13N超高纯锗单晶的制备与性能研究

13N超高纯锗单晶是制作超高纯锗探测器的核心材料。本文通过还原法获得还原锗锭,再由水平区熔法提纯获得12N高纯锗多晶,最后由直拉法生长得到13N超高纯锗单晶。通过低温霍尔测试、位错密度检测、深能级瞬态谱(DLTS)测试对13N超高纯锗单晶性能进行分析。低温霍尔测试结果显示,晶体头部截面平均迁移率为4.515×10⁴ cm²·V^-1·s^-1,载流子浓度为1.176×10¹⁰ cm^-3,导电类型为p型,位错密度为2 256 cm^-2;尾部截面平均迁移率为4.620×10⁴ cm²·V^-1·s^-1,载流子浓度为1.007×10¹⁰ cm^-3,导电类型为p型,位错密度为2 589 cm^-2。晶体深能级杂质浓度为1.843×10⁹ cm^-3。以上结果...     

高效背结异质结太阳电池硼掺杂非晶硅发射极研究

晶硅/非晶硅异质结(HJT)太阳电池由于具有高开压、高转换效率和低温度系数等优点而备受关注，其中硼掺杂p型非晶硅(p-a-Si∶H)发射极是高转换效率电池中不可忽视的重要部分，改变其硼掺杂浓度，可以调节p-layer薄膜的电学特性，从而直接影响电池转换效率。本文采用等离子体增强化学气相沉积(PECVD)设备制备HJT太阳电池，通过改变B₂H₆的掺杂浓度，对电池中p-a-Si∶H层进行优化，使HJT电池获得0.75%的相对效率提升。进一步地，将发射极设置为梯度掺杂的双层结构，经过优化，少子寿命(@Δn=5×10¹⁵ cm^-3)和隐开路电压(@1-Sun)分别提升400μs和3 mV,最终具有梯度掺杂发射极的电池其平均效率相对提升2.03%,主要表现为FF和V_oc的明显增加，实现了高效HJT电池p型发射极的工艺优化。     

全TOPCon电池正面多晶硅层硼掺杂工艺

为提升隧穿氧化层钝化接触(TOPCon)电池光电转换效率,本文通过高温扩散在n型TOPCon电池正面制作p型隧穿氧化层钝化接触结构,提升发射极钝化性能,减少正面金属复合。本文研究了不同沉积时间、推进温度、推进时间等工艺参数对实验样品钝化性能及掺杂曲线的影响。实验结果表明,当沉积时间为1 500 s,推进温度为920℃,推进时间为20 min时,掺硼多晶硅层可获得较优的钝化性能及掺杂浓度,其中样品多晶硅层硼掺杂浓度达到1.40×10²⁰ cm^-3,隐开路电压(iV_oc)大于720.0 mV。依据该参数制备的TOPCon电池光电转换效率可达23.89%,对应的短路电流密度为39.36 mA/cm²,开路电压(V_oc)达到726.4 mV,填充因子(FF)为83.54%。     

单层n型MoS2/p型c-Si异质结太阳电池数值模拟

单层二硫化钼(MoS₂)是一种具有优异光电性能的半导体材料,在太阳能能量转换中表现出很大的应用潜力。本文基于AMPS模拟软件,对单层n型MoS₂/p型c-Si异质结太阳电池进行了数值模拟与分析。通过模拟优化,n型MoS₂的电子亲和能为3.75 eV、掺杂浓度为10¹⁸ cm^-3,p型c-Si的掺杂浓度为10¹⁷ cm^-3时,太阳电池能够取得最高22.1%的转换效率。最后模拟了n型MoS₂/p型c-Si异质结界面处的界面态对太阳电池性能的影响,发现界面态密度超过10¹¹ cm^-2·eV^-1时会严重影响太阳电池的光伏性能。     

超薄多晶硅的掺杂、钝化及光伏特性研究

本文对70 nm超薄多晶硅的掺杂工艺、钝化性能及光伏特性进行了研究。确定了70 nm超薄多晶硅的掺杂工艺,研究表明当离子注入剂量为3.2×10¹⁵ cm^-3,在855 ℃退火20 min时,70 nm超薄多晶硅的钝化性能可以达到与常规120 nm多晶硅相当的水平,且70 nm多晶硅的表面掺杂浓度达到5.6×10²⁰ atoms/cm³,远高于120 nm掺杂多晶硅的表面掺杂浓度(2.5×10²⁰ atoms/cm³)。基于70 nm超薄多晶硅厚度减薄和高表面浓度掺杂的特点,较低的寄生吸收和强场钝化效应使得在大尺寸(6英寸)直拉单晶硅片上加工的N型TOPCon太阳能电池的光电转换效率得到明显提升,主要电性能参数表现为:电流I_sc升高20 mA,串联电阻R_s降低,填充因子FF增加0.3%,光电转换效率升高0.13%。     

高质量氧化镓单晶及肖特基二极管的制备

本文采用导模法生长技术,成功制备了高质量掺Si氧化镓(β-Ga₂O₃)单晶,掺杂浓度为2×10¹⁸ cm^-3.晶体呈现淡蓝色,通过劳厄衍射、阴极荧光(CL)及拉曼测试对晶体的基本性质进行了表征,结果表明晶体质量良好.紫外透过光谱证明该晶体的禁带宽度约为4.71 eV.此外,在剥离衬底上,采用电子束蒸发、光刻和显影技术制备了垂直结构的肖特基二极管,平均击穿场强EAva为2.1 MV/cm,导通电阻3 mΩ·cm²,展示了优异性能.     

红外LED用GaAs单晶的垂直梯度凝固制备研究

GaAs单晶是当前光电子器件的主要衬底材料之一，在红外LED中有着重要应用。但杂质浓度高、迁移率低等缺点会严重影响红外LED器件性能。为生产出低杂质浓度、高迁移率、载流子分布均匀、高利用率的红外LED用掺硅垂直梯度凝固(VGF)法GaAs单晶，本文研究了热场分布、合成舟和炉膛材质、工艺参数对单晶的成晶质量、杂质浓度、迁移率、载流子分布的影响。利用CGSim软件对单晶生长热场系统进行数值模拟研究，温区一至温区六长度比例为8∶12∶9∶5∶5∶7时，恒温区达到最长，位错密度达到1 000 cm^-2以下，成晶率达到85%。采用打毛石英合成舟进行GaAs合成，用莫来石炉膛替代石英炉膛，可以获得迁移率整体高于3 000 cm²/(V·s)的GaAs单晶，满足红外LED使用要求。对单晶生长工艺参数展开研究，采用提高头部生长速度、降低尾部生长速度的方式提高单晶轴向载流子浓度均匀性，头尾部载流子浓度差降低33%,尾部迁移率从2 900 cm²/(V·s)提高到3 560 cm²/(V·s)。单晶有效利用长度提高33...     

MoS2/SnS异质结太阳能电池的模拟研究

硫化亚锡(SnS)是一种Ⅳ-Ⅵ族层状化合物半导体材料,其禁带宽度与太阳能电池最佳带隙1.5 eV非常接近,并且在可见光范围内光的吸收系数很大(α>10⁴ cm^-1),因此SnS是一种很有应用前景的材料。本文利用太阳能电池模拟软件wxAMPS模拟了MoS₂/SnS异质结太阳能电池,主要研究SnS吸收层的厚度、掺杂浓度和缺陷态等因素对太阳能电池性能的影响。研究发现:SnS吸收层最佳厚度为2 μm,最佳掺杂浓度为1.0×10¹⁵ cm^-3;同时高斯缺陷态浓度超过1.0×10¹⁵ cm^-3时,电池各项性能参数随着浓度的增加而减小,而带尾缺陷态超过1.0×10¹⁹ cm^-3·eV^-1时,电池性能才开始下降;其中界面缺陷态对太阳能电池影响比较严重,界面缺陷态浓度超过1.0×10¹² cm^-2时,开路电压、短路电流、填充因子和转换效率迅速下降。另外,通过模拟获得的转换效率高达24.87%,开路电压为0.88 V,短路电流为33.4 mA/cm²。由此可知,MoS₂/SnS异质结太阳能电池是一种很有发展潜力的光伏器件结构。     

单晶金刚石p型和n型掺杂的研究

超宽禁带半导体材料金刚石在热导率、载流子迁移率和击穿场强等方面表现出优异的性质,在功率电子学领域具有广阔的应用前景。实现p型和n型导电是制备金刚石半导体器件的基础要求,其中p型金刚石的发展较为成熟,主流的掺杂元素是硼,但在高掺杂时存在空穴迁移率迅速下降的问题;n型金刚石目前主流的掺杂元素是磷,还存在杂质能级深、电离能较大的问题,以及掺杂之后金刚石晶体中的缺陷造成载流子浓度和迁移率都比较低,电阻率难以达到器件的要求。因此制备高质量的p型和n型金刚石成为研究者关注的焦点。本文主要介绍金刚石独特的物理性质,概述化学气相沉积法和离子注入法实现金刚石掺杂的基本原理和参数指标,进而回顾两种方法进行单晶金刚石薄膜p型和n型掺杂的研究进展,系统总结了其面临的问题并对未来方向进行了展望。     

ZnO(n)/ZnSe(i)/c-Si(p)异质结太阳电池的模拟研究

近年来,HIT(heterojunction with intrinsic thin-layer)结构太阳能电池由于具有转化效率高和可低温生产等优点获得了广泛的关注,但是转化原材料成本高、生产技术条件苛刻和缺陷态控制等问题制约了其进一步的发展。本文采用AFORS-HET软件模拟了ZnO(n)/ZnSe(i)/c-Si(p)异质结太阳电池结构吸收层掺杂浓度、缺陷密度和界面缺陷态密度等参数对该结构短路电流、开路电压、填充因子和光电转换效率的影响。优化后的结果显示,当吸收层掺杂浓度为1×10²¹ cm^-3,ZnO层和c-Si层缺陷密度小于10¹⁷ cm^-3时,ZnSe/c-Si界面缺陷密度小于10²⁵ cm^-3时,该结构太阳能电池光电转换效率可达24.29%。     

Growth of nitrogen-doped p-type ZnO films by spray pyrolysis and their electrical and optical properties

Nitrogen-doped ZnO films were deposited on silicon (1 0 0) substrate using zinc acetate and ammonium acetate aqueous solution as precursors by ultrasonic spray pyrolysis. Successful p-type doping can be realized at optimized substrate temperature. The p-type ZnO films show excellent electrical properties such as hole concentration of 10¹⁸ cm⁻³, hole mobility of 10² cm² V⁻¹ s⁻¹ and resistivity of 10⁻² Ω cm. In the photoluminescence measurement, a strong near-band-edge emission was observed, while the deep-level emission was almost undetectable in both undoped and N-doped ZnO films. The growth and doping mechanism of N-doped ZnO films were discussed.     

4英寸氧化镓单晶生长与性能

本文使用导模法(EFG)制备了4英寸氧化镓(β-Ga₂O₃)单晶,并对晶体物相、结晶质量、缺陷、光学及电学特性进行了研究。晶体不同方向劳厄(Laue)衍射斑点清晰一致,符合β-Ga₂O₃衍射特征。晶体(400)面摇摆曲线半峰全宽(FWHM)为57.57″,通过化学腐蚀获得其腐蚀坑位错密度为1.06×10⁴ cm^-2。晶体在紫外截止边为262.1 nm,对应光学带隙为4.67 eV。通过C-V测试分析获得非故意掺杂晶体中的电子浓度为7.77×10¹⁶ cm^-3。     

High-quality InP grown by chemical beam epitaxy

InP films were grown by chemical beam epitaxy using trimethylindium (TMI) and pure phosphine (PH₃) in a flow control mode with hydrogen as the carrier gas, with the TMI flow rate fixed at 3 SCCM. Substrate temperatures were varied between 505 and 580°C and V/III ratios from 3 to 9. InP layers with high optical quality (intense and narrow excitonic transition lines) and high crystalline quality (narrow and symmetric X-ray diffraction peaks) could be grown only within a narrow parameter window around a substrate temperature of 545°C (δT_s ≤ 25°C) and a V/III ratio of 5.5 (δ(V/III) ≤ 2). Carrier densities of 8 × 10¹⁴ cm^-3 with mobilities of 70000 cm²/V.s measured at 77 K were obtained for growth conditions close to the edge of this parameter window towards low V/III ratios. The growth rate of inP was also clearly at its maximum in the given parameter window. Leaving the window, by changing either the growth temperature or the V/III ratio, significantly decreased the growth rate. This reduced growth rate was accompanied by a degradation in the crystalline quality. We also demonstrate that for higher TMI flow the parameter window shifts to higher growth temperatures. The InP could be doped effectively with Si in the range from 9 × 10¹⁵ to 3 × 10¹⁸ cm^-3.     

CBE growth of high-quality AlGaAs/GaAs heterostructures for HEMT applications

AlGaAs/GaAs heterostructures were grown by chemical beam epitaxy using triethylgallium, triisobutylaluminium and pure arsine in flow control mode with hydrogen as carrier gas. For substrate temperatures of 580°C and V/III ratios of 10, high quality AlGaAs layers are obtained; heterostructures show abrupt and smooth interfaces. Modulation doping with silicon evaporated from a conventional effusion cell gives two-dimensional electron gases with carrier densities up to 1×10¹² cm^-2. Mobilities of 70000 cm²/V·s are obtained at 77 K for carrier densities of 4×10¹¹ cm^-2. The lateral homogeneity of the heterostructures in layer thickness, composition and doping level is excellent. Perfect morphology with defect densities of about 100 cm^-2 is observed. High electron mobility transistors (gate length 0.3 nm) fabricated from quantum well structures show a transconductance of about 380 mS/mm.     

Growth of carbon-doped base GaAs/AlGaAs HBT by gas-source MBE using TEG, TEA, TMG, AsH3, and Si2H6

High-performance carbon-doped-base GaAs/AlGaAs heterobipolar transistors (HBTs) were grown by gas-source MBE using only gaseous sources including dopant sources. The AlGaAs emitter layer was doped with Si from uncracked SI₂H₆ (n = 9 × 10¹⁷ cm^-3), and the base layer (92.5 nm) was doped with carbon from TMG (p = 4 × 10¹⁹ cm^-3). From SIMS analysis it was confirmed that a well-defined emitter-base junction with sharp carbon profile was obtained. The base-current ideality factor from the Gummel plot was 1.47, and the emitter-base junction ideality factor was 1.12. A high DC current gain of 53 was obtained at a current density of 4 × 10⁴ A/cm². The device characteristics of our carbon-doped HBTs were found to be stable under current stress.     

Growth of GaAs/AlGaAs HBTs by MOMBE (CBE)

In this paper, we will discuss how the unique growth chemistry of MOMBE can be used to produce high speed GaAs/AlGaAs heterojunction bipolar transistors (HBTs). The ability to grow heavily doped, well-confined layers with carbon doping from trimethylgallium (TMG) is a significant advantage for this device. However, in addition to high p-type doping, high n-type doping is also required. While elemental Sn can be used to achieve doping levels up to 1.5×10¹⁹ cm^-3, severe segregation limits its use to surface contact layers. With tetraethyltin (TESn), however, segregation does not occur and Sn doping can be used throughout the device. Using these sources along with triethylgallium (TEG), trimethylamine alane (TMAA), and AsH₃, we have fabricated Npn devices with 2 μm×10 μm emitter stripes which show gains of ≥ 20 with either ƒ_t = 55 GHz and ƒ_max = 70 GHz or ƒ_t = 70 GHz and ƒ_max = 50 GHz, depending upon the structure. These are among the best RF values reported for carbon doped HBTs grown by any method, and are the first reported for an all-gas source MOMBE process. In addition, we have fabricated a 70 transistor decision circuit whose performance at 10 Gb/s equals or exceeds that of similar circuits made from other device technologies and growth methods. These are the first integrated circuits reported from MOMBE grown material.