Fe/Al混合膜的PLD法制备及表面分析

 采用脉冲激光气相沉积（PLD）技术制备了Fe/Al混合膜,测量了该混合膜的光电子能谱（XPS）,并采用原子力显微镜（AFM）、扫描电子显微镜（SEM）对Fe/Al混合膜作了表面分析。结果表明：Fe/Al混合膜的表面粗糙度对衬底温度有明显的依赖性, 随着衬底温度的升高,薄膜的表面逐渐变得平滑,膜层变得致密,在200 ℃衬底温度下制得了均方根（rms）粗糙度为0.154 nm、具有原子尺度光滑性的Fe/Al混合膜, 膜中Fe和Al分布比较均匀,其成分比约为1∶3,同时XPS分析也表明Fe/Al混合膜暴露在空气中后表面形成了Al₂O₃和FeO氧化层。     

Al-Cu-Fe二十面体准晶的深过冷研究

通过循环过热净化法研究了Ａｌ－Ｃｕ－Ｆｅ合金系中Al₆₅Cu₂₀Fe₁₅合金液的深过冷采用循环过热净化法净化Al₆₅Cu₂₀Fe₁₅合金液，获得了９８Ｋ的过冷度，并制备出直径为６ｍｍ的高纯度的Ａｌ－ＣＳ－ＦＳ二十面体准晶球．随着Al₆₅Cu₂₀Fe₁₅合金液过冷度的不同，Al₆₅Cu₂₀Fe₁₅合金液的第一形核相也发生变化．此外，提高对Al₆₅Cu₂₀Fe₁₅合金液的净化程度，可以提高合金液的形成Ａｌ－Ｃｕ－Ｆｅ二十面体准晶的能力．     

LBO晶体上1 064，532 nm倍频增透膜的镀制及性能分析

 用电子束蒸发沉积方法在X切LBO（X-LBO）晶体上镀制了两种不同膜系结构的1 064和532 nm倍频增透膜，其中一种膜系结构为基底/ZrO₂/Y₂O₃/Al₂O₃/SiO₂/空气，另一种为基底/0.5Al₂O₃/ZrO₂/Y₂O₃/Al₂O₃/SiO₂/空气，两种膜系结构的主要差别在于有无氧化铝过渡层。测量了薄膜的反射率光谱曲线，发现两种增透膜在1 064和532 nm处的反射率均小于0.5％，实际镀制结果与理论设计曲线的差异主要是由材料折射率的变化引起的。且对样品在空气环境中进行了温度为473 K的退火处理，结果发现两种膜系结构均表现了较优异的光学性能，氧化铝过渡层的加入使薄膜具有强的热应力性能。     

液Zn对Fe2Al5涂层侵蚀的相变过程研究

本文对Fe₂Al₅涂层在液态Zn中的侵蚀相变过程进行了研究,实验结果表明：在侵蚀初期,靠界面张力平衡的作用,先发生热侵蚀,在试样表面形成热蚀沟,当热蚀沟达到一定程度后, 液Zn与Fe₂Al₅相由不浸润变为浸润;同时Zn原子扩散进入Fe₂Al₅相并形成Fe₂Al₅-Zn_x固溶体相(η相);随着侵蚀时间的增加,发生在腐蚀界面上的液Zn对Fe₂Al₅涂层的侵蚀过程是恒温相变过程,相变过程使Fe₂Al₅涂层发生定向熔化. 相变的驱动力来自于相成分的改变所引起的各相自由能的变化及各相间的相平衡的重新建立.     

Pb-Mg-Al合金腐蚀机理的电子理论研究

为了了解Pb-Mg-Al合金腐蚀的物理本质, 本文采用基于第一性原理的赝势平面波方法系统地计算了Pb-Mg-Al合金中各物相的结合能、费米能级和局域态密度等电子结构参数, 分析了合金的电化学腐蚀机理. 计算结果表明：Pb-Mg-Al合金中各主要组成物相稳定性大小关系为 Mg₁₇Al₁₂>Mg₂Pb>Mg;Mg,Mg₂Pb和Mg₁₇Al₁₂的费米能级存在E_f(Mg)>E_f(Mg₂Pb)>E_f(Mg₁₇Al₁₂)的关系, 说明Mg最容易失去电子, Mg₂Pb次之, Mg₁₇Al₁₂最难;局域态密度表明, 在同样的外界条件下, 体系中Mg相和Mg₂Pb相对于Mg₁₇Al₁₂均处于不稳定的状态, 容易失去电子, 即容易发生腐蚀. Pb-Mg-Al合金体系中不同物相的费米能级差构成了电化学腐蚀的电动势, 导致电子从费米能级高的Mg相和Mg₂Pb相流向费米能级低的Mg₁₇Al₁₂相, 使Pb-Mg-Al合金发生腐蚀.     

三氧化二铝-聚苯乙烯复合微球的制备

 以Al₂O₃-PS复合材料为原料，采用乳液微封装法制备出掺杂Al₂O₃的PS空心微球。三相溶液分别是两个水相：蒸馏水（W₁相）、5wt%PVA水溶液（W₂相）和3wt%Al₂O₃-PS溶液（O相，苯和三氯甲烷混合物作溶剂）。所得微球表面粗糙度低于50nm。     

真空退火对355nm Al2O3/MgF2高反射薄膜性能的影响

 采用电子束蒸发沉积技术制备了355nm Al₂O₃/MgF₂ 高反射薄膜，并在真空中进行不同温度梯度的退火，用X射线衍射（XRD）观察了薄膜微结构的变化，用355nm Nd：YAG脉冲激光测试了薄膜的激光损伤阈值，用Lambda 900光谱仪测试了薄膜的透过和反射光谱。结果表明在工艺条件相同的条件下真空退火过程对薄膜的性能有很大的影响，退火温度梯度越小的样品，吸收越小，阈值越大，并且是非晶结构。选择合适的真空退火过程可以减少355nm Al₂O₃/MgF₂ 高反射膜的膜层吸收，提高薄膜的激光损伤阈值。     

Al3+掺杂的CuZn铁氧体的结构，电学和磁学特性

采用固相合成反应技术制备纳米Cu_0.5Zn_0.5Fe_2-xAl_xO₂(x=0.0,0.1,0.2,0.3,0.4和0.5)铁氧体材料,研究Al³⁺含量对结构,电学和磁学性质的影响. 采用X射线衍射研究单相立方尖晶石结构. 利用Scherrer公式估算晶粒尺寸. 测定了温度依赖的直流电阻率.结果表明随Al³⁺含量的增加,晶格常数减小,孔隙度增加,饱和磁化强度值降低,Al³⁺对铁氧体的介电常数、介电损耗角的正切值和介质损耗因子等介电性能有明显影响,这可能与空间电荷极化有关.     

MAGNETIC PROPERTIES OF BALL MILLED FexCu1-x (x=0.4, 0.5) ALLOY

The samples Fe_0.4Cu_0.6 and Fe_0.5Cu_0.5 ball milled for 50 h are investigated by X-ray diffraction, M?ssbauer spectra, as well as magnetic measurement. The experiments show that the structure of the samples is fcc, with lattice constant 0.361 nm and there are fcc Fe-rich phase and fcc Cu-rich phase in the samples. Most of Fe atoms (91%) are in the fcc Fe-rich phase, which is a ferromagnetic phase. The M-H curve at 1.5 K shows the saturation magnetization of the samples are 80.5 emu/g and 101.6 emu/g for Fe_0.4Cu_0.6 and Fe_0.5Cu_0.5 respectively. The average magnetic moment of Fe atoms is deduced to be 2.40 μ_B . Compared with theoretical predication, the Fe atoms in the fcc phase are in high spin state.     

电爆炸丝法制备纳米Al2O3粉末

 设计了电爆炸金属丝产生纳米金属氧化物粉末的实验装置，金属丝电爆炸腔采用圆筒结构，纳米粉末经过微孔滤膜过滤收集。成功制备了纳米Al₂O₃粉末，其平均粒度达到64.9 nm。对电爆炸金属丝产生纳米Al₂O₃粉末的物理条件进行了研究。结果表明实验条件对粉末粒度有重要影响：随气压的增加粉末平均粒度变大；随金属丝直径增大粉末平均粒度变大；粉末的平均粒度与电容器的初始储能也有一定的关系。     

衬底温度对PLD制备的Mo薄膜结构及表面形貌的影响

 运用脉冲激光沉积(PLD)技术在Si(100)基片上沉积了金属Mo薄膜。在激光重复频率2 Hz,能量密度5.2 J/cm²,本底真空10^－6 Pa的条件下,研究Mo薄膜的结构和表面形貌,讨论了衬底温度对薄膜形貌与结构的影响。原子力显微镜(AFM)图像和X射线小角衍射(XRD)分析表明,薄膜表面平整、光滑,均方根粗糙度小于2 nm。沉积温度对Mo薄膜结构和表面形貌影响较大,在373~573 K范围内随着温度升高,薄膜粗糙度变小,结晶程度变好。     

Electronic structure and nematic phase transition in superconducting multiple-layer FeSe films grown by pulsed laser deposition method

We report comprehensive angle-resolved photoemission investigations on the electronic structure of single crystal multiple-layer FeSe films grown on CaF_2 substrate by pulsed laser deposition(PLD) method. Measurements on FeSe/CaF_2 samples with different superconducting transition temperatures T_c of 4 K, 9 K, and 14 K reveal electronic difference in their Fermi surface and band structure. Indication of the nematic phase transition is observed from temperature-dependent measurements of these samples; the nematic transition temperature is 140-160 K, much higher than ~90 K for the bulk FeSe. Potassium deposition is applied onto the surface of these samples; the nematic phase is suppressed by potassium deposition which introduces electrons to these FeSe films and causes a pronounced electronic structure change. We compared and discussed the electronic structure and superconductivity of the FeSe/CaF_2 films by PLD method with the FeSe/SrTiO_3 films by molecular beam epitaxy(MBE) method and bulk FeSe. The PLD-grown multilayer FeSe/CaF_2 is more hole-doped than that in MBE-grown multiple-layer FeSe films. Our results on FeSe/CaF_2 films by PLD method establish a link between bulk FeSe single crystal and FeSe/SrTiO_3 films by MBE method, and provide important information to understand superconductivity in FeSe-related systems.     

Improved performances in low-voltage-driven InGaZnO thin film transistors using a SiO2 buffer layer insertion

Al (5 nm)/Ga-doped ZnO (GZO, 100 nm) double-layer films were prepared at room temperature by magnetron sputtering. It is found that the crystal structure of GZO is degraded due to the existence of Al layer. Semiconductor transport behavior is observed in GZO and Al/GZO films in the temperature range of 80～360 K. As opposed to that of GZO, the resistivity of Al/GZO shows a significant decrease with increasing the temperature from 320 to 360 K. To understand the temperature dependent resistivity, Al (5 nm)/GZO film was annealed in vacuum in the temperature range of 398～573 K. High-resolution TEM observations reveal that Al grains become more and more isolated as the annealing temperature increases. The decreasing resistivity above 320 K for the Al/GZO system is considered to be caused by the substitution of Al atoms for Zn atoms at the interface, showing an improvement in the transmittance with over 90 % especially at 398 K.     

生长条件对脉冲激光沉积制备ZnO：Al薄膜光电性能的影响

本文研究了脉冲激光沉积(PLD)生长过程中, 铝掺量、氧压及衬底温度等实验参数对ZnO:Al(AZO)薄膜生长的影响, 并利用扫描电子显微镜、原子力显微镜、X射线衍射、霍尔效应、光透射光谱等实验手段对其透明导电性能进行了探讨. 变温霍尔效应和光透射测量表明, 当靶材中铝掺量大于0.5 wt%时, 所制备AZO薄膜中铝施主在80 K时已完全电离, 因Bernstein-Moss (BM) 效应其带隙变大, 均为重掺杂简并半导体. 进一步系统研究了氧压和衬底温度对AZO薄膜透明导电性能的影响, 实验发现当氧压为1 Pa, 衬底温度为200 ℃时, AZO 导电性能最好, 其霍尔迁移率为28.8 cm²/V·s, 薄膜电阻率最小可达2.7×10^-4 Ω·cm, 且在可见光范围内光透过率超过了85%. 氧压和温度的增加, 都会导致薄膜电阻率变大. 关键词： 脉冲激光沉积法 ZnO：Al薄膜 透光性 导电性     

Fabrication of pulsed-laser deposited V-W-Nd mixed-oxide films

V-W-Nd mixed-oxide films were prepared by pulse-laser deposition (PLD) technique from the targets sintered at different temperatures. X-ray photoelectron spectroscopy (XPS) data indicate that the films fabricated from the targets sintered at low temperature were composed of various mixed valences. Raman spectroscopy shows that V-W-Nd films were composed of the vanadates as NdVO₄, and the W⁶⁺ doping supplements the formation of vanadate. Atomic force microscopy (AFM) image of the films fabricated from the target sintered at 923 K reveals the average particle size is estimated around 86 nm. The surface morphology of the films roughness shows a dramatic change at 923-943 K.     

AlFe单晶薄膜微结构与热力学性质研究

采用PLD方法,在573 K条件下制备了AlFe单晶合金薄膜.X射线衍射与透射电子衍射表明,AlFe空间点群为PM-3M,晶格常数a =0.297 nm (略大于bcc-Fe的晶格常数,a =0.293 nm),且AlFe晶体结构为bcc-Fe晶格体心Fe原子被Al取代产生的新结构.采用第一性原理与准谐德拜模型研究了AlFe合金的化学势与热力学性能,计算表明AlFe合金具有更低的化学势,导致在生长过程只出现AlFe相.与此同时,AlFe合金具有与bc 关键词： PLD AlFe单晶薄膜 第一性原理 准谐德拜模型     

Quantitative TEM analysis of Al/Cu multilayer systems prepared by pulsed laser deposition

Thin films composed of alternating Al/Cu/Al layers were deposited on a (111) Si substrate using pulsed laser deposition (PLD). The thicknesses of the film and the individual layers, and the detailed internal structure within the layers were characterized by means of transmission electron microscopy (TEM), high-resolution TEM (HRTEM), and energy-filtered TEM (EFTEM). Each Al or Cu layer consists of a single layer of nano-sized grains of different orientations. EFTEM results revealed a layer of oxide about 2 nm thick on the surface of the Si substrate, which is considered to be the reason for the formation of the first layer of nano-sized Al grains. The results demonstrate that the PLD technique is a powerful tool to produce nano-scale multilayered metal films with controllable thickness and grain sizes.     

退火温度对溅射铝膜结构与电性能的影响

 采用直流磁控溅射方法成功地制备了Al膜,研究了退火温度对Al膜表面形貌、晶体结构、应力、择优取向及反射率的影响。研究表明：不同退火温度的薄膜晶粒排布致密而光滑,均方根粗糙度小。XRD测试表明：不同温度退火的铝膜均成多晶状态,晶体结构为面心立方,退火温度升高到400 ℃时,Al膜的应力最小达0.78 GPa,薄膜平均晶粒尺寸由18.3 nm增加到25.9 nm;随着退火温度的升高,(200)晶面择优取向特性变好。薄膜紫外-红外反射率随着退火温度的升高而增大。     

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利用微波电子回旋共振等离子体增强型化学气相沉积(ECR-PECVD)采用一步法直接在K9玻璃上低温沉积制备了多晶硅薄膜.研究了不同实验参数对薄膜沉积的影响,采用X射线衍射(XRD)、拉曼光谱、扫描电子显微镜(SEM)等实验分析方法对不同条件下制备的样品进行了晶体结构和表面形貌分析,并讨论了多晶硅薄膜沉积的最佳条件.实验结果表明,玻璃衬底上多晶硅薄膜呈柱状生长,并有一定厚度的非晶孵化层;较高氢气比例和衬底温度有利于结晶,薄膜的结晶率达到了62％;晶粒团簇的最大尺寸约为500nm.