梯度材料中矩形裂纹的对偶边界元方法分析

采用对偶边界元方法分析了梯度材料中的矩形裂纹. 该方法基于层状材料基本解,以非裂纹边界的位移和面力以及裂纹面的间断位移作为未知量. 位移边界积分方程的源点配置在非裂纹边界上,面力边界积分方程的源点配置在裂纹面上. 发展了边界积分方程中不同类型奇异积分的数值方法. 借助层状材料基本解,采用分层方法逼近梯度材料夹层沿厚度方向力学参数的变化. 与均匀介质中矩形裂纹的数值解对比,建议方法可以获得高精度的计算结果. 最后,分析了梯度材料中均匀张应力作用下矩形裂纹的应力强度因子,讨论了梯度材料非均匀参数、夹层厚度和裂纹与夹层之间相对位置对应力强度因子的影响.      

正交各向异性功能梯度材料反平面裂纹尖端应力场

采用积分变换-对偶积分方程方法,研究了正交各向异性功能梯度材料反平面裂纹问题,文中假定材料沿两个主轴方向的剪切模量成比例按双参数梯度模型变化,通过求解对偶积分程并考虑变形Bessel函数的渐特性,推导出了裂纹尖端应力场,最后考察了材料非均匀性及正交性对应力强度因子的影响。     

功能梯度压电板条中电绝缘型运动裂纹的电弹性场

基于三维弹性理论和压电理论，对材料系数按指数函数规律分布的功能梯度压电板条中的反平面运动裂纹问题进行了求解。利用Fourier积分变换方法将电绝缘型运动裂纹问题化为对偶积分方程，并进一步归结为易于求解的第二类Fredholm积分方程。通过渐近分析，获得了裂纹尖端应力、应变、电位移和电场的解析解，给出了裂纹尖端场各个变量的角分布函数，并求得了裂纹尖端场的强度因子，分析了压电材料物性梯度参数、几何尺寸及裂纹运动速度对它们的影响。结果表明，对于电绝缘型裂纹，功能梯度压电板条中运动裂纹尖端附近的各个场变量都具有-1／2阶的奇异性；当裂纹运动速度增大时，裂纹扩展的方向会偏离裂纹面。     

功能梯度压电压磁材料中断裂问题分析

分析了功能梯度压电/压磁材料中裂纹在反平面剪切载荷下的断裂问题. 为了便于分析，假设材料性质沿着裂纹的法线方向呈指数变化. 利用Fourier变换，问题可以转化为对未知数是裂纹表面张开位移的一对对偶积分方程的求解，此对偶积分方程采用Schmidt方法求解. 最后分析了裂纹长度及表征功能梯度材料的参数βl对应力，电位移和磁通量强度因子的影响.     

功能梯度板条Ⅲ型运动裂纹问题研究

现存文献关于梯度材料断裂问题的研究大都是假设材料参数为坐标的指数函数或幂函数,而其它函数形式较少采用.本文假设功能梯度材料剪切模量和密度的倒数均为坐标的线性函数,而泊松比为常量,研究功能梯度板条的反平面运动裂纹问题.利用Fourier积分变换技术和传递矩阵法将混合边值问题化为一对奇异积分方程,通过数值求解奇异积分方程获得板条运动裂纹在反平面载荷作用下的动态应力强度因子,并讨论了裂纹运动速度、裂纹相对尺寸、以及材料非均匀性对动态应力强度因子的影响,结果证明梯度参数、裂纹速度和几何尺寸对材料动态断裂行为有显著影响.     

功能梯度材料与均质材料交界面上Ⅰ-型裂纹对简谐动载的响应分析

在忽略界面裂尖端裂纹面相互叠入的条件下,对功能梯度材料与均质材料交界面上Ⅰ-型裂纹对简谐动载响应问题进行了分析。利用傅立叶变换,将问题的求解转换为对以裂纹面上位移差为未知函数的对偶积分方程的求解。为了求解对偶积分方程,将裂纹面上的位移差函数展开为雅可毕多项式的级数形式。最终给出了裂纹长度、入射波频率和材料性质对应力强度的影响。结果表明,当界面材料不连续时,获得了具有普通1/2奇异性的近似解。     

含非完整界面的功能梯度压电材料Ⅲ型裂纹问题

本文研究了含非完整界面的功能梯度压电复合材料的Ⅲ型裂纹问题．此裂纹垂直于非完整界面，采用弹簧型力电耦合界面模型模拟非完整界面．界面两侧材料的性质，如弹性模量、压电常数和介电常数均假定呈指数函数形式且沿着裂纹方向变化．运用积分变换法将裂纹面条件转换为奇异积分方程，并使用Gauss-Chebyshev方法对其进行数值求解．根据算例结果讨论了一些退化问题并分析了裂纹尖端强度因子与材料的非均匀系数和非完整界面参数的关系．     

功能梯度材料涂层平面运动裂纹分析

研究粘结于均匀材料基底上功能梯度材料涂层平面运动裂纹问题,假设功能梯度材料剪切模量和密度为坐标的指数函数,而泊松比为常数.采用Fourier变换和传递矩阵法将该混合边值问题转化为一对奇异积分方程,通过数值求解奇异积分方程组获得功能梯度材料涂层平面运动裂纹的应力强度因子.考察了结构几何尺寸、裂纹运动速度以及材料梯度参数对运动裂纹的应力强度因子的影响,发现材料梯度参数、结构几何尺寸、裂纹长度以及运动速度均对功能梯度材料动态断裂行为有显著影响.     

功能梯度压电压磁材料中裂纹对SH波的散射

研究无限大功能梯度压电/压磁复合材料中裂纹对SH波的散射问题.为了便于分析,假设材料性质沿着裂纹的法线方向是指数变化.利用Fourier余弦变化,将问题转化为对偶积分方程的求解,此对偶积分方程采用Copson方法求解.然后求得应力强度因子、电位移强度因子、磁通量强度因子的解析表达式,最后数值算例给出了材料参数、入射角及波数对标准动应力强度因子的影响.     

功能梯度压电压磁材料粘结的Ⅲ型裂纹问题

利用奇异积分方程方法研究两个半无限大的功能梯度压电压磁材料粘结,在渗透和非 渗透边界条件下的III型裂纹问题. 首先通过积分变换构造出原问题的形式解，然 后利用边界条件通过积分变换与留数定理得到一组奇异积分方程， 最后利用Gauss-Chebyshev方法进行数值 求解，讨论材料参数、材料非均匀参数以及裂纹几何形状等对裂纹尖端应力 强度因子的影响. 从结果中可以看出，压电压磁复合材料中反平面问题的应力奇异性 形式与一般弹性材料中的反平面问题应力奇异形式相同，但材料梯度参数对功能梯度压电压 磁复合材料中的应力强度因子和电位移强度因子有很大的影响.     

A moving mode-III crack in functionally graded piezoelectric material: permeable problem

In this paper a moving mode-III crack in functionally graded piezoelectric materials (FGPM) is studied. The crack surfaces are assumed to be permeable. The governing equations for FGPM are solved by means of Fourier cosine transform. The mathematical formulation for the permeable crack condition is derived as a set of dual integral equations, which, in turn, are reduced to a Fredholm integral equation of the second kind. The results obtained indicate that the stress intensity factor of moving crack in FGPM depends only on the mechanical loading. The gradient parameter of the FGPM and the moving velocity of the crack do have significant influence on the dynamic stress intensity factor.     

A MOVING CRACK IN A NONHOMOGENEOUS MATERIAL STRIP

This paper considers an anti-plane moving crack in a nonhomogeneous material strip of finite thickness. The shear modulus and the mass density of the strip are considered for a class of functional forms for which the equilibrium equation has analytical solutions. The problem is solved by means of the singular integral equation technique. The stress field near the crack tip is obtained. The results are plotted to show the effect of the material non-homogeneity and crack moving velocity on the crack tip field. Crack bifurcation behaviour is also discussed. The paper points out that use of an appropriate fracture criterion is essential for studying the stability of a moving crack in nonhomogeneous materials. The prediction whether the unstable crack growth will be enhanced or retarded is strongly dependent on the type of the fracture criterion used. Based on the analysis, it seems that the maximum 'anti-plane shear' stress around the crack tip is a suitable failure criterion for moving cracks in nonhomogeneous materials.     

An Interface Crack for a Functionally Graded Strip Sandwiched Between Two Homogeneous Layers of Finite Thickness

In this paper, the behavior of an interface crack for a functionally graded strip sandwiched between two homogeneous layers of finite thickness subjected to an uniform tension is resolved using a somewhat different approach, named the Schmidt method. The Fourier transform technique is applied and a mixed boundary value problem is reduced to two pairs of dual integral equations in which the unknown variables are the jumps of the displacements across the crack surface. To solve the dual integral equations, the jumps of the displacements across the crack surfaces are expanded in a series of Jacobi polynomials. This process is quite different from those adopted in previous works. Numerical examples are provided to show the effects of the crack length, the thickness of the material layer and the materials constants upon the stress intensity factor of the cracks. It can be obtained that the results of the present paper are the same as ones of the same problem that was solved by the singular integral equation method. As a special case, when the material properties are not continuous through the crack line, an approximate solution of the interface crack problem is also given under the assumption that the effect of the crack surface interference very near the crack tips is negligible. Contrary to the previous solution of the interface crack, it is found that the stress singularities of the present interface crack solution are the same as ones of the ordinary crack in homogenous materials.     

Antiplane crack at the interface of two bonded dissimilar graded piezoelectric materials

The problem of an antiplane crack situated in the interface of two bonded dissimilar graded piezoelectric half-spaces is considered under the permeable crack assumption. The mechanical and electrical properties of the half-spaces are considered for a class of functional forms for which the equilibrium equation has analytic solutions. By using an integral transform technique, the problem is reduced to dual integral equations which are transformed into a Fredholm integral equation by introducing an auxiliary function. The stress intensity factors are obtained in explicit form in terms of auxiliary functions. By solving the Fredholm integral equation numerically, the numerical results for stress intensity factors are obtained which have been displayed graphically to show the influence of the graded piezoelectric materials.     

黏弹性体界面裂纹的冲击响应

研究两半无限大黏弹性体界面Griffith裂纹在反平面剪切突出载荷下,裂纹尖端动应力强度因子的时间响应,首先,运用积分变换方法将黏弹性混合黑社会问题化成变换域上的对偶积分方程,通过引入裂纹位错密度函数进一步化成Cauchy型奇异积分方程,运用分片连续函数法数值求解奇异积分方程,得到变换域内的动应力强度因子,再用Laplace积分变换数值反演方法,将变换域的解反演到时间域内,最终求得动应力强度因子的时间响应,并对黏弹性参数的影响进行分析。     

一种基于直接计算高阶奇异积分的断裂力学双边界积分方程分析法

相对于有限元法,边界单元法在求解断裂问题上有着独特的优势,现有的边界单元法中主要有子区域法和双边界积分方程法.采用一种改进的双边界积分方程法求解二维、三维断裂问题的应力强度因子,对非裂纹边界采用传统的位移边界积分方程,只需对裂纹面中的一面采用面力边界积分方程,并以裂纹间断位移为未知量直接用于计算应力强度因子.采用一种高阶奇异积分的直接法计算面力边界积分方程中的超强奇异积分;对于裂纹尖端单元,提供了三种不同形式的间断位移插值函数,采用两点公式计算应力强度因子.给出了多个具体的算例,与现存的精确解或参考解对比,可得到高精度的计算结果.      

Convolution of the impact three-dimensional elasto-dynamics and dynamic stress intensity factor for an elliptic cracks

This paper presents a formulation for three-dimensional elastodynamics with an elliptic crack based on the Laplace and Fourier transforms and the convolution theorem. The dynamic stress intensity factor for the crack is determined by solving a Fredholm integral equation of the first kind. The results of this paper are very close to those given by the two-dimensional dual integral equation method. The project supported by the National Natural Science Foundation of China (K19672007)     

Griffith crack moving in a piezoelectric strip

Summary  The dynamic problem of an impermeable crack of constant length 2a propagating along a piezoelectric ceramic strip is considered under the action of uniform anti-plane shear stress and uniform electric field. The integral transform technique is employed to reduce the mixed-boundary-value problem to a singular integral equation. For the case of a crack moving in the mid-plane, explicit analytic expressions for the electroelastic field and the field intensity factors are obtained, while for an eccentric crack moving along a piezoelectric strip, numerical results are determined via the Lobatto–Chebyshev collocation method for solving a resulting singular integral equation. The results reveal that the electric-displacement intensity factor is independent of the crack velocity, while other field intensity factors depend on the crack velocity when referred to the moving coordinate system. If the crack velocity vanishes, the present results reduce to those for a stationary crack in a piezoelectric strip. In contrast to the results for a stationary crack, applied stress gives rise to a singular electric field and applied electric field results in a singular stress for a moving crack in a piezoelectric strip. Received 14 August 2001; accepted for publication 24 September 2002 The author is indebted to the AAM Reviewers for their helpful suggestions for improving this paper. The work was supported by the National Natural Science Foundation of China under Grant 70272043.     

Moving interfacial crack between piezoelectric ceramic and elastic layers

An analysis is performed for the problem of a finite Griffith crack moving with constant velocity along the interface of a two-layered strip composed of a piezoelectric ceramic and an elastic layers. The combined out-of-plane mechanical and in-plane electrical loads are applied to the strip. Fourier transforms are used to reduce the problem to a pair of dual integral equations, which is then expressed in terms of a Fredholm integral equation of the second kind. The dynamic stress intensity factor(DSIF) is determined, and numerical results show that DSIF depends on the crack length, the ratio of stiffness and thickness, and the magnitude and direction of electrical loads as well as the crack speed. In case that the crack moves along the interface of piezoelectric and elastic half planes, DSIF is independent of the crack speed.