共查询到18条相似文献,搜索用时 171 毫秒
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换能系统是热超声引线键合装备的核心部分,夹持环对系统起安装支撑的作用,其安装方式直接影响换能系统的能量传递与振动模态。利用有限元法分析了夹持环对换能系统振动模态的影响,结果表明,对夹持环未施加约束、施加z向约束时换能系统的夹持环会出现振动现象,而施加x向约束时,工作频率下的主振型完全不符合要求;改变夹持环的安装位置,对换能系统的节点位置及谐振频率都有一定的影响,实验测得在全约束情况下,换能系统的节点位置为58 mm,与分析结果一致;换能系统在工作频率附近包含有其他的振动模态,在键合过程中易被激发出来,由此消耗超声能量而降低芯片的键合质量,这些振动模态必须得到抑制。 相似文献
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为了减小热超声键合换能系统的振动稳定性、提高键合强度,从超声波在热超声键合换能系统中的传播出发,建立了超声波在接触界面处传播的微观模型.研究表明,当静应力较小时,输出的超声波不完整,材料内部质点的有效振动较小;当静应力逐渐增大时,材料进入弹性变形阶段,输出的超声波波形与输入的超声波的波形一致,材料内部质点的有效振动最大;当静应力太大时,材料进入塑性变形区域,材料内部质点的有效振动减小.通过在芯片倒装键合实验台上实验,测量在不同压电陶瓷片预紧力下,变幅杆的振动速度和芯片的键合强度,证明了所提出模型的正确性. 相似文献
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在作为微器件电气互连主要手段的热超声键合工艺中,微细键合区域内金属变形/变性/互连所需的能量,来自于超声波功率源通过换能系统所施加的微幅压剪动载.对热超声倒装键合过程的研究说明,PZT换能系统在热超声倒装键合工艺过程中的非线性动力学行为,如换能系统启动后的初值敏感性和不确定性,键合工具与换能杆之间的不稳定动力耦合,倒装芯片运动的奇异相轨线等,是深入研究键合机理以及提高工艺可靠性的重要关键. 相似文献
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热超声倒装键合过程中的非线性动力学行为 总被引:4,自引:0,他引:4
在作为微器件电气互连主要手段的热超声键合工艺中,微细键合区域内金属变形/变性/互连所需的能量,来自于超声波功率源通过换能系统所施加的微幅压剪动载.对热超声倒装键合过程的研究说明,PZT换能系统在热超声倒装键合工艺过程中的非线性动力学行为,如换能系统启动后的初值敏感性和不确定性,键合工具与换能杆之间的不稳定动力耦合,倒装芯片运动的奇异相轨线等,是深入研究键合机理以及提高工艺可靠性的重要关键. 相似文献
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芯片键合换能系统中接触界面的影响分析 总被引:1,自引:1,他引:0
接触界面对超声能量传递与振动特性的影响是各类压电换能器的共性问题。在超声芯片封装领域,各子部分之间的接触界面是影响系统超声能量传递的强非线性因素,直接影响芯片与基板的键合质量。该文通过有限元法与激光多谱勒测振仪等技术,获得系统中接触界面对超声能量传递与振动特性的影响规律,发现不合理的接触界面会引发系统多模态与频率混叠效应、超声能量输出不稳定、系统迟滞响应等,导致键合强度下降、芯片与基板倾斜、键合效率下降等封装缺陷。研究结果对理解超声键合与系统设计具有指导意义。 相似文献
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在热超声引线键合过程中,低功率设置和低温下容易导致欠键合,高功率设置和高温下则容易出现过键合。通过实验采集了不同超声功率设置、不同温度下大量键合过程中换能杆末端轴向的速度信号、换能杆两端驱动电压和电流信号,并测量其键合强度,计算得到不同温度下换能杆的振幅。分析了超声功率和键合温度对振幅的影响规律,解释了功率设置和键合温度导致欠键合和过键合的可能原因,建立了功率设置和温度对换能杆振幅影响的模型。这些实验数据和结果有助于进一步研究键合过程中参数间的相互影响规律。 相似文献
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《Components and Packaging Technologies, IEEE Transactions on》2009,32(2):261-267
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超声换能器是微电子封装技术的核心执行元件,为解决传统一维纵振超声换能器键合效率低、键合面不均匀及键合点不牢靠等问题,采用ANSYS仿真软件建立换能器有限元模型进行模态分析及谐响应分析,设计了一种可同时实现轴向纵振、水平弯振及竖直俯仰振动的40 kHz多向复合夹心压电式超声换能器。其中,压电部分由整圆环和可单独激励的1/4圆环陶瓷片组成。利用阻抗分析仪实物测试,得到换能器纵振、弯振及俯仰振动的阻抗 频率特性曲线。结果表明,测试值与仿真值基本一致,且结构性能参数均符合键合要求,验证了该结构的合理性。 相似文献
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《Components and Packaging Technologies, IEEE Transactions on》2002,25(3):486-494
A high frequency ultrasonic transducer for wire bonding is conceived, designed, prototyped, tested and industrially produced. The influence of each feature of the ultrasonic transducer design, such as constituent material, amplifier geometry, mounting flange, capillary fixing, on the wire bonding process results is clearly identified and carefully analyzed through thorough process tests. The assembly and aging characteristics of the transducers are measured and the scattering of the vibration properties in the mass production is statistically quantified by laser interferometer measurements and compared with that of conventional horns. The transducer is mounted on the wire bonder with a flange whose special geometry is calculated by means of FEM simulations and patented. This flange allows the mechanical stiffness of the coupling transducer-wire bonder to be dramatically increased and the parasitic mechanical dynamical vibrations at the horn tip to be significantly reduced. Process tests show that the reduction in mechanical vibrations obtained in this way allows a wire bonder scarcely capable normally to attain the 80 /spl mu/m fine pitch process, to perform easily the 60 /spl mu/m fine pitch process. A beneficial impact of the mechanical coupling horn-wire bonder on the process performance is ascertained. The use of titanium as horn material, characterized by a low thermal expansion coefficient, is proven by process tests to be effective in improving the placement accuracy of the wire bonder. The high vibration frequency of the transducer (125 kHz) is proven by process tests to be effective in improving the ball roundness and the fine pitch wire bonding capabilities of the wire bonder and in decreasing the minimum wire bonding temperature and the applied bond force. The new approach to characterize the process performance of new ultrasonic transducer designs is of general importance for wire bonding technology. 相似文献
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超声键合换能系统中劈刀的振动特性分析 总被引:1,自引:0,他引:1
阐述了Lyapunov指数作为振动信号的混沌判断原理,并对换能系统的振动信号进行分析与研究,计算了换能系统在不同加载压力下劈刀的振动时间序列的Lyapunov指数.结果表明振动信号中的最大Lyapunov指数均大于0,根据混沌理论可以判定换能系统振动信号中存在混沌现象,应该采用混沌的方法研究与分析换能系统振动信号.通过不同加载压力下的振动速度信号的RMS值与最大Lyapunov指数的比较,发现两者随压力变化趋势相同,为进一步研究超声引线键合换能系统的振动特性提供了有价值的参考. 相似文献
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电力支柱瓷绝缘子超声波检测对预防和检测绝缘子裂纹和断裂起到重要作用,换能器是超声波检测的基础元件,而换能器的核心部件是压电陶瓷晶片,其性能直接影响到检测结果。该文研究针对有限元法和传统解析法在压电陶瓷晶片特性分析中的不足,采用ANSYS有限元分析软件对压电陶瓷锆钛酸铝(PZT)晶片进行特性分析,基于ANSYS的电-结构耦合场模型,对超声波换能器的矩形压电晶片进行静态、模态、谐响应和瞬态分析。通过模态分析和谐响应分析可得到晶片的一阶纵向振动和二阶弯曲振动的固有频率、振型及频率位移响应及影响因素等信息,研究结果对提高超声辐射功率及超声换能器的性能有一定的理论指导和工程应用价值。 相似文献
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Kiwon Lee Hyoung-Joon Kim Myung-Jin Yim Kyung-Wook Paik 《Electronics Packaging Manufacturing, IEEE Transactions on》2009,32(4):241-247
In this paper, a novel anisotropic conductive film (ACF) flip chip bonding method using ultrasonic vibration for flip chip interconnection is demonstrated. The curing and bonding behaviors of ACFs by ultrasonic vibration were investigated using a 40-kHz ultrasonic bonder with longitudinal vibration. In situ temperature of the ACF layer during ultrasonic (U/S) bonding was measured to investigate the effects of substrate materials and substrate temperature. Curing of the ACFs by ultrasonic vibration was investigated by dynamic scanning calorimetry (DSC) analysis in comparison with isothermal curing. Die adhesion strength of U/S-bonded specimens was compared with that of thermo-compression (T/C) bonded specimens. The temperature of the ACF layer during U/S bonding was significantly affected by the type of substrate materials rather than by the substrate heating temperature. With room the temperature U/S bonding process, the temperature of the ACF layer increased up to 300degC within 2 s on FR-4 substrates and 250degC within 4 s on glass substrates. ACFs were fully cured within 3 s by ultrasonic vibration, because the ACF temperature exceeded 300degC within 3 s. Die adhesion strengths of U/S-bonded specimens were as high as those of T/C bonded specimens both on FR-4 and glass substrates. In summary, U/S bonding of ACF significantly reduces the ACF bonding times to several seconds, and also makes bonding possible at room temperature compared with T/C bonding which requires tens of seconds for bonding time and a bonding temperature of more than 180degC. 相似文献
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《Advanced Packaging, IEEE Transactions on》2008,31(3):442-446