柔性OLED用高耐热聚酰亚胺薄膜的制备与性能

聚酰亚胺(PI)薄膜作为柔性有机发光显示(OLED)基板材料应用时, 需要满足玻璃化转变温度(T_g)大于450 ℃和热膨胀系数(CTE)在0~5×10^-6 K^-1之间. 为了提高PI薄膜的热性能, 本文合成了2,7-占吨酮二胺 (2,7-DAX), 并将其与均苯四甲酸二酐(PMDA)和2-(4-氨基苯基)-5-氨基苯并噁唑(BOA)共聚制备了一系列新型PI薄膜. 研究了PI薄膜的聚集态结构、 耐热性能、 尺寸稳定性和力学性能. 结果表明, 占吨酮结构和苯并噁唑结构提高了PI分子链的刚性与线性, 使分子链在平面内紧密堆积与取向, 制备的PI薄膜综合性能优异, 玻璃化转变温度高于408 ℃, CTE在-5.0×10^-6~8.1×10^-6 K^-1之间, 拉伸强度大于140 MPa, 拉伸模量大于4.2 GPa, 断裂伸长率为7.1%~20%, 5%热失重分解温度(T_5%)在601~624 ℃之间. 其中, PI-50和PI-60薄膜具有超高玻璃化转变温度和超低热膨胀系数, T_g高于450 ℃, CTE分别为2.1×10^-6 K^-1和1.6×10^-6 K^-1. 制备的系列PI薄膜作为柔性OLED基板材料有潜在应用前景.     

卤代二苯乙烯体系中卤-卤相互作用的调控及其对分子聚集态和发光特性的影响

卤素-卤素(X···X)相互作用是一类强的分子间相互作用,这种非共价键分子间的相互作用对有机π分子的聚集态结构和光电特性具有重要的影响.本文通过在反式二苯乙烯类化合物骨架上引入给电子基团甲硫基和调节卤素取代基的位置,实现了分子间卤素-卤素相互作用的可控构筑,并进一步研究了卤素-卤素相互作用对卤代反式二苯乙烯类分子聚集态和发光特性的影响.该实验结果为调控有机π分子聚集态结构,获得高性能有机光电材料提供了新思路.     

燃料电池用侧链型磺化聚砜质子交换膜的性能

在制备氯甲基化聚砜(CPS)的基础上,以1,2-二羟基苯-3,5-二磺酸钠为试剂,通过亲核取代反应制备一种侧链末端为磺酸基团的侧链型磺化聚砜(PS-BDS),并采用溶液浇注法制备相应的质子交换膜(PEM),研究温度对PEM性能的影响规律。 结果表明,由于亲水基团远离疏水聚合物主链,该PEM能够形成亲水微区远离疏水微区的相分离结构,亲水区域对主链的影响较小,该PEM在高磺化度下仍能保持较好的尺寸稳定性,随着温度的升高,PEM的吸水率(WU)、吸水溶胀率(SW)和质子传导率(PC)升高,其中PS-BDS-4(离子交换容量为1.57 mmol/g)在25和85 ℃时的SW仅为22.1%和55.0%,甲醇的渗透率(DK)仅为10.17×10^-7 cm²/s,低于商业化的Nafion115(16.8×10^-7 cm²/s)和Nafion117(23.8×10^-7 cm²/s),表现出很好的综合性能。     

含有酰亚胺结构单元的氮杂和硫杂稠五环分子的合成与性能研究

设计合成了含有酰亚胺结构单元的氮杂和硫杂稠五环共轭分子1和2, 并对它们的物理化学性质进行了研究. 实验结果显示酰亚胺基团的引入不仅使得分子具有良好的溶解性, 而且有效地降低分子的HOMO和LUMO能级. 化合物1的单晶结构显示其共轭核具有良好的平面性. 单晶中, 化合物1通过强的π-π相互作用形成二聚体, 二聚体之间存在强的氢键相互作用. 基于化合物2的薄膜场效应晶体管表现出p-型场效应晶体管行为, 其最高迁移率为2.75×10^-3 cm²·V^-1·s^-1.     

基于乙硫基取代的三层酞菁铕二聚体修饰ITO电极构筑电化学多巴胺和尿酸传感器

通过在水平和垂直两个方向上来扩展酞菁配合物的共轭结构, 合成了三明治三层酞菁铕二聚体配合物[Pc(SC₂H₅)₈]₂Eu₂[BiPc(SC₂H₅)₁₂]Eu₂[Pc(SC₂H₅)₈]₂, 使用Quasi-Langmuir-Sh?fer(QLS)方法将配合物薄膜修饰在氧化铟锡导电玻璃(ITO)电极表面, 利用多种谱学手段对配合物分子在薄膜内的排列进行表征, 发现分子采取J聚集模式Edge-on排列在ITO电极表面, 该薄膜具有良好的半导体性质, 导电率高达8.86×10^-5 S/cm. 将配合物薄膜修饰的ITO电极成功应用于多巴胺(DA)和尿酸(UA)的电化学灵敏检测, 最低检测限分别达到1.35和1.64 μmol/L, 灵敏度分别达到110和186.5 mA·μL·mol^-1 ·cm^-2.     

主链含N-烷基咔唑环结构聚芳醚酮的性能表征

对含N-烷基咔唑环结构的聚芳醚酮(PPCzE、PPCzB和PPCzH)进行基本物理性能方面的表征,并与商业化酚酞基聚芳醚酮(PEK-C)进行比较。 咔唑环结构的引入使聚合物在345 nm附近有强紫外光吸收并表现出发蓝光能力。 由于疏水性烷基侧链的存在,聚合物薄膜的水接触角(87°~103°)大于PEK-C(76°),但同时烷基侧链所引起的聚合物链间距的增大导致聚合物的吸水率(0.65%~0.86%)高于PEK-C(0.56%)。 此外,聚合物表现出较好的尺寸稳定性(平均线膨胀系数6.4×10^-5 ℃^-1)和电绝缘性能(体积电阻率10¹⁶ Ω·cm)。 聚合物的拉伸模量在1.9~2.0 GPa之间,拉伸强度在72.5~75.0 MPa之间以及断裂伸长率在6.5%~7.2%之间。 高温条件下(≤225 ℃),PPCzE仍具有良好的拉伸性能。     

核壳结构Ru@PtRu纳米花电催化剂的制备及碱性氢析出反应性能研究

本文通过分步还原Ru、Pt前驱体,制备了以Ru为核、PtRu合金为壳的Ru@Pt_0.24Ru纳米花电催化剂,其平均直径为16.5±4.0 nm. 利用高分辨电子显微镜、电感耦合等离子体原子发射光谱和X射线光电子能谱等表征了这种电催化剂的结构和组成. 在1 mol·L ^-1 KOH水溶液中,核壳结构Ru@Pt_0.24Ru/C纳米花氢析出反应的过电位为22 mV（@10 mA·cm ^-2）,耐久性测试后过电位增加至30 mV（@10 mA·cm ^-2）,明显优于商业Pt/C电催化剂（初始值：60 mV@10 mA·cm ^-2,耐久性测试后：85 mV@10mA·cm ^-2）. 显著提高的电化学活性可能源于核壳结构Ru@Pt_0.24Ru纳米花的电子效应和几何效应,耐久性的改善可能源于核壳结构Ru@Pt_0.24Ru纳米花结构的稳定性.     

锂磷氧氮(LiPON)薄膜电解质和全固态薄膜锂电池研究

采用电子束热蒸发Li₃PO₄与氮等离子体辅助相结合的方法制备了含氮磷酸锂(LiPON)电解质薄膜,已测得该非晶态电解质薄膜在温度为300K时的离子导电率为6.0×10^-7 S/cm,电子电导率低于10^-10 S/cm,电化学稳定窗口为5.0V.以脉冲激光沉积法(PLD)制备的非晶态Ag_0.5V₂O₅薄膜为阴极,真空热蒸发法制备的金属锂为阳极,LiPON薄膜为电解质,成功地制备了一个新的Li/LiPON/Ag_0.5V₂O₅全固态薄膜锂电池.该电池以14μA/cm²电流充/放电时,首次放电容量达到62 μAh·cm^-2·μm^-1,10次循环后容量衰减缓慢,衰减率约为0.2%,循环寿命达到550次以上.     

含氨基磺化聚芳醚酮砜质子交换膜的制备与性能

通过四元缩聚的方法合成了带有氨基的磺化度可控的磺化聚芳醚酮砜共聚物(Am-SPAEKS). 采用红外光谱和核磁共振谱表征了Am-SPAEKS共聚物的结构. 该共聚物膜具有较好的热性能、尺寸稳定性、较高的质子传导率和阻醇能力. 在80℃时Am-SPAEKS-1膜的质子传导率达到0.0894 S/cm, 而其甲醇渗透系数在25℃时为0.24×10^-6 cm²/s, 低于相同温度下SPAEKS膜(0.87×10^-6 cm²/s)和Nafion膜(2×10^-6 cm²/s). 结果表明, Am-SPAEKS膜能够满足质子交换膜燃料电池(PEMFC)的使用要求.     

分子凝胶电解质的电导率研究

凝胶因子4,4'-二(硬脂酰胺基)二苯醚(BSDE)在水和非水介质(如二甲基甲酰胺、二甲基亚砜、碳酸丙烯酯等)中利用非共价键相互作用自组装成有序的三维纤维网络结构,使介质凝胶化.该凝胶被称之为分子凝胶.同样,BSDE也能使锂盐溶液凝胶化,制备一种新型分子凝胶电解质.水分子凝胶锂离子电解质的室温离子电导率达到10^-1～10^-2S·cm^-1,碳酸丙烯酯分子凝胶锂离子电解质的室温离子电导率也能达到10^-2～10^-3S·cm^-1.分子凝胶的离子电导率研究表明,锂盐在凝胶中的行为和其在溶液中的行为相似.在-35℃的低温下,分子凝胶的电导率与其溶液相比约低1～2个数量级.     

The effect of orientation on thermal expansion behavior in polyimide films

The anisotropy of the thermal expansion of polyimide films was investigated . Out-of-plane or thickness direction coefficients of linear thermal expansion (CTE) were calculated from the difference between the coefficient of volumetric expansion (CVE) and the sum of the in-plane or film direction coefficients of linear thermal expansion for commercial and spin-coated PMDA//ODA and BPDA//PPD films and spin coated BTDA//ODA/MPD films. The CVEs were obtained from a pressure-volume-temperature (PVT) technique based on Bridgeman bellows. The CVE was shown to be essentially constant, independent of molecular orientation and thickness. A decrease in the in-plane CTEs therefore occurs at the expense of an increase in the out-of-plane CTE. In all cases the calculated out-of-plane CTE was higher than the measured in-plane CTE. The ratio of the out-of-plane CTE to the in-plane CTE was 1.2, 3.8, and 49.3 for the spin-coated BTDA//ODA/MPD, PMDA//ODA, and BPDA//PPD films, respectively. © 1994 John Wiley & Sons, Inc.     

Molecular Mechanisms Causing Anomalously High Thermal Expansion of Nanoconfined Water

Anomalously high thermal expansion is measured in water confined in nanoscale pores in amorphous silica and the molecular mechanisms are identified by molecular dynamics (MD) simulations using an accurate dissociative water potential. The experimentally measured coefficient of thermal expansion (CTE) of nanoconfined water increases as pore dimension decreases. The simulations match this behavior for water confined in 30 Å and 70 Å pores in silica. The cause of the high expansion is associated with the structure and increased CTE of a region of water ～6 Å thick adjacent to the silica. The structure of water in the first 3 Å of this interface is templated by the atomically rough silica surface, while the water in the second 3 Å just beyond the atomically rough silica surface sits in an asymmetric potential well and displays a high density, with a structure comparable to bulk water at higher pressure.     

Effect of Thermal Cycles on the Thermal Expansion Behavior of T700 Carbon Fiber Bundles

The relationships between the coefficient of thermal expansion(CTE) of T700 carbon fiber bundles(CFBs) and the thermal cycles were investigated. The microstructure of T700 CFBs was analyzed with Raman spectra and XRD before and after the thermomechanical test. The results indicated that the T700 CFBs exhibited negative expansion in the direction of parallel fibers in the temperature range of -150-150℃. The thermal strain that occurred during the heating and the cooling thermal cycle had an unclosed curve that served as the loop. When the experimental load was the same, the position of strain loop tended to move upward, and the length of the specimen increased continuously with the thermal cycles increasing. The microstructural analysis suggested that the degree of structural order and the degree of orientation along the fiber axis were improved with the increase of thermal cycles. The change of microstructure parameters could be the primary cause of the negative CTE's variation within the T700 CFBs.     

Structural and compositional effects on thermal expansion behavior in polyimide substrates of varying thicknesses

Polyimide films with thicknesses ranging from 6 μm to 80 μm were prepared with a solvent casting method to explore film thickness effects on the in-plane thermal expansion coefficient (CTE). In the case of polyimide films composed of bulky and flexible molecular units, CTE is consistent regardless of film thickness. In contrast, films with rigid and planar molecular structure show CTE increase according to the increase of film thickness up to 40–50 μm, which then plateau for thicker films. It is apparent that the film thickness dependent thermal expansion originates from complex effects of molecular orientation, charge transfer complex formation, and crystal formation as a function of film thicknesses, through characterization on UV–Vis absorption, crystalline structure, glass transition behavior, and optical retardation. These results provide insight into the design of polymer structures for flexible display substrates that require appropriate CTE values.     

新型聚酰胺酰亚胺的合成及其热稳定性

L-丙氨酸与均苯四甲酸二酐经缩合反应制得手性酰亚胺(1);1与二苯基甲烷二异氰酸酯聚合制得新型的以L-丙氨酸为手性源的聚酰胺酰亚胺(2),其结构经1H NMR和FT-IR表征.用DSC和TGA研究了2的结晶性能和热稳定性,同时对2的溶解性能进行了探讨.结果表明,2的Tm为357.6℃,失重5％的分解温度为215℃;2在常温下溶于DMF,DMAc,DMSO和NMP.     

Spontaneous molecular orientation of polyimides induced by thermal imidization (6). Mechanism of negative in-plane CTE generation in non-stretched polyimide films

The mechanism of negative coefficient of thermal expansion (CTE) generation for non-stretched polyimide (PI) films is proposed in this work. Negative CTE behavior was observed in some miscible binary blend films composed of a major fraction of a rod-like semi-crystalline PI derived from pyromellitic dianhydride (PMDA) with p-phenylenediamine (PDA) and flexible PIs based on 2,3,3′,4′-biphenyltetracarboxylic dianhydride (a-BPDA) whereas homo PMDA/PDA PI film shows a considerably low but a positive CTE value. The results suggest that the negative CTE generation is related to not only a considerably high extent of in-plane orientation of the PMDA/PDA chains but also to the crystallinity of the blends. The present work revealed that some other PIs, a poly(ester imide), and a polybenzoxazole system also display negative CTE and these systems also possess extremely high extents of in-plane chain orientation without exception. In addition to CTE, the morphologies were monitored as a function of imidization temperature for two PI systems, PMDA/2,2′-bis(trifluoromethyl)benzidine and PMDA/m-tolidine by wide-angle X-ray diffraction, FT-IR spectroscopy, birefringence, and film density measurements. The results suggested that the negative CTE phenomenon occurs when PI films possess very high extents of in-plane orientation and a less crystalline morphology simultaneously, thereby significant thermal expansion can be allowed to the thickness direction.     

(Fe1-xNix)ZrF6固溶体晶体结构与可调控的热膨胀性质

绝大部分物质具有热胀冷缩的基本性质,然而近年来的研究发现一些化合物具有反常的负热膨胀性质,其为有效调节物质热膨胀系数(CTE)提供了可行性,尤其调控各向同性化合物热膨胀性质是一个重要的研究方向。本文以双ReO₃结构的固溶体(Fe_1-xNi_x)ZrF₆为研究对象,对(Fe_1-xNi_x)ZrF₆固溶体的制备、晶体结构以及热膨胀调控开展了深入研究。(Fe_1-xNi_x)ZrF₆固溶体呈现全程固溶特性,通过Ni²⁺对Fe²⁺进行化学替代的方法实现了(Fe_1-xNi_x)ZrF₆热膨胀系数在大范围内的有效调控(−3.24×10⁻⁶– +18.23 × 10⁻⁶ K⁻¹,300–675 K),尤其,在(Fe_0.5Ni_0.5)ZrF₆化合物中得到了零膨胀性能。作为一种典型的框架结构化合物,晶胞中F原子横向热振动的差异是导致各自不同热膨胀差异的本质原因。该研究给我们提供了一个基于开放式框架结构化合物的热膨胀调控方法。     

Thermally stable sulfone-containing poly(amide-imides)

Novel sulfone containing poly(amide-imides) have been prepared by reacting 3,4-dicarboxy-4′-(chloroformyl)-diphenylsulfone dianhydride with various aromatic diamines. Relatively high molecular weight polymers were obtained by using a two-step procedure. Transparent poly(amide-imide) films, varying in color from dark yellow to colorless, were formed by thermally treating polyamic acid solutions. All films showed good thermal stability.     

Thermal expansion behavior of solar cell encapsulation materials

The object of this paper is to determine the thermal expansion behavior of nine different encapsulants in order to identify possible deficiencies in production processes and allow for the optimization of the process parameters. High dimensional stability of the encapsulant is of great importance in photovoltaic (PV) module production to avoid problems during lamination and/or in application. For this purpose, the samples were heated twice in a thermo-mechanical analyzer (TMA) in tensile mode, and the coefficient of thermal expansion (CTE) over temperature was evaluated. To get additional information about transition temperatures of the encapsulants, differential scanning calorimetry (DSC) measurements were made. The TMA results for most samples showed anisotropic behavior which was eliminated after the first heating run. Three samples showed shrinkage with subsequent increased thermal expansion as well as anisotropic behavior. It could be shown that knowing the thermal expansion behavior of the solar cell encapsulants is highly relevant for the PV module lamination process, and Thermo-Mechanical Analysis proved to be a suitable method to evaluate and also for quality control of solar cell encapsulation films.