N‐type solar‐grade silicon purified via the metallurgical route: characterisation and fabrication of solar cells

This study focuses on the characterisation and the fabrication of solar cells using n‐type multicrystalline silicon purified via the metallurgical route. Electrical and chemical analyses were performed on wafers taken from several positions along the crystallised ingot. The impact of the fabrication processing steps was investigated via effective carrier lifetime measurements. Solar cells were processed, and their efficiencies were found to be dependent on the position of the wafer along the ingot height, that is, the wafer's resistivity. A maximum conversion efficiency of 15.0% was obtained on cells from the bottom part of the ingot. In this study, the minimum resistivity value of 0.4 Ω cm resistivity is given in order to reach adequate cell efficiency. Light‐soaking experiments were then performed on the fabricated cells. No significant variations of the cell performances were observed even after 110 h at 60 °C, meaning that the fabricated cells are stable under illumination. Copyright © 2012 John Wiley & Sons, Ltd.     

Boron‐doped hydrogenated silicon carbide alloys containing silicon nanocrystallites for highly efficient nanocrystalline silicon thin‐film solar cells

Boron‐doped hydrogenated silicon carbide alloys containing silicon nanocrystallites (p‐nc‐SiC:H) were prepared using a plasma‐enhanced chemical vapor deposition system with a mixture of CH₄, SiH₄, B₂H₆ and H₂ gases. The influence of hydrogen dilution on the material properties of the p‐nc‐SiC:H films was investigated, and their roles as window layers in hydrogenated nanocrystalline silicon (nc‐Si:H) solar cells were examined. By increasing the R_H (H₂/SiH₄) ratio from 90 to 220, the Si―C bond density in the p‐nc‐SiC:H films increased from 5.20 × 10¹⁹ to 7.07 × 10¹⁹/cm³, resulting in a significant increase of the bandgap from 2.09 to 2.23 eV in comparison with the bandgap of 1.95 eV for p‐nc‐Si:H films. For the films deposited at a high R_H ratio, the Si nanocrystallites with a size of 3–15 nm were formed in the amorphous SiC:H matrix. The Si nanocrystallites played an important role in the enhancement of vertical charge transport in the p‐nc‐SiC:H films, which was verified by conductive atomic force microscopy measurements. When the p‐nc‐SiC:H films deposited at R_H = 220 were applied in the nc‐Si:H solar cells, a high conversion efficiency of 8.26% (V_oc = 0.53 V, J_sc = 23.98 mA/cm² and FF = 0.65) was obtained compared to 6.36% (V_oc = 0.44 V, J_sc = 21.90 mA/cm² and FF = 0.66) of the solar cells with reference p‐nc‐Si:H films. Further enhancement in the cell performance was achieved using p‐nc‐SiC:H bilayers consisting of highly doped upper layers and low‐level doped bottom layers, which led to the increased conversion efficiency of 9.03%. Copyright © 2015 John Wiley & Sons, Ltd.     

Investigation of bulk and solar cell properties of ingots cast from compensated solar grade silicon

In this work, the effect of the concurrent presence of B and P on bulk and solar cell properties of directionally solidified multicrystalline ingots from commercially compensated solar grade silicon (SoG‐Si) feedstock produced by Elkem Solar was investigated. The initial B and P content prior to the directional solidification experiment was 1260 and 762 ppba, respectively. Two reference ingots have been solidified in a silica crucible from 100% electronic grade silicon (EG‐Si) feedstock, with 332 ppba of boron added. All ingots have been cast under similar process parameters. The resistivity measurements by Four Point Probe (FPP) are in good agreement with the net dopant content, i.e., N_A − N_D for p‐type material, measured by Glow Discharge Mass Spectrometer (GDMS). Bulk lifetime measurements show a decrease in the values compared to the EG reference. Lifetime distributions show the highest values of 13 and 19 µs at approximately half ingot height, compared to 30 and 44 µs in the reference ingots. This decrease can be due to the concurrent effect of compensation and of other impurities present in the ingot. However, the content of several transition metals measured by GDMS at half ingot height was not significantly higher than that of the reference ingots. Oxygen content as measured by Fourier Transform Infra‐Red (FTIR) spectroscopy shows no significant difference compared to the references. Solar cells made from the compensated ingots and processed under standard process conditions show efficiency values up to 15.5% and fill factor values up to 78%, comparable to conventional multicrystalline silicon cells. Copyright © 2010 John Wiley & Sons, Ltd.     

Industrially feasible,dopant‐free,carrier‐selective contacts for high‐efficiency silicon solar cells

Dopant‐free, carrier‐selective contacts (CSCs) on high efficiency silicon solar cells combine ease of deposition with potential optical benefits. Electron‐selective titanium dioxide (TiO₂) contacts, one of the most promising dopant‐free CSC technologies, have been successfully implemented into silicon solar cells with an efficiency over 21%. Here, we report further progress of TiO₂ contacts for silicon solar cells and present an assessment of their industrial feasibility. With improved TiO₂ contact quality and cell processing, a remarkable efficiency of 22.1% has been achieved using an n‐type silicon solar cell featuring a full‐area TiO₂ contact. Next, we demonstrate the compatibility of TiO₂ contacts with an industrial contact‐firing process, its low performance sensitivity to the wafer resistivity, its applicability to ultrathin substrates as well as its long‐term stability. Our findings underscore the great appeal of TiO₂ contacts for industrial implementation with their combination of high efficiency with robust fabrication at low cost. Copyright © 2017 John Wiley & Sons, Ltd.     

Removal of impurities from metallurgical grade silicon by electron beam melting

Solar cells are currently fabricated from a variety of silicon-based materials.Now the major silicon material for solar cells is the scrap of electronic grade silicon(EG-Si).But in the current market it is difficult to secure a steady supply of this material.Therefore,alternative production processes are needed to increase the feedstock.In this paper,EBM is used to purify silicon.MG-Si particles after leaching with an initial purity of 99.88%in mass as starting materials were used.The final purity of the silicon disk obtained after EBM was above 99.995%in mass.This result demonstrates that EBM can effectively remove impurities from silicon.This paper mainly studies the impurity distribution in the silicon disk after EBM.     

Research on Removal of Impurities from Metallurgical Grade Silicon（MG-Si） by Electron Beam Melting（EBM）

Solar cells are currently fabricated from a variety of silicon-based materials.Now the major silicon material for solar cells is the scrap of electronic grade silicon(EG-Si).But in the current market it is difficult to secure a steady supply of this material.Therefore,alternative production processes are needed to increase the feedstock.In this paper,EBM is used to purify silicon.MG-Si particles after leaching with an initial purity of 99.88%in mass as starting materials were used.The final purity of the...     

Temperature‐dependent Hall‐effect measurements of p‐type multicrystalline compensated solar grade silicon

In this study, we have investigated the Hall majority carrier mobility of p‐type, compensated multicrystalline solar grade silicon (SoG‐Si) wafers for solar cells in the temperature range 70–373 K. At low temperature (~70 K) the difference in the mobilities measured for the compensated and the uncompensated reference samples is the highest, and the measured mobility shows dependence on the compensation ratio. Mobilities decrease with increasing temperature, and towards room temperature, the mobilities of the different samples are in the same range. The measurements show that, for these samples, the contribution from lattice scattering is dominating over ionized impurity scattering at room temperature. In the range of interest for silicon solar cells (above room temperature), the trend in carrier mobility is similar for all the samples, and the measured value for the sample with low compensation ratio and low doping density is comparable to the uncompensated references. A comparison of resistivity and majority carrier density measured by the Hall setup at room temperature and by four‐point probe and glow discharge mass spectroscopy, respectively, is reported as well. Copyright © 2012 John Wiley & Sons, Ltd.     

Large‐area epitaxial silicon solar cells based on industrial screen‐printing processes

Thin‐film epitaxial silicon solar cells are an attractive future alternative for bulk silicon solar cells incorporating many of the process advantages of the latter, but on a potentially cheap substrate. Several challenges have to be tackled before this potential can be successfully exploited on a large scale. This paper describes the points of interest and how IMEC aims to solve them. It presents a new step forward towards our final objective: the development of an industrial cell process based on screen‐printing for > 15% efficient epitaxial silicon solar cells on a low‐cost substrate. Included in the discussion are the substrates onto which the epitaxial deposition is done and how work is progressing in several research institutes and universities on the topic of a high‐throughput epitaxial reactor. The industrial screen‐printing process sequence developed at IMEC for these epitaxial silicon solar cells is presented, with emphasis on plasma texturing and improvement of the quality of the epitaxial layer. Efficiencies between 12 and 13% are presented for large‐area (98 cm²) epitaxial layers on highly doped UMG‐Si, off‐spec and reclaim material. Finally, the need for an internal reflection scheme is explained. A realistically achievable internal reflection at the epi/substrate interface of 70% will result in a calculated increase of 3 mA/cm² in short‐circuit current. An interfacial stack of porous silicon layers (Bragg reflectors) is chosen as a promising candidate and the challenges facing its incorporation between the epitaxial layer and the substrate are presented. Experimental work on this topic is reported and concentrates on the extraction of the internal reflection at the epi/substrate interface from reflectance measurements. Initial results show an internal reflectance between 30 and 60% with a four‐layer porous silicon stack. Resistance measurements for majority carrier flow through these porous silicon stacks are also included and show that no resistance increase is measurable for stacks up to four layers. Copyright © 2005 John Wiley & Sons, Ltd.     

物理冶金多晶硅太阳电池叠层钝化减反射结构模拟

采用PC1D模拟软件对p型物理冶金多晶硅太阳电池的SiO2/Si Nx/SiNx叠层钝化减反射结构进行了计算模拟。结果表明:在SiNx/Si Nx双层减反射结构中引入SiO2钝化层后可以明显改善电池的外量子效率与表面减反射效果,并最终提高电池转换效率;随着SiO2膜厚度的增加,电池表面反射率呈先降低后增加的趋势,而电池外量子效率及转换效率则呈现出相反的趋势。二氧化硅膜厚度在2~8 nm时,电池转换效率变化不大,并在6 nm时效率达到最大值18.04%,当二氧化硅膜厚度大于8 nm后电池转换效率会出现明显下降。     

Characterization of polycrystalline silicon wafers for solar cells sliced with novel fixed‐abrasive wire

For slicing crystalline silicon ingots, we have developed a novel fixed‐abrasive wire where diamond grit is fixed onto a bare wire by resin bonding. The properties of the wafers sliced using a multi‐wire saw with the fixed‐abrasive wire have been investigated. When compared with the wafers sliced with the loose‐abrasive wire, the slicing speed is improved by approximately 2.5‐fold and the thicknesses of saw‐damage layers are reduced by more than a factor of two. Polycrystalline silicon solar cells have been fabricated for the first time utilizing the wafers sliced with the fixed‐abrasive wire, and the cells with the saw‐damage etching depth of 7 µm have shown photovoltaic properties comparable to those prepared using the wafers sliced with the loose‐abrasive wire and subsequently etched to remove the damage layers up to 15 µm. It has been clarified that wafer slicing using the fixed‐abrasive wire is promising as a next‐generation slicing technique for fabrication of solar cells, particularly thin silicon cells where the wafer thicknesses approach or become less than 150 µm. Copyright © 2010 John Wiley & Sons, Ltd.     

Sensitivity of state‐of‐the‐art and high efficiency crystalline silicon solar cells to metal impurities

For the first time, the sensitivity to impurities of the solar cell conversion efficiency is reported for a state‐of‐the‐art (i.e., 18%) and advanced device architecture (i.e., 23%). The data are based on the experimental results obtained in the CrystalClear project for the state‐of‐the‐art cell process and extrapolated to a device with excellent front and rear surface passivation. Both device structures are not assumed to work in low injection level as several studies assumed before, but real operating conditions are considered. This is a fundamental difference with the past and required for modeling future high efficiency devices. The impurity with highest impact is Ti, followed by Cu, Cr, Ni and Fe, which form together a group two order of magnitude less sensitive than the former. In high efficiency devices, a large reduction of the impurity impact is visible for impurities with large capture cross‐section ratio like Fe, which reduces its relative difference in comparison with, for example, Cr, which has a small capture cross‐section ratio. In general, advanced devices will be more sensitive to the impurity content than the state‐of‐the‐art cell design. This effect is partly compensated by a reduction of the substrate thickness. The impurity sensitivity as function of the substrate thickness is reported. Copyright © 2012 John Wiley & Sons, Ltd.     

Two‐dimensional modeling of front contact silicon solar cells

The modeling of a new type of silicon solar cell intended for operation at very high concentration, with all the contacts at its front face, is presented. The two‐dimensional model developed makes use of the theory of the complex variable, and is able to explain the main features of the operation of these cells. It is shown that if all the parameters reach good state‐of‐the‐art values, and with the appropriate layout, this structure can reach 25% efficiency for a range of concentrations wider than any other known silicon cell. Copyright © 2004 John Wiley & Sons, Ltd.     

Wide‐bandgap p‐type microcrystalline silicon oxycarbide using additional trimethylboron for silicon heterojunction solar cells

We report a new wide‐bandgap p‐type microcrystalline silicon oxycarbide (p‐μc‐SiO_xC_y:H) film prepared by plasma‐enhanced chemical vapor deposition. As an additional doping gas, trimethylboron was introduced into the standard processing gas‐mixture of silane, carbon dioxide, hydrogen, and diborane. With both trimethylboron and diborane as doping gases, the optical bandgap (E ₀₄) of the formed p‐μc‐SiO_xC_y:H film was 0.18 eV higher than that of reference microcrystalline silicon oxide (p‐μc‐SiO_x:H) processed with only diborane doping gas for the same levels of film thickness and electrical conductivity. To demonstrate the effectiveness of the developed p‐layer, we applied it as an emitter in silicon heterojunction solar cells, which delivered a markedly high open circuit voltage of 0.702 V and a power conversion efficiency of 18.9% based on a non‐textured flat wafer. Copyright © 2017 John Wiley & Sons, Ltd.     

Bifacial potential of single‐ and double‐sided collecting silicon solar cells

Bifacial applications are a promising way to increase the performance of photovoltaic systems. Two silicon solar cell concepts suitable for bifacial operation are the passivated emitter, rear totally diffused (PERT) and the both sides collecting and contacted (BOSCO) cell concepts. This work investigates the bifacial potential of these concepts by means of in‐depth numerical device simulation and experiment with a focus on the impact of varying material quality. It is shown that the PERT cell concept (representing a structure with front‐side emitter only) requires high‐minority‐carrier‐diffusion‐length substrates with L_bulk > 3 × W (with cell thickness W) to exploit its bifacial potential, while the BOSCO cell (representing a structure with double‐sided emitter) can already utilise its bifacial potential on substrates with significantly lower diffusion lengths down to L_bulk ≈ 0.5 × W. Experimentally, BOSCO cells with and without activated rear‐side emitter are compared. For rear‐side illumination, the activated rear‐side emitter is measured to increase internal quantum efficiency at wavelengths λ < 850 nm by up to 45%_abs (factor of 9) and 30%_abs (factor of 2) for cells processed on p‐type multicrystalline silicon substrates with L_bulk ≈ 0.3 × W and L_bulk ≈ 2.6 × W, respectively. For PERT cells processed on n‐type Czochralski‐grown silicon substrates, an according increase in internal quantum efficiency for rear‐side illumination of more than 20%_abs (factor of 1.3) is measured when changing from a substrate with L_bulk ≈ 3.0 to 10.0 × W. The performed simulations and experiments demonstrate that the BOSCO cell concept is a promising candidate to successfully exploit bifacial gain also on low‐ to medium‐diffusion‐length substrates such as p‐type multicrystalline silicon, while PERT cells require a high‐diffusion‐length substrate to utilise their bifacial potential. Furthermore, the BOSCO cell concept is shown to be a promising option to achieve highest output power densities, even when using lower quality and therefore possibly more cost‐effective silicon substrates. Copyright © 2016 John Wiley & Sons, Ltd.     

High‐efficiency solar cells on phosphorus gettered multicrystalline silicon substrates

Measurements of the dislocation density are compared with locally resolved measurements of carrier lifetime for p‐type multicrystalline silicon. A correlation between dislocation density and carrier recombination was found: high carrier lifetimes (>100 µs) were only measured in areas with low dislocation density (<10⁵ cm⁻²), in areas of high dislocation density (>10⁶ cm⁻²) relatively low lifetimes (<20 µs) were observed. In order to remove mobile impurities from the silicon, a phosphorus diffusion gettering process was applied. An increase of the carrier lifetime by about a factor of three was observed in lowly dislocated regions whereas in highly dislocated areas no gettering efficiency was observed. To test the effectiveness of the gettering in a solar cell manufacturing process, five different multicrystalline silicon materials from four manufacturers were phosphorus gettered. Base resistivity varied between 0·5 and 5 Ω cm for the boron‐ and gallium‐doped p‐type wafers which were used in this study. The high‐efficiency solar cell structure, which has led to the highest conversion efficiencies of multicrystalline silicon solar cells to date, was used to fabricate numerous solar cells with aperture areas of 1 and 4 cm². Efficiencies in the 20% range were achieved for all materials with an average value of 18%. Best efficiencies for 1 cm² (20·3%) and 4 cm² (19·8%) cells were achieved on 0·6 and 1·5 Ω cm, respectively. This proves that multicrystalline silicon of very different material specification can yield very high efficiencies if an appropriate cell process is applied. Copyright © 2006 John Wiley & Sons, Ltd.     

Design,fabrication, and analysis of transparent silicon solar cells for multi‐junction assemblies

Transparent silicon solar cells can lead to an increased efficiency of silicon‐based multi‐junction assemblies by transmitting near and below band gap energy light for conversion in a low band gap solar cell. This analysis shows that the maximum efficiency gain for a low band gap solar cell beneath silicon at a concentration of 50 suns is 5.8%, based on ideal absorption and conversion of the photons. This work analyzes the trade‐offs between increased near band edge absorption in the silicon and silicon solar cell transparency. Application of these results to real cases including a germanium bottom solar cell is analyzed, leading to a range of cases with increased system efficiency. Non‐ideal surfaces and real silicon and germanium solar cell device performance are presented. The range of practical system gains may be as low as 2.2 – 1% absolute when compared with the efficiency of a light‐trapped silicon solar cell for 1‐sun operation, based on this work. Copyright © 2012 John Wiley & Sons, Ltd.     

High‐efficiency microcrystalline silicon single‐junction solar cells

This short communication highlights our latest results towards high‐efficiency microcrystalline silicon single‐junction solar cells. By combining adequate cell design with high‐quality material, a new world record efficiency was achieved for single‐junction microcrystalline silicon solar cell, with a conversion efficiency of 10.69%, independently confirmed at ISE CalLab PV Cells. Such significant conversion efficiency could be achieved with only 1.8 µm of Si. Copyright © 2013 John Wiley & Sons, Ltd.     

Electron‐beam crystallized large grained silicon solar cell on glass substrate

Thin film hetero‐emitter solar cells with large‐grained poly‐silicon absorbers of around 10 µm thickness have been prepared on glass. The basis of the cell concept is electron‐beam‐crystallization of an amorphous or nanocrystalline silicon layer deposited onto a SiC:B layer. The SiC:B layer covers a commercially well available glass substrate, serving as diffusion barrier, contact layer and dopand source. For silicon absorber deposition a low pressure chemical vapour deposition was used. The successively applied e‐beam crystallization process creates poly‐silicon layers with grain sizes up to 1 × 10 mm² with low defect densities. The high electronic quality of the absorber is reflected in open circuit voltages as high as 545 mV, which are realized making use of the well‐developed a‐Si:H hetero‐emitter technology. Copyright © 2011 John Wiley & Sons, Ltd.     

19% efficient n‐type Czochralski silicon solar cells with screen‐printed aluminium‐alloyed rear emitter

High and stable lifetimes recently reported for n‐type silicon materials are an important and promising prerequisite for innovative solar cells. To exploit the advantages of the excellent electrical properties of n‐type Si wafers for manufacturing simple and industrially feasible high‐efficiency solar cells, we focus on back junction n⁺np⁺ solar cells featuring an easy‐to‐fabricate full‐area screen‐printed aluminium‐alloyed rear p⁺ emitter. Independently confirmed record‐high efficiencies have been achieved on n‐type phosphorus‐doped Czochralski‐grown silicon material: 18·9% for laboratory‐type n⁺np⁺ solar cells (4 cm²) with shadow‐mask evaporated front contact grid and 17·0% for front and rear screen‐printed industrial‐type cells (100 cm²). The electrical cell parameters were found to be perfectly stable under illumination. Copyright © 2006 John Wiley & Sons, Ltd.