Threshold Identification for Micro‐Tomographic Damage Characterisation in a Short‐Fibre‐Reinforced Polymer

The micro‐tomographic technique represents an important tool for the analysis of the internal structure in short‐fibre‐reinforced polymers samples. For the investigation of damage mechanisms, detection of the micro‐voids within the matrix can be facilitated by applying a tensile load in‐situ during the scan. The investigations here described started from two micro‐CT acquisitions, at different strain levels, of the same PA6.6GF10 sample. An original procedure for micro‐voids identification is proposed, based on the statistical elaboration of the matrix grey‐tone range. In order to validate the suggested procedure beyond visual inspection, an independent method based on an optimisation approach, which puts to use the two available micro‐tomographic sets, was developed and applied. The effect of the tensile load, which can induce a progression of the damage within the specimen, was investigated, and the relations among strain, fibre distribution and micro‐voids volumetric fraction were studied. Our findings point out that the mechanisms of damage progression, even under static loading as in this case, appear to be more complex than those related to the fibre‐density‐induced stress concentrations alone and require further investigation.     

Graphene‐Based Linear Tandem Micro‐Supercapacitors with Metal‐Free Current Collectors and High‐Voltage Output

Printable supercapacitors are regarded as a promising class of microscale power source, but are facing challenges derived from conventional sandwich‐like geometry. Herein, the printable fabrication of new‐type planar graphene‐based linear tandem micro‐supercapacitors (LTMSs) on diverse substrates with symmetric and asymmetric configuration, high‐voltage output, tailored capacitance, and outstanding flexibility is demonstrated. The resulting graphene‐based LTMSs consisting of 10 micro‐supercapacitors (MSs) present efficient high‐voltage output of 8.0 V, suggestive of superior uniformity of the entire integrated device. Meanwhile, LTMSs possess remarkable flexibility without obvious capacitance degradation under different bending states. Moreover, areal capacitance of LTMSs can be sufficiently modulated by incorporating polyaniline‐based pseudocapacitive nanosheets into graphene electrodes, showing enhanced capacitance of 7.6 mF cm^?2. To further improve the voltage output and energy density, asymmetric LTMSs are fabricated through controlled printing of linear‐patterned graphene as negative electrodes and MnO₂ nanosheets as positive electrodes. Notably, the asymmetric LTMSs from three serially connected MSs are easily extended to 5.4 V, triple voltage output of the single cell (1.8 V), suggestive of the versatile applicability of this technique. Therefore, this work offers numerous opportunities of graphene and analogous nanosheets for one‐step scalable fabrication of flexible tandem energy storage devices integrating with printed electronics on same substrate.     

On the Characterisation of Foam and Micro‐lattice Materials used in Sandwich Construction1

Abstract: The paper gives an overview of issues relating to the characterisation of the progressive collapse of core cellular materials used in sandwich construction. The specific structural application addressed is foreign object impact, and in this case the core cellular material is subject to multi‐axial stresses, progressive collapse and possible rupture. The paper gives an overview of various theoretical and modelling issues, which are then related to experimental materials and structural tests for model development, calibration and validation. Most discussion concerns polymeric crushable foam, metal foam and metallic lattice structures.     

Sub‐Micron Anisotropic InP‐based III–V Semiconductor Material Deep Etching for On‐Chip Laser Photonics Devices

Two InP‐based III–V semiconductor etching recipes are presented for fabrication of on‐chip laser photonic devices. Using inductively coupled plasma system with a methane free gas chemistry of chlorine and nitrogen at a high substrate temperature of 250 °C, high aspect ratio, anisotropic InP‐based nano‐structures are etched. Scanning electron microscopy images show vertical sidewall profile of 90° ± 3°, with aspect ratio as high as 10. Atomic Force microscopy measures a smooth sidewall roughness root‐mean‐square of 2.60 nm over a 3 × 3 μm scan area. The smallest feature size etched in this work is a nano‐ring with inner diameter of 240 nm. The etching recipe and critical factors such as chamber pressure and the carrier plate effect are discussed. The second recipe is of low temperature (?10 °C) using Cl₂ and BCl₃ chemistry. This recipe is useful for etching large areas of III–V to reveal the underlying substrate. The availability of these two recipes has created a flexible III–V etching platform for fabrication of on‐chip laser photonic devices. As an application example, anisotropic InP‐based waveguides of 3 μm width are fabricated using the Cl₂ and N₂ etch recipe and waveguide loss of 4.5 dB mm^?1 is obtained.