穿透夹杂界面的半无限楔形裂纹尖端螺型位错的发射研究

摘要：研究了穿透圆形夹杂界面的半无限楔形裂纹与裂纹尖端螺型位错的干涉问题。应用复变函数解析延拓技术与奇性主部分析方法,得到了位错位于半圆形夹杂内部时,半无限基体和半圆形夹杂内复势函数的解析解。然后利用保角映射技术得到了穿透圆形夹杂界面的半无限楔形裂纹尖端螺型位错产生的应力场以及作用在位错上的位错力的解析表达式。主要讨论了螺型位错对裂纹的屏蔽效应以及从楔形裂纹尖端发射位错的临界载荷条件。研究结果表明正的螺型位错可以削弱楔形裂纹尖端的应力强度因子,屏蔽裂纹的扩展,屏蔽效应随位错方位角的增大而减小。位错发射所需的无穷远临界应力随发射角的增加而增大,最可能的位错发射角度为零度,直线裂纹尖端位错的发射比楔形裂纹尖端位错的发射更容易,硬基体抑制位错的发射。     

温度对金属材料钼位错发射的影响

应用关联参照模型、随位错位置变化的柔性位移边界条件和三维分子动力学方法研究了体心立方（ＢＣＣ）金属晶体钼在不同温度下裂尖发射位错的力学行为，随着温度的提高，不但发射位错的临界应力强度因子下降而且在同一应 度因子条件下，发射位错的数量出增加，位错速度和不全位错之间的扩展距离对温度不敏感，在位错发射过程中，发现了稳定的和不稳定的两个变形状态，在稳定的有状态，位错发射后，塞积在远离裂纹尖端处；必须增加外     

压电双材料界面钝裂纹附近螺型位错的屏蔽效应与发射条件

研究了压电双材料界面钝裂纹附近螺型位错的屏蔽效应与发射条件.应用保角变换技术,得到了复势函数与应力场的封闭形式解,讨论了位错方位、双材料电弹常数及裂纹钝化程度对位错屏蔽效应和发射条件的影响.结果表明,Burgers矢量为正的螺型位错可以降低界面钝裂纹尖端的应力强度因子(屏蔽效应),屏蔽效应随位错方位角及位错与裂纹尖端距...     

INTERACTION OF A DISLOCATION DIPOLE WITH A MODE III INTERFACE CRACK

Interaction between a screw dislocation dipole and a mode III interface crack is investigated. By using the complex variable method, the closed form solutions for complex potentials are obtained when a screw dislocation dipole lies inside a medium. The stress fields and the stress intensity factors at the tip of the interface crack produced by the screw dislocation dipole are given. The influence of the orientation, the dipole arm and the location of the screw dislocation dipole as well as the material mismatch on the stress intensity factors is discussed. The image force and the image torque acting on the screw dislocation dipole center are also calculated. The mechanical equilibrium position of the screw dislocation dipole is examined for various material property combinations and crack geometries. The results indicate that the shielding or anti-shielding effect on the stress intensity factor increases abruptly when the dislocation dipole approaches the tip of the crack. Additionally, the disturbation of the interface crack on the motion of the dislocation dipole is also significant.     

随机载荷下疲劳裂纹的闭合和扩展估算模型

本文分析了裂尖前,后方塑性区对闭合性能的影响,提出从裂尖塑性钝化量和尾迹区残余塑性变形两个方面来确定裂纹面的残余变形,并讨论了压缩载荷对闭合应力的影响,由此建立了一个疲劳裂纹闭合模型,然后通过模型“有限记忆”性质的假定将它应用到随机加载情况。用此模型对铝合金2219——T851受飞机谱载荷的CCT平面应力试件进行了疲劳寿命估算,估算值与实验结果接近。     

位错、裂纹与断裂

本文评述近些年来在位错、裂纹与断裂方面的研究进展.内容主要包括:①以屈服强度温度依赖性为例,讨论力学性能的结构敏感性,使其对位错芯结构与塑性之间的关系有一定的认识;②纯弹性断裂总是极少的,因之在加载应力作用下,裂纹顶端总是存在着或大或小的塑性区,存在着裂纹与位错的交互作用.这里以我们自己的工作为主,重点讨论裂端位错过程的研究结果.      

液体金属吸附促进位错发射的分子动力学研究

用第一原理算出Ｒｏｓｅ方程中的参量后,利用陈氏反演原理可以求出Ａｌ－Ｇａ和Ｃｕ－Ｇａ的对势;从而可研究Ａｌ和Ｃｉ裂纹表面吸附液体金属Ｇａ之后对裂尖发射位错的影响。结果表明,Ａｌ吸附Ｇａ后可使发射们错的临界应力强度因子从ＫＩｅ＝０．５ＭＰａｍ＾１／２,降为ＫＩｅ（Ｌ）＝０．４ＭＰａｍ＾１／２;对Ｃｕ则从ＫＩｅ＝０．５５ＭＰａｍ＾１／２降为ＫＩｅ（Ｌ）＝０．４５ＭＰａｍ＾１／２,即Ｇａ吸附后能促进位错     

纳米晶体铝在单轴拉伸下的位错堆积对微裂纹扩展的影响

摘要：针对纳米晶体材料,研究了单轴拉伸载荷作用下纳米晶体铝中的裂纹与裂纹尖端发射的位错所形成的滑移面之间的相互作用。通过分布位错法,将裂纹和滑移面等效为均匀分布的连续位错,获得了裂纹面上应力场。并引入裂纹尖端的无位错区,研究了裂纹尖端无位错区对微裂纹的萌生和主裂扩展之间的影响。结果表明,不考虑裂纹尖端无位错区时,裂纹长度较短,会先在晶界处形成微裂纹,主裂纹较长时,主裂纹会直接穿晶扩展。滑移面与裂纹尖端夹角较大时,会增加裂纹尖端发射的位错个数,从而抑制主裂纹的扩展。考虑裂纹尖端无位错区时,无位错区先于晶界处出现微裂纹,通过主裂纹与微裂纹之间位错的相互发射,导致裂纹与尖端处微裂纹汇合,有效加速了主裂纹的扩展。     

Nanoscale rotational deformation effect on dislocation emission from an elliptically blunted crack tip in nanocrystalline materials

A grain size-dependent model is theoretically established to describe the effect of a special physical micromechanism of plastic flow on the dislocation emission from an elliptical blunt crack tip in nanocrystalline solids. The micromechanism represents the fast nanoscale rotational deformation (NRD) occurring through collective events of ideal nanoscale shear near crack tips, which as a stress source is approximately equivalent to a quadrupole of wedge disclinations. By the complex variable method, the grain size-dependent criterion for the dislocation emission from an elliptical blunt crack tip is derived. The influence of the grain size and the features of NRD on the critical stress intensity factors for dislocation emission is evaluated. The results indicate that NRD releases the high stresses near the crack tip region and thereby enhances the critical stress intensity factor for dislocation emission. The NRD has great influence on the most probable angle for dislocation emission. The critical stress intensity factor will increase with the increment of the grain size, which means the emission of the dislocation becomes more difficult for larger grain size due to the effect of NRD.     

Peierls框架与裂纹尖端位错行为

本文在Ｐｅｉｅｒｌｓ框架下对裂纹尖端位错成核与发射问题进行了严格的数学分析，在修正Ｒｉｃｅ设相的基础上，建立了一组新的控制方程，应力场与位错密度场分别表示成第一类与第二类切比雪夫多项式的级数，相应的张开位移与滑错位移以用三角级数表示。通过离散的方法，控制方程转化为一组非线性代数方程。用Ｎｅｗｔｏｎ－Ｒａｐｈｓｏｎ方法求解这组方程，得到远场为纯剪，纯拉及两者复合情况下的解答。计算结果清楚地揭示了裂纹     

Crack tip dislocation distribution generated by external sources

The dislocation distribution function near a crack tip generated by external sources is calculated. It is qualitatively similar to the feature of crack tip emission but differed quantitatively by a large margin. The image forces tend to enlarge the negative dislocation zone but does not affect the shape of the curve.     

Exact solutions for piezoelectric screw dislocations near two asymmetrical edge cracks emanating from an elliptical hole

The interaction between piezoelectric screw dislocations and two asymmetrical interfacial cracks emanating from an elliptic hole under combined mechanical and electric load at infinity is dealt with. The closed-form solutions are derived for complex potentials and generalized stress fields. In the limiting cases, some well-known results can be obtained from the present solutions. Moreover, some new exact solutions are shown. The stress intensity factor and the energy release rate at the right tip due to a screw dislocation near the right interfacial crack are also calculated. The results show that the shielding effect of dislocation on crack expanding decreases with the increase in dislocation azimuth angle and the distance between the dislocation and the crack tip, and the repulsion acting on the dislocation from the other half plane demotes crack propagation. The increasing of the length of the other crack promotes crack growth, but the increasing of the minor semi-axis demotes it.     

关联参照模型和位错发射过程的分子动力学模拟

提出关联参照模型和随位错位置变化的柔性位移边界条件．提供了一个在固定位移边界条件下位错穿越边界的方法．应用三维分子动力学方法研究了体心立方（ＢＣＣ）金属晶体钼裂尖发射位错的力学行为．     

On a semi-infinite crack penetrating a piezoelectric circular inhomogeneity with a viscous interface

We investigate a semi-infinite crack penetrating a piezoelectric circular inhomogeneity bonded to an infinite piezoelectric matrix through a linear viscous interface. The tip of the crack is at the center of the circular inhomogeneity. By means of the complex variable and conformal mapping methods, exact closed-form solutions in terms of elementary functions are derived for the following three loading cases: (i) nominal Mode-III stress and electric displacement intensity factors at infinity; (ii) a piezoelectric screw dislocation located in the unbounded matrix; and (iii) a piezoelectric screw dislocation located in the inhomogeneity. The time-dependent electroelastic field in the cracked composite system is obtained. Particularly the time-dependent stress and electric displacement intensity factors at the crack tip, jumps in the displacement and electric potential across the crack surfaces, displacement jump across the viscous interface, and image force acting on the piezoelectric screw dislocation are all derived. It is found that the value of the relaxation (or characteristic) time for this cracked composite system is just twice as that for the same fibrous composite system without crack. Finally, we extend the methods to the more general scenario where a semi-infinite wedge crack is within the inhomogeneity/matrix composite system with a viscous interface.     

二维位错裂纹的稳定性分析

在已有的一维穿透位错裂纹模型及能量计算的基础上，将其推广为二维椭圆盘状裂纹模型，并计算了其能量．根据能量平衡原理，给出了位错裂纹模型的裂纹平衡尺寸、裂纹扩展临界应力．并与不考虑位错影响的宏观断裂力学中Ⅰ型穿透裂纹的Ｇｒｉｆｉｔｈ解及椭圆盘裂纹的Ｇｒｉｆｉｔｈ解加以比较．给出的位错裂纹模型解在位错数目ｎ＝０时与宏观断裂力学解一致     

Molecular-dynamics simulation-based cohesive zone representation of intergranular fracture processes in aluminum

A traction-displacement relationship that may be embedded into a cohesive zone model for microscale problems of intergranular fracture is extracted from atomistic molecular-dynamics (MD) simulations. An MD model for crack propagation under steady-state conditions is developed to analyze intergranular fracture along a flat Σ99 [1 1 0] symmetric tilt grain boundary in aluminum. Under hydrostatic tensile load, the simulation reveals asymmetric crack propagation in the two opposite directions along the grain boundary. In one direction, the crack propagates in a brittle manner by cleavage with very little or no dislocation emission, and in the other direction, the propagation is ductile through the mechanism of deformation twinning. This behavior is consistent with the Rice criterion for cleavage vs. dislocation blunting transition at the crack tip. The preference for twinning to dislocation slip is in agreement with the predictions of the Tadmor and Hai criterion. A comparison with finite element calculations shows that while the stress field around the brittle crack tip follows the expected elastic solution for the given boundary conditions of the model, the stress field around the twinning crack tip has a strong plastic contribution. Through the definition of a Cohesive-Zone-Volume-Element—an atomistic analog to a continuum cohesive zone model element—the results from the MD simulation are recast to obtain an average continuum traction-displacement relationship to represent cohesive zone interaction along a characteristic length of the grain boundary interface for the cases of ductile and brittle decohesion.     

Higher order fields for damaged nonlinear antiplane shear notch, crack and inclusion problems

Damaged nonlinear antiplane shear problems with a variety of singularities are studied analytically. A deformation plasticity theory coupled with damage is employed in analysis. The effect of microscopic damage is considered in terms of continuum damage mechanics approach. An exact solution for the general damaged nonlinear singular antiplane shear problem is derived in the stress plane by means of a hodograph transformation, then corresponding higher order asymptotic solutions are obtained by reversing the stress plane solution to the physical plane. As example, traction free sharp notch and crack, rigid sharp wedge and flat inclusion, and mixed boundary sharp notch problems are investigated, respectively. Consequently, higher order fields are obtained, in which analytical expressions of the dominant and second order singularity exponents and angular distribution functions of the near tip fields are derived. Effects of the damage and hardening exponents of materials and the geometric angle of notch/wedge on the near tip quantities are discussed in detail. It is found that damage leads to a weaker dominant singularity of stress, but to little stronger singularities of the dominant and second order terms of strain compared to that for undamaged material. It is also seen that damage has important effect on the angular distribution functions of the near tip stress and strain fields. As special cases, higher order analytical solutions of the crack and rigid flat inclusion tip fields are obtained, respectively, by reducing the notch/wedge tip solutions. Effects of damage and hardening exponents on the dominant and second order terms in the solutions of the crack and inclusion tip fields are discussed.     

A piezoelectric screw dislocation near a wedge-shaped bi-material interface

The electro-elastic stress field due to a piezoelectric screw dislocation near the tip of a wedge-shaped bi-material interface is derived. The screw dislocation is subjected to a line charge and a line force at the core. The explicit closed-form analytical solutions for the stress field are derived by means of the complex variable and conformal mapping methods. The stress and electric intensity factors of the wedge tip induced by the dislocation and the image force acting on the dislocation are also formulated and calculated. The influence of the wedge angle and the different bi-material constant combinations on the image force is discussed. Numerical results for three particular wedge angles are calculated and compared.     

Cracking characteristics of mixed mode dislocations near a lip-like mode crack

This work is concerned with the cracking characteristics of mixed mode dislocations near a lip-like mode crack, stress intensity and strain energy density factor are obtained by using conformal mapping, singularity analysis and Cauchy integrals. Shielding effect generated by screw dislocation near a lip-like mode crack decreases with the increment of the distance between screw dislocation and crack tip. Larger distance between two faces of the crack leads to the shielding effect waning. The strain energy density factor of mode III decreases with the increment of the distance between dislocation and crack tip. Larger distance between two faces of lip-like mode crack also leads to the strain energy density factor waning and encourages crack initiation; the shielding effects generated by edge dislocation near the crack decrease with the increment of the distance between edge dislocation and crack tip.     

Effect of temperature on dislocation emission from crack tip for BCC metal Mo

The effect of thermally activated energy on the dislocation emission from a crack tip in BCC metal Mo is simulated in this paper. Based on the correlative reference model on which the flexible displacement boundary scheme is introduced naturally, the simulation shows that as temperature increases the critical stress intensity factor for the first dislocation emission will decrease and the total number of emitted dislocations increase for the same external load. The dislocation velocity and extensive distance among partial dislocations are not sensitive to temperature. After a dislocation emission, two different deformation states are observed, the stable and unstable deformation states. In the stable deformation state, the nucleated dislocation will emit from the crack tip and piles up at a distance far away from the crack tip, after that the new dislocation can not be nucleated unless the external loading increases. In the unstable deformation state, a number of dislocations can be emitted from the crack tip continuously under the same external load. The project is supported by the National Natural Science Foundation of China.