键合剂对RDX/HTPB推进剂界面粘结效能的影响

应用接触角测定仪测试了几种键合剂对ＲＤＸ／ＨＴＰＢ界面粘结效能的影响。选择了两种键合剂制备了ＲＤＸ／ＨＴＰＢ推进剂，测定了推进主 单轴拉伸力学性能和单拉伸破坏能。结果表明，键合改善ＲＤＸ／ＨＴＰＢ推进剂力学性能的主要原因在于它们改善了ＲＤＸ颗粒与ＨＴＰＢ粘结剂基体间的界面粘结效能。     

以偶联技术提高固体推进剂力学性能的研究

在ＨＭＸ／硝酸酯体系中选择醇胺类、多烯多胺类、海因衍生物类等三类共１４种键合剂，分别在两种不同的固化系统中考察了这些键合剂改善推进剂力学性能的效果，证明海因衍生物类是一种较好的键合剂。结合光电子能谱的测试结果，对ＨＭＸ／硝酸酯体系有效键合剂的选择提出了一些见解。     

包覆奥克托今颗粒的燃烧性能

采用聚合物材料和一些键合剂对ＨＭＸ表面进行了包覆,并研究了包覆材料对ＨＭＸ燃烧性能的影响,试验表明,聚合物材料将降低度系数而不盼子键合剂对ＨＭＸ燃性能的影响不大。     

高能固体推进剂的新型键合剂NPBA

综述了国外在研究高能固体推进剂新型键合剂一中性聚合物键合剂方面所取得的主要进展，并介绍其物化特性、结构式、应用以及ＮＰＢＡ对改善高能推进剂力学性能的作用机理。     

应用于填充聚氨酯弹性体的键合剂

综术了聚氨酯复合固体推进剂领域中研制，应用键合剂的情况，对民用工业中常见键合剂的品种及作用机制作简介。在此基础上，提出了开发适应于填充聚氨酯弹性体键合剂新品种的设想。     

键合剂在固体推进剂中的应用及其作用机理

本文综述了键合剂在复合固体推进剂甲的应用及其作用机理,对键合剂的发展动向做了评述,同时提出了我国发展键合剂的方向。     

硝胺类推进剂用键合剂的研究进展

综述了各类适用于硝胺类推进剂的键合剂的研究情况,认为中性聚合物键合剂（NPBA）提高硝胺类推进剂的力学性能效果较好,需根据具体配方情况合成具有适当溶度积参数的NPBA,并根据NPBA的临界温度确定合适的推进剂制备温度条件。酰胺类和硼化物类键合剂具有成为优良键合剂的潜力,应加强对其合成与应用的研究。通过文献分析,认为键合剂的作用效果是官能团因素和分子结构因素共同作用的结果。对今后用于硝胺类推进剂的键合剂的发展提出了一些建议。     

醇胺类键合剂在丁羟推进剂中的应用进展

介绍醇胺类键合剂的发展现状,分析键合剂在复合推进剂中的键合机理及其在丁羟推进剂中的应用,总结了醇胺类键合剂在应用中所存在的问题及发展趋势。认为醇胺类键合剂可明显改善丁羟推进剂的性能。     

固体推进剂用键合剂研究进展

介绍了键合剂的设计理论,各种类型键合剂的研究应用情况及其对推进剂性能的影响,并对未来键合剂发展提出了若干建议。     

复合固体推进剂用键合剂的研究进展

键合剂是改善黑索金(RDX)、奥克托金(HMX)等硝胺和氧化剂填料与黏合剂间界面作用的关键功能材料,也是提高推进剂力学性能的有效、方便、实用的策略。综述复合推进剂中硼酸酯(BEBA)与中性聚合物(NPBA)等键合剂的研究进展,归纳了键合剂的作用机理,梳理了当前和未来高性能推进剂用键合剂的发展动向,针对不同的黏合剂体系和新的固化方式等发展趋势,设计具有多种功能基团的键合剂结构,积极开发可同时与硝胺、氧化剂及黏合剂相匹配的键合剂,进一步完善补充键合机理,以满足高新武器系统对高力学性能推进剂的需求。     

水中固化环氧树脂胶黏剂制备与性能研究

以固化剂、偶联剂及水泥用量,填料种类及其用量、促进剂及其用量等因素为考察对象,进行正交实验设计,考察了环氧胶黏剂中各组分用量对其剪切粘接强度的影响,并测试了其粘接性能及动态黏弹力学性能,同时进行了傅立叶红外光谱(FTIR)结构表征和热重(TGA)分析。通过粘接性能测试,得到了自制固化剂复配环氧树脂及不同助剂的最优配方:环氧树脂100份、固化剂30份、偶联剂5份、水泥120份、填料10份、促进剂2.8份,该环氧胶黏剂的剪切粘接强度为22.0MPa左右,拉伸强度为12.50MPa左右,冲击强度为9.41kJ/m2。TGA表明:环氧胶黏剂在低于335℃时,热稳定性比较好,保留率为90%以上。DMA测试得到:该胶玻璃化温度Tg为50℃左右。通过探索,混凝土哑铃型试件水中固化环氧胶黏剂的拉伸粘接强度达2.5MPa以上。     

探讨提高三角带疲劳寿命的方法

试验探讨一些提高三角带疲劳寿命的方法。用模量高、粘合好、高质量稳定的线绳作为三角带的强力材料;配方设计为橡胶并用;加偶联剂SI69和抗硫化还原剂TDB680及进口抗疲劳剂R300;用软化点极高的超级增粘树脂作为粘合剂：工艺管理严格控制。     

粘接用银膏粘接性能的研究

对粘接用银膏（以下简称银膏）的粘接性能进行了分析和研究,主要对偶联剂和增韧剂对粘接强度的影响进行了讨论,通过试验确定了最佳偶联剂和增韧剂及用量,优化了配方,提高了粘接性能。     

Modification of a nitrile-phenolic bonding agent by addition of an interfacial agent: effect on the practical adhesion between nitrile rubber and metal

—The mechanism of vulcanization bonding of a nitrile rubber (NBR) elastomer to metal with a single-coat nitrile-phenolic bonding agent is discussed. A nitrile-phenolic bonding agent consisting of NBR, phenol formaldehyde (PF) resin, and vulcanizing agents was modified with an interfacial agent (p-cresol formaldehyde resin) and the effect of interfacial agent addition on the practical adhesion between metal and the NBR elastomer after vulcanization was investigated. The adhesion strength was measured in terms of the metal-to-NBR elastomer peel strength using the bonding agent. The addition of p-cresol formaldehyde (PCF) resin to the bonding agent with a proportionate reduction of PF resin initially improved the peel strength; a maximum was reached at about 20% PCF content and then decreased with a further increase in the PCF content. The improvement in peel strength produced by the addition of PCF resin is attributed to the increased chemical bonding between NBR and the phenolic resin. The drop in peel strength above 20% PCF content is explained by the increased diffusion of the bonding agent into the NBR elastomer, away from the bond line, leading to a starved glue line. The mechanism for the optimum performance at about 20% PCF resin content is believed to be due to the balance of diffusion and chemical crosslinking.     

多种键合剂与CL-20界面的相互作用机理

选用4种键合剂对CL-20晶体进行包覆,通过X射线光电子能谱（XPS）和显微红外光谱（MIR）研究了包覆性能及其界面相互作用机理.结果表明,键合剂可以在CL-20表面形成一层粘附层以及键合剂与CL-20的NO2基团存在诱导效应,从而证明了键合剂对CL-20有良好的包覆性能.     

N,N-二羟乙基乙酰乙酰胺的合成及应用

二乙醇胺与乙酰乙酸甲酯反应合成了硼酸酯键合剂原料N,N-二羟乙基乙酰乙酰胺。通过均匀设计与SPSS软件处理实验数据,确定了N,N-二羟乙基乙酰乙酰胺收率与各反应因素的回归方程;最佳反应条件为:n(乙酰乙酸甲酯)/n(二乙醇胺)=1.3,催化剂w(ZnAc2.2H2O)=0.25%(以二乙醇胺的质量计,以下同),反应温度140℃,反应时间2.5 h,减压蒸除未反应原料得产物。在该条件下,N,N-二羟乙基乙酰乙酰胺收率达84.9%。以N,N-二羟乙基乙酰乙酰胺制备的硼酸酯键合剂BA-5-2在5 L高能丁羟四组元推进剂装药实验中的应用结果显示:推进剂常温、高温各项力学性能指标均高于发动机设计要求15%,高温黏附指数φ=1.037,其综合力学性能优于醇胺类键合剂LAB-303B、二乙醇胺硼酸酯键合剂BAG-5及海因三嗪类键合剂BA603。     

IR study on the character of hydrogen bonding in novel liquid crystalline epoxy resin

The hydrogen bonding of liquid crystalline epoxy resin with aromatic ester mesogenic group was investigated using FT-IR. The hydrogen bonding in the hydroxyl and carbonyl region was described. Free hydroxyl, intermolecular hydrogen bonding and intramolecular hydrogen bonding was observed in the cured LCE/DDS system. The amount of free hydroxyl was proportional to the content of curing agent and intramolecular hydrogen bonding showed adverse tendency with the content of curing agent. Carbonyl region was analyzed by curve fitting and the amount of hydrogen bonded carbonyl increased with the curing time and the content of curing agent. Received: 19 November 1996/Accepted: 25 December 1996     

Effect of bonding agents on natural rubber–aluminium powder composites

The effects of various bonding agents, namely the hexamethylene tetramine-resorcinol system (HR), bis[3-(triethoxysilyl)propyl]tetrasulphide (Si-69), cobalt naphthenate (CoN), and toluene diisocyanate (TDI), on the mechanical properties of aluminium powder-filled natural rubber composites have been investigated. Studies were done both as a function of the bonding agent by keeping the loading of aluminium powder constant and as a function of the aluminium powder loading along with the bonding agents. Shore A hardness, rebound resilience, heat build-up, etc., are increased by the use of bonding agents, due to the improved adhesion between the natural rubber and aluminium powder. The addition of a bonding agent minimizes the DIN abrasion loss and percentage of compression set. The tensile properties can also be improved by adding bonding agents. Of the various bonding agents used in this study, the silane coupling agent (Si-69) and the hexamethylene tetramine-resorcinol (HR) system were found to be better for natural rubber-aluminium powder composites.     

基于原位红外光谱技术的键合剂贮存老化规律及寿命研究

采用原位红外光谱技术开展键合剂在不同温度下的贮存老化规律及动力学研究,结果表明羟基为键合剂老化的薄弱环节.采用羟基官能团的变化规律进行动力学分析,得到活化能为117kJ/mol;以吸光度变化0.1％和1％作为贮存寿命的判据,键合剂在30 ℃下的贮存寿命分别为9.37 a和93.7 a.