile thermoplastic resin. Diglycidyl ether of bisphenol-A (DGEBA) cured by
diamino diphenyl sulphone (DDS) was used as the base resin. Polyethersulphone (PES) was used as the thermoplastic modifier.
Fracture toughness and shear ductility tests were performed to characterize the materials. The fracture toughness of the DDS-cured
epoxy was not enhanced by simply adding PES. However, in the presence of rubber particles as a third component, the toughness
of the PES–rubber-modified epoxy was found to improve with increasing PES content. The toughening mechanisms were determined
to be rubber cavitation, followed by plastic deformation of the matrix resin. It was also determined, through uniaxial compression
tests, that the shear ductility of the DDS-cured epoxy was enhanced by the incorporation of PES. These results imply that
the intrinsic ductility, which had been enhanced by the PES addition, was only activated under the stress state change due
to the cavitation of the rubber particles. The availability of increasing matrix ductility seems to be responsible for the
increase in toughness.
This revised version was published online in November 2006 with corrections to the Cover Date. 相似文献
94.
同等功率和照射时间条件下,在14只家兔大脑皮质运用伊文思蓝染料和超微结构观察方法进行血脑屏障改变的研究。结果表明:CO_2激光作用十分表浅,且激光作用后的水肿层血脑屏障改变是可逆的。 相似文献
95.
用614.3nm染料激光照射以Ne为缓冲气体的Ca空心阴极灯,观察到了Ca原子的Pen-ning离化效应。对比在Li空心阴极灯中获得的光电流信号,解释了Ca原子的彭宁离化。 相似文献
96.
TRT入口方管道爆裂原因剖析 总被引:1,自引:0,他引:1
介绍了鞍钢7#高炉TRT装置入口方管道爆裂事故经过,进行了原因分析,并提出了解决措施。 相似文献
97.
在本试验中,采用智能同步广播激励器和CCTV传输的1MHz标频,实现了中波同步广播同频保护率趋于0dB.并提出了自适应相位跟踪同步的概念。 相似文献
98.
Shye Lin Wu Chung Len Lee Tan Fu Lei Chen C.F. Chen L.J. Ho K.Z. Ling Y.C. 《Electron Device Letters, IEEE》1994,15(4):120-122
In this study, it is demonstrated that the incorporation of fluorine can enhance poly-Si/Si interfacial oxide break-up in the poly-Si emitter contacted p+-n shallow junction formation. The annealing temperature for breaking up the poly-Si/Si interfacial oxide has been found to be as low as 900°C. As a result, the junction depth of the BF2-implanted device is much larger than that of the boron-implanted device 相似文献
99.
Performance analysis of adaptive interleaving for OFDM systems 总被引:7,自引:0,他引:7
We proposed a novel interleaving technique for orthogonal frequency division multiplexing (OFDM), namely adaptive interleaving, which can break the bursty channel errors more effectively than traditional block interleaving. The technique rearranges the symbols according to instantaneous channel state information of the OFDM subcarriers so as to reduce or minimize the bit error rate (BER) of each OFDM frame. It is well suited to OFDM systems because the channel state information (CSI) values of the whole frame could be estimated at once when transmitted symbols are framed in the frequency dimension. Extensive simulations show that the proposed scheme can greatly improve the performance of the coded modulation systems utilizing block interleaving. Furthermore, we show that the adaptive interleaving out performs any other static interleaving schemes, even in the fast fading channel (with independent fading between symbols). We derived a semi-analytical bound for the BER of the adaptive interleaving scheme under correlated Rayleigh fading channels. Furthermore, we discussed the transmitter-receiver (interleaving pattern) synchronization problem 相似文献
100.
Pd-Ge based ohmic contact to n-GaAs with a TiW diffusion barrier was investigated. Electrical analysis as well as Auger electron
spectroscopy and the scanning electron microscopy were used to study the contact after it was subjected to different furnace
and rapid thermal annealing and different aging steps. All analyses show that TiW can act as a good barrier metal for the
Au/Ge/Pd/n-GaAs contact system. A value of 1.45 × 10−6 Ω-cm2 for the specific contact resistance was obtained for the Au/TiW/Ge/Pd/n-GaAs contact after it was rapid thermally annealed
at 425°C for 90 s. It can withstand a thermal aging at 350°C for 40 h with its ρc increasing to 2.94 × 10−6Ω-cm2 and for an aging at 410°C for 40 h with its ρc increasing to 1.38 × 10−5 Ω-cm2. 相似文献