NBTI效应导致SET脉冲在产生与传播过程中的展宽

本文研究了负偏置温度不稳定性(NBTI)对单粒子瞬态(SET)脉冲产生与传播过程的影响.研究结果表明:NBTI能够导致SET脉冲在产生与传播的过程中随时间而不断展宽.本文还基于工艺计算机辅助设计模拟软件(TCAD)进行器件模拟,提出了一种在130nm体硅工艺下,计算SET脉冲宽度的解析模型,并结合NBTI阈值电压退化的...     

0.18μm NMOS的重离子单粒子瞬态脉冲的仿真模拟

为了详细地了解纳米MOS电路中单粒子瞬变电荷收集机理,利用ISETCAD软件仿真二维模拟0.18μm NMOS的单粒子瞬态脉冲。通过进行三种不同的电路连接方式和不同的粒子注入位置的仿真,得到了一系列单粒子瞬态电流脉冲(SET)与时间的关系曲线。分析了不同电路连接方式和注入位置对SET的峰值和脉宽的影响。为下一步建立SET的精确模型进行SET效应的模拟做基础的研究。     

0.18um NMOS的重离子单粒子瞬态脉冲的仿真模拟

摘要：为了详细的了解纳米MOS电路中单粒子瞬变电荷收集机理,利用ISETCAD软件仿真二维模拟0.18um NMOS的单粒子瞬态脉冲。通过进行三种不同的电路连接方式和不同的粒子注入位置的仿真,得到了一系列单粒子瞬态电流脉冲（SET）与时间的关系曲线。分析了不同电路连接方式和注入位置对SET的峰值和脉宽的影响。为下一步建立SET的精确模型进行SET效应的模拟做基础的研究。     

用直接隧道栅电流在线表征PMOSFET负偏压温度不稳定性

本文提出了一种在线表征负偏压温度不稳定性(NBTI,negative bias temperature insta-bility)退化的方法--直接隧道栅电流表征法(DTGCM,DT Gate Current Method)。用这种方法可以得到NBTI应力诱生在超薄栅氧化层中的缺陷密度(包括氧化层体陷阱密度和界面态密度),并得到PMOSFET器件阈值电压的漂移(ΔVth)信息。这种方法可以有效避免NBTI恢复效应的影响。     

沟道宽度对65nm金属氧化物半导体器件负偏压温度不稳定性的影响研究

随着MOS器件尺寸缩小,可靠性效应成为限制器件寿命的突出问题.PMOS晶体管的负偏压温度不稳定性（NBTI）是其中关键问题之一.NBTI效应与器件几何机构密切相关.本文对不同宽长比的65nm工艺PMOSFET晶体管开展了NBTI试验研究.获得了NBTI效应引起的参数退化与器件结构的依赖关系,试验结果表明65nm PMOSFET的NBTI损伤随沟道宽度减小而增大.通过缺陷电荷分析和仿真的方法,从NBTI缺陷产生来源和位置的角度,揭示了产生该结果的原因.指出浅槽隔离（STI）区域的电场和缺陷电荷是导致该现象的主要原因.研究结果为器件可靠性设计提供了参考.     

PDSOI工艺下单粒子瞬态脉冲宽度分析

单粒子瞬态脉冲宽度是评价电子系统软错误率的重要参数之一。针对0.13 μm、部分耗尽型绝缘体上硅(PDSOI)工艺下的反相器链,解析地计算了反相器中产生的单粒子瞬态脉冲宽度,仿真了产生的单粒子瞬态脉冲在反相器链中传播时的临界脉冲宽度和传输率随级数变化情况。仿真结果表明,单粒子瞬态脉冲宽度的大小在几十皮秒到几百皮秒之间,反相器链的级数对临界脉冲宽度和传输率影响较大。最后仿真得到在输入单粒子瞬态脉冲宽度较小时,建立保持时间与输入脉冲宽度有关。该结果有利于电气掩蔽建模和锁存掩蔽建模准确性的提高。     

深亚微米CMOS反相器的单粒子瞬态效应研究

针对小尺寸CMOS反相器的单粒子瞬态效应,分别采用单粒子效应仿真和脉冲激光模拟试验两种方式进行研究。选取一种CMOS双反相器作为研究对象,确定器件的关键尺寸,并进行二维建模,完成器件的单粒子瞬态效应仿真,得到单粒子瞬态效应的阈值范围。同时,开展脉冲激光模拟单粒子瞬态效应试验,定位该器件单粒子瞬态效应的敏感区域,捕捉不同辐照能量下器件产生的单粒子瞬态脉冲,确定单粒子瞬态效应的阈值范围,并与仿真结果进行对比分析。     

SiGeBiCMOS线性器件脉冲激光单粒子瞬态效应研究

验证SiGe BiCMOS工艺线性器件的单粒子瞬态（Single Event Transient,SET）效应敏感性,选取典型运算放大器THS4304和稳压器TPS760进行了脉冲激光试验研究。试验中,通过能量逐渐逼近方法确定了其诱发SET效应的激光阈值能量,并通过逐点扫描的办法分析了器件内部单粒子效应敏感区域,并在此基础上分析了脉冲激光能量与SET脉冲的相互关系,获得了单粒子效应截面,为SiGe BiCMOS工艺器件在卫星电子系统的筛选应用以及抗辐射加固设计提供数据参考。     

高速PWM单粒子瞬态效应脉冲激光模拟试验研究

利用脉冲激光验证高速脉宽调制控制器（Pulse Width Modulator,PWM）单粒子瞬态效应的敏感性和防护设计。试验中,通过改变脉冲激光能量,逐步扫描PWM控制器电路,确定了诱发单粒子瞬态效应的激光能量阈值和敏感区域。通过改变PWM控制器软启动配置电路设计,验证了防护电路设计的合理性,为卫星电源子系统的单粒子瞬态效应防护设计提供技术参考。     

Negative bias temperature instability induced single event transient pulse narrowing and broadening

The effect of negative bias temperature instability(NBTI) on a single event transient(SET) has been studied in a 130 nm bulk silicon CMOS process based on 3D TCAD device simulations.The investigation shows that NBTI can result in the pulse width and amplitude of SET narrowing when the heavy ion hits the PMOS in the high-input inverter;but NBTI can result in the pulse width and amplitude of SET broadening when the heavy ion hits the NMOS in the low-input inverter.Based on this study,for the first time we ...     

Line-edge roughness induced single event transient variation in SOI FinFETs

The impact of process induced variation on the response of SOI FinFET to heavy ion irradiation is studied through 3-D TCAD simulation for the first time. When FinFET biased at OFF state configuration (V_gs=0, V_ds=V_dd) is struck by a heavy ion, the drain collects ionizing charges under the electric field and a current pulse (single event transient, SET) is consequently formed. The results reveal that with the presence of line-edge roughness (LER), which is one of the major variation sources in nano-scale FinFETs, the device-to-device variation in terms of SET is observed. In this study, three types of LER are considered: type A has symmetric fin edges, type B has irrelevant fin edges and type C has parallel fin edges. The results show that type A devices have the largest SET variation while type C devices have the smallest variation. Further, the impact of the two main LER parameters, correlation length and root mean square amplitude, on SET variation is discussed as well. The results indicate that variation may be a concern in radiation effects with the down scaling of feature size.     

New insight on negative bias temperature instability degradation with drain bias of 28 nm High-K Metal Gate p-MOSFET devices

The degradation of negative bias temperature instability (NBTI) on 28 nm High-K Metal Gate (HKMG) p-MOSFET devices under non-uniform stress condition has been systematically studied. We found the asymmetry between forward and reverse Idsat shift under non-uniform stress condition is significant for long channel devices even under low drain bias stress (e.g., Vds = −0.1 V and gate channel length L = 1 μm), and seems to be dominated by a minimally required critical length (L = 0.2 μm derived from the experimental data). To the authors’ best knowledge, these are new phenomena reported. We attribute these anomalous NBTI characteristics with drain bias to the local self-heating (LSH) activated NBTI degradation mechanism. One semi-empirical analytical model, which fits well with our experimental data, is then proposed in this paper.     

Analysis of single event transient pulse-width in 65 nm commercial radiation-hardened logic cell

With the critical charge reduced to generate a single event effect (SEE) and high working frequency for a nanometer integrated circuit, the single event effect (SET) becomes increasingly serious for high performance SOC and DSP chips. To analyze the radiation-hardened method of SET for the nanometer integrated circuit, the n⁺ guard ring and p⁺ guard ring have been adopted in the layout for a 65 nm commercial radiation-hardened standard cell library. The weakest driving capacity inverter cell was used to evaluate the single event transient (SET) pulse-width distribution. We employed a dual-lane measurement circuit to get more accurate SET''s pulse-width. Six kinds of ions, which provide LETs of 12.5, 22.5, 32.5, 42, 63, and 79.5 MeV·cm²/mg, respectively, have been utilized to irradiate the SET test circuit in the Beijing Tandem Accelerator Nuclear Physics National Laboratory. The testing results reveal that the pulse-width of most SETs is shorter than 400 ps in the range of LET_eff from 12.5 MeV·cm²/mg to 79.5 MeV·cm²/mg and the pulse-width presents saturation tendency when the effective linear energy transfer (LET_eff) value is larger than 40 MeV·cm²/mg. The test results also show that the hardened commercial standard cell''s pulse-width concentrates on 33 to 264 ps, which decreases by 40% compared to the pulse-width of the 65 nm commercial unhardened standard cell.     

Recovery of negative bias temperature instability induced degradation of p-MOSFETs with SiON gate dielectric

This paper investigates the recovery property of p-MOSFETs with an ultra-thin SiON gate dielectric which are degraded by negative bias temperature instability (NBTI). The experimental results indicate that the recovery of the NBTI degradation occurs through an electrical neutralization of the NBTI-induced positive charges at the SiON/Si interface and in the gate dielectric. The neutralization of interface charges was a fast process occurring just after the device returned to the recovery state. The neutralization of positive charges in the gate dielectric was a slow process associated with the electron injection into the gate dielectric. Below the gate voltage for strong accumulation, the amount of recovery increased with an increase of the gate voltage. A further increase of gate voltage did not affect the amount of recovery. These experimental results indicate that the major cause of the recovery is a neutralization of the NBTI-induced positive charges by electrons instead of a hydrogen passivation of the NBTI-induced defect sites.     

Experimental study on the single event latchup simulated by a pulse laser

This paper introduces major characteristics of the single event latchup (SEL) in CMOS devices. We accomplish SEL tests for CPU and SRAM devices through the simulation by a pulse laser. The laser simulation results give the energy threshold for samples to undergo SEL. SEL current pulses are measured for CMOS devices in the latchup state, the sensitive areas in the devices are acquired, the major traits, causing large scale circuits to undergo SEL, are summarized, and the test equivalence between a pulse laser and ions is also analyzed.     

脉冲激光模拟单粒子锁定试验研究

This paper introduces major characteristics of the single event latchup（SEL） in CMOS devices.We accomplish SEL tests for CPU and SRAM devices through the simulation by a pulse laser.The laser simulation results give the energy threshold for samples to undergo SEL.SEL current pulses are measured for CMOS devices in the latchup state,the sensitive areas in the devices are acquired,the major traits,causing large scale circuits to undergo SEL,are summarized,and the test equivalence between a pulse laser and ions is also analyzed.     

Voltage dependent degradation of HfSiON/SiO2 nMOSFETs under positive bias temperature instability

This paper investigates voltage-dependent degradation of HfSiON/SiO₂ nMOSFETs under conditions of positive bias temperature instability (PBTI), and proposes a PBTI degradation model that can use data from acceleration tests to predict device lifetime accurately. Experimental results show that the PBTI stress generated shallow traps in HfSiON and the exponent of power-law for threshold-voltage shift increased exponentially with an increase of PBTI stress voltage. An enhancement factor that represents creation of shallow charge traps in gate dielectric by PBTI stress was included in the proposed model. The proposed model predicted operational lifetime t_L = 1.64 × 10¹⁰ s, which agreed well with the t_L = 1.92 × 10¹⁰ s measured at low gate stress voltage, whereas the conventional model overestimates t_L by an order of magnitude, demonstrating that the proposed model is very useful on shortening the measurement time for estimating t_L of high-k nMOSFETs.     

电荷共享对于CMOS逻辑门单粒子瞬态响应的影响

随着CMOS工艺继续缩小,单粒子瞬态脉冲已经成为航天用数字电路的重要故障来源。同时,相邻晶体管之间的电荷共享也随之增加并导致组合电路中单粒子瞬态脉宽缩短,即脉宽抑制效应。之前的文献提出了PMOS到PMOS的脉宽抑制,而本文提出了三种新的脉宽抑制机理(NMOS到PMOS,PMOS到NMOS和NMOS到NMOS),并且通过90纳米三维工艺混合仿真进行了验证。本文的贡献主要有以下三点：1）除了PMOS到PMOS的情况,90纳米工艺下脉宽抑制在PMOS到NMOS和NMOS到NMOS中同样比较明显;2）脉宽抑制效应总体上与粒子入射能量关系较弱,而与粒子入射角度和版图结构(晶体管间距和N阱接触)关系较强。3）紧凑的版图和级联反向单元可以用来促进组合电路中的单粒子瞬态脉宽抑制效应。