6H-SiC硅面S钝化工艺研究

采用(NH4)2S溶液钝化SiC的Si面,借助反向I-V特性间接表征钝化效果,得到了SiC表面最佳的钝化参数:钝化温度60 ℃、钝化时间30 min、NH3·H2O浓度为2.4 mol/L、(NH4)2S浓度为0.22 mol/L.XPS测试结果表明钝化后的6H-SiC表面形成了Si-S键,反向饱和I-V特性表明S钝化降低了表面的态密度.实验结果与第一性原理计算结果相吻合.     

SiC陶瓷在钎焊过程中的6H到3C多型相变（英文）

为探究钎焊过程对SiC陶瓷晶体结构的影响，为钎焊工艺设计提供理论及试验数据支撑，本研究采用纯Ni箔作为中间层在1 100～1 245℃下实现了6H-SiC的钎焊连接，并研究了焊缝以及6H-SiC基体与焊缝界面处的微观形貌。研究结果表明，少量Ni原子在钎焊过程中会扩散进入6H-SiC陶瓷，并以固溶形式存在，降低了6H-SiC层错能。随着钎焊温度升高，6H-SiC/焊缝界面处的焊后残余应力增大，当钎焊温度达到1 245℃时，界面处的6H-SiC的(0001)面沿■方向产生滑移，6H-SiC切变形成3C-SiC。因此，SiC陶瓷在钎焊过程中受应力和钎料组成元素的作用发生相变，针对特殊环境使用的SiC陶瓷需要斟酌钎焊工艺对其晶体结构及性能的影响。     

杂质和缺陷对SiC单晶导热性能的影响

目前关于SiC单晶室温的导热性能,以及导热特性随温度的变化方面的研究报道还存在较大的差异,有关SiC单晶热导率的研究主要是沿c轴<0001>晶向或者垂直于c轴的某一晶向进行的,无法有效地解释热导率的各向异性。本文研究了4H-SiC和6H-SiC单晶目前关于SiC单晶室温的导热性能,以及导热特性随温度的变化方面的研究报道还存在较大的差异,有关SiC单晶热导率的研究主要是沿c轴0001晶向或者垂直于c轴的某一晶向进行的,无法有效地解释热导率的各向异性。本文研究了4H-SiC和6H-SiC单晶■,■,0001三个不同晶向上热导率以及其随温度的变化。对SiC单晶切割分别得到沿■,■,0001晶向的样品,尺寸为■12.7 mm×3 mm,利用闪光法对样品测试得到热扩散系数,通过计算获得了SiC单晶不同晶向的热导率数值,采用辉光放电质谱仪(GDMS)和扫描电子显微镜(SEM)进行了杂质和缺陷表征。实验结果表明,SiC晶体■,■,0001三个晶向的热导率随温度升高而下降,沿0001晶向的SiC样品热导率最小;含有较高杂质离子浓度的6H-SiC样品热导率高于4H-SiC样品;缺陷相比杂质对SiC晶体导热性能影响更大,缺陷是SiC热导率具有各向异性的主要原因。     

偏4°4H-SiC同质外延层上新形貌三角形缺陷研究

利用水平热壁CVD方法,基于SiH4-C3 H8-H2生长系统在n型4H-SiC偏4°衬底上进行同质外延生长.通过Nomarski光学显微镜、激光共聚焦显微镜和拉曼散射光谱(Raman),对外延层中的新形貌三角形缺陷——顶端有倒金字塔结构的三角形缺陷(IPRTD)的表面形貌、结构进行了表征,并根据表征结果提出了该新形貌三角形缺陷的产生机理.研究结果表明,IPRTD由3C-SiC晶型构成;在外延生长中,位于IPRTD生长方向上游的位错缺陷所引起的表面吸附原子的2D成核生长是导致3C-SiC晶型出现的主要原因.同时,外延生长过程中,生长速率和氢气刻蚀作用在[1120]和[1100]/[1100]方向上的差异是导致IPRTD顶端具有倒金字塔结构的主要原因.     

SiH4在Si(001)-(2×1)表面吸附的第一性原理研究

用第一性原理密度泛函理论研究SiH4在Si(001)-(2×1)表面的分裂吸附及吸附后的结构、能量和成键特性,计算了反应物、过渡态及生成物三个状态的能量,吸附能和反应能.计算结果表明:SiH4在Si(001)-(2×1)重构表面吸附的可能反应路径是由于SiH4中Si-H键的拉长和二聚体键的断裂导致的,形成产物Si(001)-(2×1)(SiH3:H);由SiH4分裂的能量势垒0.78 eV说明所推测的反应路径是合理的.     

CdZnTe单晶表面原子结构

半导体表面是一个特殊区域,其表面原子结构与体态有很大区别,而且他们对材料的整体性能又起着十分重要的影响.本文通过真空Ar<'+>离子刻蚀并原位退火的办法,获得理想清洁的CdZnTe单晶表面,采用低能电子衍射(LEED)观察了(110)、(111)A面和(111)B面的表面原子结构.发现(110)面为稳定面没有发生重构,而在(111)A面上发现了由空位形成的(31/2×31/2)R 30°重构,在(111)B面上发现了由Te顶戴原子形成的(2×2)重构.     

高质量N型SiC单晶生长及其器件应用

采用物理气相传输法在(0001)面偏向<11-20>方向4°的籽晶上生长了掺氮低电阻率碳化硅(SiC)单晶.结合碳化硅邻位面生长机制,通过优化温场设计,在近平温场下生长出了晶型稳定、微管密度低、高结晶质量的低电阻率4H-SiC单晶.在加工的“epi-ready”SiC衬底上进行了同质外延,获得了光滑的外延层表面.利用该外延材料研制了600V/10 A SiC肖特基二极管,器件的直流性能与进口衬底结果相当,反向漏电成品率高达67;.另外研制了600 V/50 A SiC肖特基二极管,器件的直流性能也达到了进口衬底水平.     

MOVPE生长GaN薄膜的表面吸附和扩散研究

利用量子化学计算方法,对MOVPE生长GaN薄膜的表面反应进行研究.特别针对反应前体GaCH3(简称MMG)在理想、H覆盖和NH2覆盖GaN(0001)面的吸附和扩散进行计算分析.通过建立3×3 超晶胞模型,优化计算了MMG在三种不同覆盖表面的稳定吸附位、吸附能和电子布居,搜寻了MMG在稳定吸附位之间的扩散能垒.计算结果表明:对于三种表面,MMG的稳定吸附位均为T4位和H3位,H3位比T4位略微稳定.MMG在NH2覆盖表面吸附能最大,在H覆盖表面吸附能最小,在理想表面吸附能居中.MMG中的Ga与不同的表面原子形成的化学键的键强的大小顺序为:Ga-N>Ga-Ga>Ga-H.相比于理想表面和H覆盖表面,MMG在NH2覆盖表面的扩散能垒最大,因此表面过量的NH2会抑制MMG的扩散.     

固结磨料研磨SiC晶片亚表面损伤截面显微检测技术

本文对采用截面显微检测法检测SiC晶片亚表面损伤时样品的制备、腐蚀液配方及腐蚀环境进行了系统地研究,并重点分析了固结磨料研磨SiC晶片(0001) Si面和(0001)C面亚表面损伤的深度及微裂纹构型.结果表明,采用腐蚀液配方为KOH:K2CO3 =20 g∶1 g,在420℃下腐蚀3min时亚表面损伤观测效果较好.在研磨压力为2 psi、金刚石磨粒粒径14 μm时,固结磨料研磨SiC晶片的亚表面损伤层深度约为2.6 μn,亚表面微裂纹构型有垂线状、斜线状、钩状、叉状、树枝状、人字状以及横线状.在相同的加工条件下,SiC晶片的(0001) Si面和(0001)C面的损伤深度基本相同.     

Ar气氛下退火处理对6H-SiC晶片表面结构的影响

本文对物理气相传输法生长的三片2英寸掺氮6H-SiC晶片,分别在不同温度下进行退火处理.采用原子力显微镜(AFM)对SiC晶片表面结构进行表征,研究了不同温度和偏角度对SiC晶片表面结构的影响.发现Ar气氛下高温退火处理可以在晶片表面形成规则的台阶条纹,说明Ar气氛下的高温退火处理对SiC晶片表面有一定的刻蚀作用.     

表面预处理对SiO2/Si结构上APCVD生长SiC薄膜的影响

采用S iH4-C3H8-H2气体反应体系在S iO2/S i复合衬底上进行了S iC薄膜的APCVD生长。实验结果表明,H2表面预处理温度过高或时间过长会导致衬底表面S iO2层熔化再结晶或被腐蚀掉。通过“先硅化再碳化”的工艺方法可以较好地解决S iO2/S i复合衬底上S iC成核困难以及粘附性差的问题,同时还可以有效抑制S iO2中的O原子向S iC生长膜扩散。选择预处理温度和薄膜生长温度为1180℃、H2预处理、S iH4硅化和C3H8碳化时间均为30 s的最佳生长条件时,可以得到<111>晶向择优生长的多晶3C-S iC外延薄膜,薄膜生长速率约为2.0~2.5nm/m in.     

MEMS用Si台面及SiO2/Si衬底上3C-SiC的LPCVD生长

本文报道用在Si台面及热氧化SiO2衬底上3C-SiC薄膜的LPCVD生长,反应生长使用的气体为SiH4和C2H4,载气为H2,采用光学显微镜、X射线衍射（XRD）、X射线光电子能谱（XPS）、扫描电镜（SEM）、以及室温Hall测试对所生长的3C—SiC材料进行了测试与分析,结果表明在3C-SiC和SiO2之间没有明显的坑洞形成。     

A model for the growth of anomalous polytype structures in vapour grown SiC

A number of polytype structures observed in vapour grown SiC crystals have a unit-cell which is an integral multiple of the unit-cell of the basic 6H, 15R or 4H structure. The growth of such anomalous structures cannot be understood in terms of spiral growth round a single screw dislocation in a basic matrix. However many of these polytype crystals display a single growth spiral on their (0001) face indicating that they have resulted from spiral growth round a single screw dislocation. It is shown that this anomaly can be resolved if the basic matrix is assumed to contain stacking faults near the surface at the time of the origin of the screw dislocation ledge. This possibility, overlooked in the earlier deduction of polytype structures, must be taken into consideration since vapour grown SiC crystals frequently contain a high concentration of random stacking faults, producing continuous streaks on their X-ray diffraction photographs. The most probable fault configurations that can occur in 6H, 15R and 4H structures of SiC have been deduced from a calculation of their stacking fault energy. These fault configurations are then considered to lie at different distances from the surface at the time of the origin of a screw dislocation ledge. Such a faulted ledge gives rise to polytype structures during subsequent spiral growth even if the screw dislocation has an integral Burgers vector. The most probable series of polytype structures that can result from such a faulted matrix model are deduced. It is shown that nearly all the polytype structures of SiC hitherto regarded as anomalous (such as 36H, 54H, 66H, 45R, 90R etc.) are among the expected structures and there is no need to postulate a complicated configuration of cooperating dislocations to account for their growth.     

低温热处理温度对SiC衬底上CuAlO2薄膜特性的影响

为了解决双极型碳化硅(SiC)功率器件中由于p型SiC在室温下难以完全电离所导致的p+n发射结注入效率低的问题,提出将p型CuAlO₂与n型SiC形成的异质结作为发射结以提高该结的注入效率。本文利用溶胶凝胶(sol-gel)方法,在4H-SiC衬底上制备了CuAlO₂薄膜,研究了低温热处理温度对CuAlO₂薄膜晶体结构、表面形貌、光学特性的影响。结果表明:较高的热处理温度可以促进中间产物CuO的生成,进而在固相反应阶段促进CuAlO₂相的产生,最终制备的CuAlO₂薄膜主要以CuAlO₂相的(012)晶向择优取向。随着低温热处理温度的升高,薄膜的表面均匀致密,空位缺陷含量降低,结晶质量提高。当低温热处理温度为300 ℃时,CuAlO₂薄膜晶粒尺寸约为35 nm。此外,CuAlO₂薄膜在可见光范围内的透过率超过70%,且随着预处理温度升高,薄膜光学带隙略有增加。     

Inverted SiC nanoneedles grown on carbon fibers by a two-crucible method without catalyst

Inverted single crystalline SiC nanoneedles with hexagonal cross-sections were grown on the surface of carbon fibers by high-frequency induction heating two-crucibles without using any catalysts. we employ a carbothermal reduction method of silicon monoxide with coke fibers to synthesize SiC nanoneedles within 5 min. The as-grown SiC nanoneedles shows bright blue color on carbon fibers in the [1 1 1] orientation of 3C-SiC structure. The needle-like structures grew on the substrate while the spindle portion was sticked into the carbon fibers which were different from other nanoneedles. Finally, the growth mechanism of SiC nanoneedles is proposed to be an axial direction growth with a driving force of screw dislocation and a radial direction growth with vapor–solid mechanism meanwhile.     

Investigation of 3C-SiC growth on Si(111) by vapor–liquid–solid transport using a SiGe liquid phase

The crystal growth of 3C-SiC onto silicon substrate by Vapor–Liquid–Solid (VLS) transport, where a SiGe liquid phase is fed with propane, has been investigated. Three sample configurations were used. In a preliminary approach, the VLS growth of SiC was conducted directly onto Si substrate using a Ge film as liquid catalyst. It led to the growth of a thick continuous SiC polycrystalline layer which was floating over a SiGe alloy located between the silicon substrate and the topping SiC layer. In the second configuration, a thin seeding layer of 3C-SiC grown by chemical vapor deposition (CVD) was used and the VLS growth was localized using a SiO₂ mask. The liquid phase was a CVD deposited SiGe alloy. The growth of a few hundred nanometers thick 3C-SiC epitaxial layer was demonstrated but the process was apparently affected by the presence of the oxide which was dramatically etched at the end. In the last configuration, the silicon substrate was patterned down to 10 μm and a thin seeding layer of 3C-SiC was grown by CVD onto this patterned substrate. The liquid phase was again a CVD deposited SiGe alloy. In this last configuration, the presence of epitaxial SiC was evidenced but it grew as trapezoidal islands instead of an uniform layer.     

AlN/Si(100)上CVD SiC薄膜的光致发光谱

本工作用化学气相淀积方法在AlN/Si(100)复合衬底上生长SiC薄膜.外延生长过程中,采用C4H4和SiH4作为反应气源,H2作为载气.样品的X-射线衍射谱和拉曼散射谱显示,所得到的外延层为六角对称的SiC薄膜.俄歇电子能谱及X-射线光电子能谱的测量结果表明,在外延膜中存在来自衬底的Al和N元素.样品的光致发光测量显示,所有的样品均可在室温下观察到位于3.03eV和3.17eV处的发光峰,这分别相应于4H-SiC能带中电子从导带到Al受主能级之间的辐射跃迁和电子从N施主能级到价带之间的辐射跃迁,从而表明所得的外延薄膜的多形体为4H-SiC.     

Polarities of AlN films and underlying 3C-SiC intermediate layers grown on (1 1 1) Si substrates

The hydride vapor phase epitaxy (HVPE) of {0 0 0 1} AlN films on {1 1 1} Si substrates covered with epitaxial {1 1 1} cubic SiC (3C-SiC intermediate layers) was carried out. 3C-SiC intermediate layers are essential to obtain high-quality AlN films on Si substrates, because specular AlN films are obtained with 3C-SiC intermediate layers, whereas rough AlN films are obtained without 3C-SiC intermediate layers. We determined the polarities of AlN films and the underlying 3C-SiC intermediate layers by convergent beam electron diffraction (CBED) using transmission electron microscopy. For the first time, the polarities of the AlN films and the 3C-SiC intermediate layers were determined as Al and Si polarities, respectively. The AlN films were hardly etched by aqueous KOH solution, thereby indicating Al polarity. This supports the results obtained by CBED. The result is also consistent with electrostatic arguments. An interfacial structure was proposed. The 3C-SiC intermediate layers are promising for the HVPE of AlN films on Si substrates.