3C-SiC薄膜反向外延生长工艺的研究

本文采用低压化学气相淀积(LPCVD)技术,以甲烷CH4作为反应碳气体源,氢气H2作为稀释气体,将两者混合后,在n型Si(111)衬底上反向外延生长n型3C-SiC薄膜。采用X射线衍射(XRD)、拉曼光谱(RAM)及扫描电子显微镜(SEM)对生长的3C-SiC薄膜进行测试和分析。对比在相同的反应温度下,不同的热处理方式对生长的3C-SiC薄膜质量的影响,进一步探讨SiC薄膜反向外延生长工艺的改进方法。结果表明,较慢的降温速率能够生长出质量较高的3C-SiC薄膜。     

反向外延生长3C-SiC薄膜中残余应力的工艺优化

本文为改善反向外延生长3C-SiC薄膜中残余应力的工艺优化方法,采用LPCVD技术,将甲烷和氢气按1∶10比例混合后与n-Si(111)衬底反应,制备3C-SiC薄膜。通过X射线衍射分析仪、激光拉曼光谱仪和场发射扫描电子显微镜进行测试和分析。在该方法中,反应恒温1200℃为最优温度,反应温度过高或过低都不利于3C-SiC薄膜生长;在反应温度为1200℃时,为增加薄膜厚度而单纯增加反应时长,缺陷浓度也会相应地增加,从而薄膜结晶质量相应降低;但在1250℃反应温度时,增加反应时长不仅会增加薄膜的厚度,而且也会缓减薄膜中残余应力,同时改善薄膜的结晶质量。另外研究结果还表明:1250℃时经过一个恒温的等时退火工艺后,再降温的方式可进一步降低薄膜中本征残余应力,从而改善薄膜的结晶质量和晶格失配。     

SOI基3C-SiC薄膜的光谱表征

本文探索在SOI基片上通过顶层Si直接与碳源反应,反向外延生长3C-SiC薄膜的工艺条件和技术。采用LPCVD技术,以CH4和H2混合气体为反应源,在SOI衬底上生长3C-SiC薄膜。采用X射线衍射分析仪、场发射扫描电子显微镜和傅里叶红外光谱来研究样品的结构和性质;并研究反应前、后样品电压-电容特性的变化。研究结果表明,通过反向外延的方法,能够在SOI基片反向外延生长得到3C-SiC薄膜,但目前的工艺条件有待进一步的改善。     

Si(100)和蓝宝石(0001)衬底上3C-SiC的Raman研究

单晶Si和蓝宝石(0001)是两种重要的3C-SiC异质外延衬底材料，然而，由于Si及蓝宝石和3C-SiC之间大的晶格失配度和热膨胀系数失配度，在3C-SiC中会产生很大的内应力，直接影响3C-SiC的电学特性。Raman散射测试是一个功能很强的测试方法，其强度、宽度、Raman位移等有关Raman参数可以给出有关SiC晶体质量的信息，其中包括内应力。利用背散射几何构置的Raman方法研究了Si(100)和蓝宝石(0001)村底上LPCVD方法生长的SiC外延薄膜，在生长的所有样品中均观察到了典型的3C-SiC的TO和LO声子峰，在3C-SiC／Si材料中，这两个声子峰分别位于970．3cm-l和796．0cm-1，在3C-SiC／蓝宝石材料中，分别位于965．1cm^-1和801．2cm-1，这一结果表明这两种外延材料均为3C-SiC晶型。利用一个3C-SiC自由膜作为无应力标准样品,并根据3C-SiC／Si和3C-SiC／蓝宝石的TO和LO声子峰Raman位移相对于自由膜的移动量，得到3C-SiC中的内应力约分别为1GPa和4GPa。实验发现在这两种材料的TO声子峰的Raman位移移动方向相反，通过比较3C-SiC、Si和蓝宝石的热膨胀系数，预期Si衬底上的3C-SiC外延膜受到的应力为张应力，而蓝宝石衬底上3C-SiC受到的应力则为压应力。     

基于CVD方法生长在硅基底上立方碳化硅的拉曼散射研究（英文）

立方碳化硅(3C-SiC)薄膜通过化学气相沉积(CVD)制备在Si(100)衬底上。本论文主要通过椭偏光谱仪(SE)和拉曼散射仪对3C-SiC薄膜的微观结构和光学性能进行进一步的研究。根据SE的分析获得3CSiC薄膜厚度;根据拉曼散射的分析:可从TO模式和LO模式的线形形状的拟合得到样品的相关长度和载流子浓度。结果表明:该碳化硅(3C-SiC)薄膜质量随膜厚度增加而得到提高,同时分析了外延层厚度对薄膜特性的影响。     

反应溅射氧化锌薄膜的结构特点及性质

以金属Zn(纯度为99.99%)作为靶材,采用离子束反应溅射法在玻璃衬底上溅射沉积了一系列ZnO薄膜样品。通过对薄膜样品X射线衍射(XRD)谱的分析,发现尽管溅射条件不同,但是ZnO薄膜只沿(0002)晶面取向生长。衬底温度和溅射气体的氧分压对薄膜沿c轴取向生长有影响,其中衬底温度的影响较明显。溅射过程中发现衬底温度为360℃最适合(0002)晶面的生长,在此温度下溅射获得了完全沿c轴取向生长且衍射峰最强的ZnO薄膜。室温下测量了ZnO薄膜的发射光谱,发现薄膜在紫外区(364nm附近)、蓝绿区(470nm附近)有较强的发光峰,在紫光区(398nm附近)、蓝光区(452nm附近)和红外区(722nm附近)有较弱的发光峰。ZnO薄膜在空气中退火,对薄膜的结构、发光和电学性质都有一定影响。合适的退火温度可以促进薄膜沿c轴的取向生长;退火后ZnO多晶薄膜的晶粒比未退火的略大;退火使部分发光峰的位置发生偏移并使薄膜的发光强度增强;退火使薄膜的电阻率显著增大,薄膜的电阻率随氧分压的增大而增大。     

一种新型硅基3C-SiC的生长方法及光谱学表征

采用LPCVD技术, 以CH4和H2混合气体为反应源气, 在n-Si（111）衬底上生长3C-SiC晶体薄膜。H2在反应过程中作为稀释气体和运输气体, CH4作为碳源, 硅源有衬底硅来提供。利用X射线衍射分析仪、场发射扫描电子显微镜、激光拉曼光谱和傅里叶变换红外光谱分别研究3C-SiC薄膜的晶相结构、表面形貌及其光谱性质。结果表明此生长方法可以成功的成长出3C-SiC薄膜。     

退火处理对YMnO3薄膜的结构和荧光性能的影响

室温下,采用脉冲激光沉积方法在Si(100)衬底上制备了YMnO3薄膜,并对其进行了不同温度的退火处理。采用X射线衍射和荧光光谱分析方法对薄膜的结构和荧光特性进行了研究。结果表明:通过退火处理,可以得到正交相和六方相共存的多晶态YMnO3薄膜,并且随着退火温度的升高,两相的比例发生变化,由正交相为主转变为六方相为主。YMnO3薄膜样品的荧光发射峰集中在波长430～620nm范围内,可能是由Mn3 离子从5T2到5E之间的能级跃迁所引起的。其荧光强度随着退火温度的升高逐渐增强,但峰位基本保持不变,说明薄膜结构的改变对Mn3 离子的能级跃迁几率有明显的影响,对能级位置的影响不大;而且荧光光谱还显示在同一薄膜中各个荧光峰的相对强度随着退火温度的变化不大。     

柔性ITO衬底电化学沉积制备Cu/Cu2O薄膜

研究了使用电化学沉积法于碱性条件下在柔性ITO衬底上制备Cu/Cu₂O薄膜的方法。循环伏安曲线表明Cu₂O与Cu的阴极峰分别位于-500 mV(vs Ag/AgCl)和-800 mV(vs Ag/AgCl)附近。利用循环伏安法考察了生长温度和电解液pH值等对Cu₂O与Cu阴极峰电位的影响,阴极峰随生长温度的升高以及pH值的降低而略向阳极移动,沉积电流也随之相应增大。与弱酸性条件相比,上述两个阴极峰随pH值升高而移动的程度明显减小,这可能与碱性条件下C₃H₆O电离程度增大以及C₃H₆O根作为配体的过量程度有关。通过X射线衍射光谱和扫描电子显微镜的表征证实,在所研究的生长温度区间和pH值内可利用电化学沉积法在柔性ITO衬底上制备Cu/Cu₂O纳米混晶薄膜。在相同的生长温度和pH条件下,电化学沉积电位对样品表面形貌和晶体性质具有较大影响。     

SiH2Cl2-NH3配比对a-SiNx:H薄膜PL峰的影响

低压化学气相沉积制备的纳米硅镶嵌结构的a-SiNx：H薄膜,在3．75eV的激光激发下,室温下发射1～3个高强度的可见荧光。在相同的沉积温度下（900℃）,选择不同的SiH2Cl2和NH3气体配比时,所得薄膜表现出不同的荧光属性,荧光峰的峰位和数目有着显著的变化。通过TEM、IR、XPS等分析手段对其原因进行了研究分析,认为不同配比下,生成的薄膜中缺陷态的种类和密度有所不同,这影响了其PL峰个数及其各峰的相对强弱。     

Electron beam-physical vapor deposition of SiC/SiO2 high emissivity thin film

When heated by high-energy electron beam (EB), SiC can decompose into C and Si vapor. Subsequently, Si vapor reacts with metal oxide thin film on substrate surface and formats dense SiO₂ thin film at high substrate temperature. By means of the two reactions, SiC/SiO₂ composite thin film was prepared on the pre-oxidized 316 stainless steel (SS) substrate by electron beam-physical vapor deposition (EB-PVD) only using β-SiC target at 1000 °C. The thin film was examined by energy dispersive spectroscopy (EDS), grazing incidence X-ray asymmetry diffraction (GIAXD), scanning electron microscopy (SEM), atomic force microscopy (AFM), backscattered electron image (BSE), electron probe microanalysis (EPMA), X-ray photoelectron spectroscopy (XPS) and Fourier transformed infra-red (FT-IR) spectroscopy. The analysis results show that the thin film is mainly composed of imperfect nano-crystalline phases of 3C-SiC and SiO₂, especially, SiO₂ phase is nearly amorphous. Moreover, the smooth and dense thin film surface consists of nano-sized particles, and the interface between SiC/SiO₂ composite thin film and SS substrate is perfect. At last, the emissivity of SS substrate is improved by the SiC/SiO₂ composite thin film.     

Comparison of ZnO thin films grown on a polycrystalline 3C-SiC buffer layer by RF magnetron sputtering and a sol-gel method

Zinc oxide (ZnO) thin films were deposited on a polycrystalline (poly) 3C-SiC buffer layer using RF magnetron sputtering and a sol-gel method. The post-deposition annealing was performed on ZnO thin films prepared using both methods. The formation of ZnO piezoelectric thin films with less residual stress was due to a close lattice mismatch of the ZnO and SiC layers as obtained by the sputtering method. Nanocrystalline, porous ZnO film prepared using the sol-gel method showed strong ultraviolet UV emission at a wavelength of 380 nm. The 3C-SiC buffer layer improved the optical and piezoelectric properties of the ZnO film produced by the two deposition methods. Moreover, the different structures of the ZnO films on the 3C-SiC intermediate layer caused by the different deposition techniques were also considered and discussed.     

Fabrication and characteristics of a surface acoustic wave UV sensor based on ZnO thin films grown on a polycrystalline 3C-SiC buffer layer

Zinc oxide (ZnO) thin films were deposited onto a polycrystalline (poly) 3C-SiC buffer layer for surface acoustic wave (SAW) ultraviolet (UV) sensing using a magnetron sputtering system. X-ray diffraction (XRD) and photoluminescence (PL) spectra showed that the ZnO film grown on 3C-SiC/Si had a dominant c-axis orientation, a lower residual stress, and higher intensity of luminescence at 380 nm of ZnO thin film. The SAW resonator UV detector were fabricated on ZnO/Si structures with a 3C-SiC buffer layer. The SAW resonator exposed under UV illumination had a linear response with sensitivity of 85 Hz/(μW/cm²) in ZnO/3C-SiC/Si structures, as compared to 25 Hz/(μW/cm²) in ZnO/Si structures with UV intensity varied until 600 μW/cm².     

Influence of deposition conditions on nanostructured InSe thin films

In this study, nanostructured indium selenide (InSe) thin films were deposited on Indium tin oxide (ITO)-coated glass substrate using electrochemical deposition (ECD) from aqueous solution containing In(SO₄)₃.H₂O and SeO₂. The effects of deposition potential (−0.70 to −1.35 V), time (30-3600 s), temperature (25-80 °C) and pH (2.58 for A samples; 2 for B samples and 1.45 for C samples) on growth of the InSe thin films were examined in terms of their structural, morphological and optical properties. X-ray diffraction (XRD) analysis confirmed that the InSe thin films are in polycrystalline structure. It was found that the values of grain size decreased and the full width half maximum (FWHM) values increased with the increasing deposition potential. According to the absorption measurements, optical properties of the thin films varied with changes in deposition conditions. Based on the atomic force microscopy (AFM) and the scanning electron microscopy (SEM) images, surface morphology of the thin films was influenced by deposition potential and pH of the electrolyte, and non-homogeneous depositions distributed across the entire surface were observed. In addition, Raman spectroscopy, X-ray photoelectron spectroscopy (XPS) and fourier transform infrared spectroscopy (FT-IR) analyses were used to further examine crystal quality, vibration, chemical binding conditions, In/Se orientation and structure of the prepared InSe thin films. When Raman results are examined, the B12 sample shows a more intensity and narrow peak at 248 cm⁻¹. XPS measurements sowed that A6 sample exhibited more growth in low potential for a long time and better film stoichiometry compared to the other three samples. Also, FT-IR studies prove the presence of InSe. According to the results, the film did not form at low temperatures and short times. However, the film formation began with the increasing deposition temperature and time at the low potential value of −0.730 V. But, it is clear that a high quality film can be obtained in cathodic potential with −1.3 V and shorter deposition time with 300 s at room temperature respectively. Overall results showed that the high quality thin films can be obtained by the ECD technique. However, deposition conditions must be sensitively adjusted to control morphology of the electrodeposited nanoparticles.     

3C-SiC Heteroepitaxial Growth on Silicon: The Quest for Holy Grail

For a long time now, 3C-SiC has attracted attention of the semiconductor community due to its very interesting properties. The lack of commercial 3C-SiC seeds for epitaxy has forced researchers to prospect for different host materials in order to grow heteroepitaxial thin layers. Because of the obvious economical and technical advantages, silicon is a very attractive substrate so that more than 90% of the thin 3C-SiC heteroepitaxial films are grown on such seed. However, the obstacles to overcome, mainly lattice and thermal mismatch, are challenging. This article reviews the numerous attempts for growing high quality 3C-SiC heteroepitaxial layers on silicon substrate. The various aspects of the heteroepitaxial growth, from substrate carbonization to epitaxy, are discussed as a function of growth parameters. The difficulties encountered and the proposed solutions are described. Perspectives of this heteroepitaxial system are proposed.     

Monte Carlo study of the hetero-polytypical growth of cubic on hexagonal silicon carbide polytypes

In this article we use three dimensional kinetic Monte Carlo simulations on super-lattices to study the hetero-polytypical growth of cubic silicon carbide polytype (3C-SiC) on misoriented hexagonal (4H and 6H) substrates. We analyze the quality of the 3C-SiC film varying the polytype, the miscut angle and the initial surface morphology of the substrate. We find that the use of 6H misoriented (4°–10° off) substrates, with step bunched surfaces, can strongly improve the quality of the cubic epitaxial film whereas the 3C/4H growth is affected by the generation of dislocations, due to the incommensurable periodicity of the 3C (3) and the 4H (4) polytypes. For these reasons, a proper pre-growth treatment of 6H misoriented substrates can be the key for the growth of high quality, twin free, 3C-SiC films.     

“Temperature oscillation” as a real-time monitoring of the growth of 3C-SiC on Si substrate

Pyrometric interferometry has been observed during gas-source molecular beam epitaxy (GSMBE) of 3C-SiC on Si substrate using monomethyl silane. The period of the “temperature oscillation” is shown to correspond to λ/2n, with the λ and n being the wavelength used in the monochromatic optical pyrometry and the refractive index of the grown film, respectively. As is the case for other heteroepitaxies, pyrometric interferometry may provide a feasible real-time monitoring method for the growth of 3C-SiC film on Si substrates.     

Measurement of the elastic constants of a columnar SiC thin film

The technique of resonant ultrasound spectroscopy was used to measure the elastic properties of a polycrystalline cubic silicon carbide (3C-SiC) thin film. The film, grown on a silicon (100) substrate, was 1.69 microns thick with columnar crystalline grains and a (111) texture. The substrate with the film was placed between two transducers and the resonant frequencies were measured; measurements were repeated after selective, timed dry etching of the film, allowing a determination of the elastic constants of the film alone. The film elastic constants, c(11)=371 and c(12)=146 GPa, were within a few percent of the literature values (c(11)=386, c(12)=136 GPa) of crystalline 3C-SiC. However, the film elastic constant c(44), 111 GPa, was significantly smaller than the bulk literature value, 254 GPa. For the film, c44 approximately (c(11)-c(12))/2, indicating that, quite unlike a bulk 3C-SiC crystal, the thin film is elastically isotropic.     

Direct formation of graphene layers on top of SiC during the carburization of Si substrate

We grow graphene film on silicon substrates having various orientations by simple heating in the presence of carbon source gas. We observed that a 3C-SiC (111) film would form upon carburizing silicon with carbon deposited from a carbon source because it is well lattice-matched with Si (110) (less than 2%). Graphene grew on the buffer layer of 3C-SiC (111). The surface consists of hexagonal arrays that can act as a template for graphene growth. This simple and inexpensive method of forming graphene on silicon wafer in situ is compatible with silicon technology.