Effect of some service conditions on the electrical resistivity of conductive styrene–butadiene rubber–carbon black composites

Conductive polymer composites were prepared using vulcanized styrene–butadiene rubber as a matrix and conductive carbon black as a filler. The filler loading was varied from 10 to 60 phr. The volume resistivity was measured against the loading of the carbon black to verify the percolation limit. The electrical conductivity of filled polymer composites is attributed to the formation of some continuous conductive networks in the polymer matrix. These conductive networks involve specific arrangements of conductive elements (carbon black aggregates) so that the electrical paths are formed for free movement of electrons. The effects of temperature and pressure on the volume resistivity of the composites were studied. The volume resistivity of all the composites increased with increase in temperature, and the rate of increase in the resistivity against temperature depended on the loading of carbon black. The change in volume resistivity during the heating and cooling cycle did not follow the same route, leading to the phenomena of electrical hysteresis and electrical set. It was found that the composites with 40 and 60 phr carbon black become more conductive after undergoing the heat treatment. Generally, all the composites showed a positive temperature coefficient of resistivity. The volume resistivity of all the composites decreased with increase in pressure. The relaxation characteristic of the volume resistivity of the composites was studied with respect to time under a constant load. It was found that the volume resistivity of the compressed specimen of the composites decreased exponentially with time. It was observed that initially a faster relaxation process and later a slower relaxation process occurred in these composites. Some mechanical properties of these composites were also measured to confirm the efficacy of these composites for practical applications. © 2004 Wiley Periodicals, Inc. J Appl Polym Sci 92: 2179–2188, 2004     

Influence of compatibilizer on notched impact strength and fractography of HDPE–organoclay composites

The focus of this study was the notched impact property of high‐density polyethylene (HDPE)–organoclay composites and the resultant morphology of impact‐fractured surfaces. Composites with a different organoclay content and degree of organoclay dispersion were compared with neat HDPE under identical conditions. The degree of organoclay dispersion was controlled through the use of a compatibilizer, maleic anhydride grafted polyethylene. It was found that the addition of organoclay can slightly increase the elastic modulus and notched impact strength of the composite. When the level of organoclay dispersion was improved by using compatibilizer, elastic modulus and toughness further increased. A significant increase in yield strength was also notable. The presence of organoclay was found to suppress strain hardening of the matrix during tensile testing. The impact‐fractured surfaces of failed specimens were studied with scanning electron microscopy. The micromechanism for the increased toughness of HDPE–organoclay composites was discussed. © 2009 Wiley Periodicals, Inc. J Appl Polym Sci, 2009     

Effect of processing on the positive temperature coefficient of resistivity in lead metaplumbate/polyethylene composites

The positive temperature coefficient of resistivity (PTCR) effect of a barium metaplumbate/polyethylene [(BaPbO₃)/PE] composite with 12 vol% of BaPbO₃ was studied. The composite samples were prepared by hot-pressing a mixture of BaPbO₃ ceramic and high-density polyethylene powders around the melting point of polyethylene. The composites exhibit a pronounced PTCR effect of up to a six-decade increase in resistivity within a narrow range of temperature (∼10°C). The dependences of the room temperature resistivity and the magnitude of the resistivity jump on the pressing and annealing temperature, and the electrical behavior after repeated heating-cooling cycles were investigated. The fracture surfaces of the composite samples were examined in a scanning electron microscope in order to correlate the electrical behavior with the microstructure.     

PTCR characteristics of poly(styrene‐co‐acrylonitrile) copolymer/stainless steel powder composites

Positive temperature coefficient of resistivity (PTCR) characteristics of poly(styrene‐co‐acrylonitrile) copolymer (SAN)/stainless steel (SS) powder (80 wt %) composites prepared by melt‐mixing method has been investigated with reference to SAN/carbon black (CB) composites. The SAN/CB (10 wt %) composites showed a sudden rise in resistivity (PTC trip) at 125°C, above the glass transition temperature (T_g) of SAN (T_g ≈ 107°C). However, the PTC trip temperature of SAN/SS (80 wt %) composites appeared at 94°C, well below the T_g of SAN. Addition of 1 phr of nanoclay increased the PTC trip temperature of SAN/CB (10 wt %) composites to 130°C, while SAN/SS (80 wt %)/clay (1 phr) nanocomposites showed the PTC trip at 101°C. We proposed that the mismatch in coefficient of thermal expansion (CTE) between SAN and SS played a key role that led to a disruption in continuous network structure of SS even at a temperature below the T_g of SAN. The dielectric properties study of SAN/SS (80 wt %) composites indicated possible use of the PTC composites as dielectric material. DMA results showed higher storage modulus of SAN/SS composites than the SAN/CB composites. © 2011 Wiley Periodicals, Inc. J Appl Polym Sci, 2012     

Effects of filler–filler and polymer–filler interactions on rheological and mechanical properties of HDPE–wood composites

High‐density polyethylene (HDPE)–wood composite samples were prepared using a twin‐screw extruder. Improved filler–filler interaction was achieved by increasing the wood content, whereas improved polymer–filler interaction was obtained by adding the compatibilizer and increasing the melt index of HDPE, respectively. Then, effects of filler–filler and polymer–filler interactions on dynamic rheological and mechanical properties of the composites were investigated. The results demonstrated that enhanced filler–filler interaction induced the agglomeration of wood particles, which increased the storage modulus and complex viscosity of composites and decreased their tensile strength, elongation at break, and notched impact strength because of the stress concentration. Stronger polymer–filler interaction resulted in higher storage modulus and complex viscosity and increased the tensile and impact strengths due to good stress transfer. The main reasons for the results were analyzed. © 2008 Wiley Periodicals, Inc. J Appl Polym Sci, 2009     

Positive temperature coefficient behavior of polymer composites having a high melting temperature

The positive temperature coefficient (PTC) behavior of polymers having a high melting temperature, such as nylon, polyvinylidene fluoride, polyester, and polyacetal, was investigated. Carbon black and nickel powder were used to investigate the influence of their conductive fillers on PTC intensity. The polymer/filler composite was irradiated with gamma rays at dosages of 50, 100, and 150 kGy for the purpose of reducing the negative temperature coefficient (NTC) of a conductive composite. It was found that the PTC temperature depended on the melting point of the polymer matrix. The crosslinking structure enhanced the electrical stability and decreased the NTC effect of the composites. © 2004 Wiley Periodicals, Inc. J Appl Polym Sci 92: 394–401, 2004     

Measurement of the coefficient of thermal expansion of ultra-high strength cementitious composites using fibre optic sensors

Fibre Bragg Grating (FBG) sensors were embedded into cement mortar and ultra-high strength reactive powder concrete (RPC) prisms. Thermal tests are performed to accurately characterise the coefficient of thermal expansion (CTE) of these prisms using the measured signals from the embedded sensors. With the use of the fibre optic sensors, the difficulties inherent in using conventional techniques, such as strain gauges or vibrating wire gauges, to measure the thermal properties of cementitious materials are overcome. The error values associated with the measurements, typically measured to be as low as ± 0.04 με/K, are a full order of magnitude less than what is expected for standard conventional testing using a length comparator.     

Effects of thermal ageing treatment and antioxidants on the positive temperature coefficient characteristics of carbon black/polyethylene conductive composites

Polyethylene (PE)‐filled with carbon black (CB) is a prototypical composite that displays resistance switching. These materials can exhibit either a positive temperature coefficient (PTC) or negative temperature coefficient (NTC). The CB‐filled semicrystalline polymer composites ideally need antioxidants, which stabilize the composites against thermooxidative degradation, because they should be resistant to the severe conditions of high temperature. The characterization of PTC materials is affected by the crystallinity of the polymer, and the crystallinity of the polymer is changed with thermal ageing treatment. Thermal ageing of PTC samples was conducted in an oven in the range 50–140°C, in air. The composites, containing 0.5–3% (by weight) Irganox 1076 (Ciba‐Geigy), were irradiated under nitrogen at room temperature with different doses of gamma rays from a ⁶⁰Co source. The resulting composites were analyzed by differential scanning calorimetry, gel fractionation, X‐ray diffraction, and dynamic mechanical analysis. The conductivity of the composites depended on the amounts of antioxidants and the duration of the thermal ageing treatment. © 2003 Wiley Periodicals, Inc. J Appl Polym Sci 89: 2316–2322, 2003     

Effect of carbon black and nanoclay on mechanical and thermal properties of ABS–PANI/ABS–PPy blends

Acrylonitrile butadiene styrene (ABS)–polyaniline (PANI) and ABS–polypyrrole (PPy) blends exhibit poor mechanical and thermal properties due to their weak interfacial adhesion and inhomogeneous mixing. The properties have been improved by addition of carbon black (CB) and nanoclay (NC). Composites are prepared by mixing CB and NC with ABS–PANI and ABS–PPY blends. The morphology and crystalline characteristics are studied using field emission scanning electron spectroscopy (FESEM) and X‐ray diffraction, respectively. In addition, all the composites have been analyzed for their mechanical and thermal performance. The tensile strength of ABS–PANI has been increased by 7.18% and 65.83% with addition of CB and a combination of CB–NC, respectively. FESEM images are found supportive with these trends and show homogeneous dispersion of CB in the polymer matrix, assisted by NC. Dynamic mechanical analysis results also show slight improvement of glass transition temperature (T_g) with addition of fillers. © 2015 Wiley Periodicals, Inc. J. Appl. Polym. Sci. 2015 , 132, 42577.     

Effect of nanoclay on positive temperature coefficient to resistivity characteristics of high density polyethylene/silver‐coated glass bead composites

Positive temperature coefficient to resistivity characteristics of high density polyethylene (HDPE)/silver (Ag)‐coated glass bead (45 wt%) composites, without and with nanoclay, has been investigated with reference to HDPE/carbon black (CB) (10 wt%) composites. Plot of resistivity versus temperature of HDPE/CB (10 wt%) composites showed a sudden rise in resistivity (PTC trip) at ≈128°C, close to the melting temperature (T_m) of HDPE. However, for HDPE/Ag coated glass bead (45 wt%) composites, the PTC trip temperature (≈88°C) appeared well below the T_m of HDPE. Addition of 1 phr clay in the composites resulted in an increase in PTC trip temperature of HDPE/Ag‐coated glass bead (45 wt%) composites, whereas no significant effect of clay on PTC trip temperature was evident in HDPE/CB/clay composites. We proposed that the PTC trip temperature in HDPE/Ag‐coated glass bead composites was governed by the difference in coefficient of thermal expansion of HDPE and Ag‐coated glass beads. The room temperature resistivity and PTC trip temperature of HDPE/Ag‐coated glass bead (45 wt%) composites were found to be very stable on thermal cycling. Dynamic mechanical analyzer results showed higher storage modulus of HDPE/Ag‐coated glass bead (45 wt%) composites compared with the HDPE/CB (10 wt%) composites. Thermal stability of HDPE/Ag‐coated glass bead (45 wt%) composites was also improved compared with that of HDPE/CB (10 wt%) composites. POLYM. COMPOS., 2012. © 2012 Society of Plastics Engineers     

SiCNO–GO composites with the negative temperature coefficient of resistance for high‐temperature sensor applications

We report the synthesis of silicon oxycarbonitride ceramic‐graphene oxide (SiCNO–GO) composites by using polyvinylsilazne (PVSZ) and GO as precursors through cross‐linking processes, in which GO organizes into microspheres in the SiCNO matrix. The formation of GO microspheres significantly enhances the electrical conductivity of SiCNO. The electrical resistivity of SiCNO–GO composites shows a negative temperature coefficient in the range from 25°C to 600°C. We demonstrate the application of SiCNO–GO composites as the functional component of high‐temperature sensors.     

Synthesis and characterization of novel borosiloxane‐containing aromatic copolyimides with excellent thermal stability and low coefficient of thermal expansion

The properties of borosiloxane‐containing copolyimides with borosiloxane in the main chain and in the side chain were studied. Two series of borosiloxane‐containing copolyimides were synthesized by the reaction of 3,3′,4,4′‐biphenyltetracarboxylic dianhydride (s‐BPDA ) and 2,3′,3,4′‐biphenyltetracarboxylic dianhydride (a‐BPDA ) with p ‐phenylenediamine (PDA ), 4,4′‐oxydialinine (4,4′‐ODA ) and different borosiloxane diamine monomers (BSiAs ). The synthesized borosiloxane‐containing copolyimides exhibited better solubility than borosiloxane‐free copolyimides and showed high glass transition temperatures (320–360 °C), excellent thermal stability (570–620 °C for T ₁₀), great elongation at break (10% ? 14%) and a low coefficient of thermal expansion (14–24 ppm °C^?1). More specifically, the copolyimides containing BSiA‐2 formed nano‐scale protrusions and the copolyimides containing BSiA‐1 formed micro‐scale protrusions. The contact angles of the copolyimides increased from 72° for neat copolyimide to 96° for 5% of borosiloxane in the main chain of the copolymer up to 107° for 10% of borosiloxane in the side chain of the copolymer. © 2017 Society of Chemical Industry     

Effect of structural changes of silica filler on the coefficient of thermal expansion (CTE) of underfill encapsulant

This study investigates the effect of degree of crystallinity (DC) of silica on the CTE value of epoxy filled silica composite. Various DC of silica was produced through high intensity grinding process in a jet mill by varying the grinding pressure. The ground silica with the DC ranging from 76% to 100% was filled at 45% volume and the CTE values were measured. The obtained results showed that CTE of composite was reduced as the filler's degree of crystallinity decreased.     

In-plane thermal expansion behavior of dense ceramic matrix composites containing SiBC matrix

In order to reveal the effect of matrix cracks resulted from thermal residual stresses (TRS) on the thermal expansion behavior of ceramic matrix composites, SiBC matrix was introduced into C_f/SiC and SiC_f/SiC by liquid silicon infiltration. The TRS in both two composites were enlarged with incorporating SiBC matrix which has higher coefficients of thermal expansion (CTEs) than SiC matrix. Due to the relatively high TRS, matrix cracks and fiber/matrix (f/m) debonding exist in C_f/SiC-SiBC, which would provide the space for the expansion of matrix with higher CTEs. For SiC_f/SiC, no matrix cracking and f/m debonding took place due to the close CTEs between fiber and matrix. Accordingly, with the incorporation of SiBC matrix, the in-plane CTE of C_f/SiC between room temperature to 1100 °C decreases from 3.65 × 10⁻⁶ to 3.19 × 10⁻⁶ K^-1, while the in-plane CTE of SiC_f/SiC between room temperature to 1100 °C increases slightly from 4.97 × 10⁻⁶ to 5.03 × 10⁻⁶ K^-1.     

Influence of the clay modification and compatibilizer on the structure and mechanical properties of ethylene–propylene–diene rubber/montmorillonite composites

Ethylene–propylene–diene rubber (EPDM)/montmorillonite (MMT) composites were prepared through a melt process, and three kinds of surfactants with different ammonium cations were used to modify MMT and affect the morphology of the composites. The morphology of the composites depended on the alkyl ammonium salt length, that is, the hydrophobicity of the organic surfactants. Organophilic montmorillonite (OMMT), modified by octadecyltrimethyl ammonium salt and distearyldimethyl ammonium salt, was intercalated and partially exfoliated in the EPDM matrix, whereas OMMT modified by hexadecyltrimethyl ammonium chloride exhibited a morphology in which OMMT existed as a common filler. Ethylene–propylene–diene rubber grafted with maleic anhydride (MAH‐g‐EPDM) was used as a compatibilizer and greatly affected the dispersion of OMMT. When OMMTs were modified by octadecyltrimethyl ammonium chloride and distearydimethyl ammonium chloride, the EPDM/OMMT/MAH‐g‐EPDM composites (100/15/5) had an exfoliated structure, and they showed good mechanical properties and high dynamic moduli. © 2004 Wiley Periodicals, Inc. J Appl Polym Sci 92: 638–646, 2004     

Negative in-plane CTE of benzimidazole-based polyimide film and its thermal expansion behavior

Non-stretched polyimide films based on 5,4′-diamino-2-phenyl benzimidazole (DAPBI) show curious thermal expansion properties: the in-plane CTE value of PI film is negative when cured at 350 °C (contract upon heating). However, the value of CTE turns positive when cured at 400 °C. In-plane and out-of-plane CTE of PI films annealed at various temperatures have been measured to study the annealing effect on thermal expansion feature. The in-plane CTE value increases from negative to positive as the raise of the annealing temperatures (T_anneal), while the out-of-plane CTE decreases as a function of T_anneal. Morphologies of PI films change from amorphous to semi-crystalline accompanied with the change of in-plane CTE from negative to positive. Mechanism of the thermal expansion behavior of DAPBI-based PI films is proposed: negative in-plane CTE is generated under the combination of the more preferential thermal expansion in the out-of-plane direction and the amorphous structure when the films are cured at lower temperatures; while thermal expansion in the in-plane and out-of-plane directions are both available for semi-crystallized PI films, affording positive in-plane CTE values.     

The influence of EB-crosslinking on barrier properties of HDPE–mica composites

High-density polyethylene (HDPE) was compounded with untreated and surface-treated mica (10, 20, 40 wt %) and composites were injection-molded. The composites were radiation crosslinked (100, 300, 700 kGy) and hydrocarbon permeability, tensile impact strength, and tensile strength at 25 and 80°C of the composites were examined. The permeability of HDPE decreased from 7 to 3.6 g/(d × m²) by compounding the polymer with 20 wt % mica, and the permeability was additionally reduced to 1.3 g/(d × m²) by irradiation of the compounds (700 kGy). When surface-treated mica was used, the permeability of the composite furthermore decreased to about 1.0 g/(d × m²). Upon irradiation, the E modulus measured at 25°C increased 5% when the dose was 300 kGy. At 80°C, the corresponding increase was 40%. The tensile impact strength of an unfilled polymer increased more than three times by an irradiation dose of 700 kGy, and for a polymer with 10 wt % mica, the tensile impact strength was twice the level of an unirradiated composite. © 1996 John Wiley & Sons, Inc.     

Improvement of polyimide/polysulfone composites filled with conductive carbon black as positive temperature coefficient materials

In this study, polyimide (PI)/polysulfone (PSF) blends filled with carbon black (CB) were developed for the use as positive temperature coefficient (PTC) materials in order to achieve the volume resistivity as lower than 10⁴ Ω.cm at room temperature. The weight ratios of PI/PSF were various from 100/0 to 10/90 with CB varied from 0 to 20 wt%. The use of conductive filler was reduced when PSF was blended with PI; the blends clearly possessed a percolation threshold decreased by 90%. The electrical conductivity of the CB-filled blends was higher than those of CB-filled pure PI. The transition temperature for PTC material was reported in the range of 180 to 210 °C. The preferential location of CB filler in PI domains could be observed using the optical microscope. In addition, the composites met the standards for the obtained mechanical and thermal properties, exhibiting the potential use as PTC materials. © 2019 Wiley Periodicals, Inc. J. Appl. Polym. Sci. 2020 , 137, 48482.     

Thermally induced double‐positive temperature coefficients of electrical resistivity in combined conductive filler–doped polymer composites

Polymer composites of low‐density polyethylene/polypropylene/graphite/vanadium dioxide (LDPE_0.8/PP_0.2/Gr_0.4/VO₂) are prepared by classical melt‐mixing technology and show a notable double positive temperature coefficient of electric resistivity (PTC), which originates from the combined effect of highly conductive Gr and VO₂ with a thermal phase transition. When the weight ratio of VO₂ is 8 wt %, the positive temperature coefficient intensity (PTCI) for the composites reaches 3.85 orders of magnitude. The model system demonstrates the reason for the improvement in the PTC performance of the polymer composites by analyzing the construction of the conductive networks. Therefore, the addition of phase‐transition compounds may be a promising path to improving PTC materials. © 2017 Wiley Periodicals, Inc. J. Appl. Polym. Sci. 2017 , 134, 44876.     

The effect of low‐filler volume fraction on the elastic modulus and thermal expansion coefficient of particulate composites simulated by a multiphase model

The aim of this investigation is to determine the effect of low‐filler volume fraction on the elastic modulus and the thermal expansion coefficient of particulate composites. In the theoretical part, theoretical model valid for low‐filler volume fractions is used to evaluate these two magnitudes. In the experimental part, low‐percentage filler contents of 3, 5, 7, and 10% are used. The density for these epoxy resin‐iron particle composites is also determined. At the same time, an attempt to explain some of the disagreements observed between theoretical values and experimental data on a qualitative basis is also made. This attempt is in part assisted by scanning electron microscopy (SEM) observations concerning structural inhomogeneities and fractographical data. The comparison of the theoretical values derived from the present model with experimental results and with theoretical values derived from other workers appears satisfactory in many cases, but in some others the discrepancies among them are considerable. © 2008 Wiley Periodicals, Inc. J Appl Polym Sci, 2009