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1.
Pyromellitic dianhydride‐based dianhydrides with bulky substituents, such as 1‐phenyl pyromellitic dianhydride and 1‐(4′‐trifluoromethylphenyl)pyromellitic dianhydride, were combined with bis(3‐aminophenyl)phenylphosphine oxide and 4,4′‐phenylene diamine to prepare polyimides with low coefficient of thermal expansion (~ 17 ppm/°C) and good adhesion (>100 g/mm). The polyimides were synthesized via a conventional two‐step process: preparation of poly(amic‐acid) followed by solution imidization with o‐dichlorobenzene. The molecular weights of the polyimides were controlled to 25,000 g/mol via off‐stoichiometry and the synthesized polyimides were characterized by Fourier transform infrared, nuclear magnetic resonance, differential scanning calorimetry, and thermogravimetric analysis. Their intrinsic viscosity and solubility were also measured, while adhesive property was measured via T‐peel test samples of Cu/polyimide. © 2010 Wiley Periodicals, Inc. J Appl Polym Sci, 2010  相似文献   

2.
A polyfluorinated aromatic diamine, 3,3′, 5,5′‐tetrafluoro‐4,4′‐diaminodiphenylmethane (TFDAM), was synthesized and characterized. A series of polyimides, PI‐1–PI‐4, were prepared by reacting the diamine with four aromatic dianhydrides via a one‐step high‐temperature polycondensation procedure. The obtained polyimide resin had moderate inherent viscosity (0.56–0.68 dL/g) and excellent solubility in common organic solvents. The polyimide films exhibited good thermal stability, with an initial thermal decomposition temperature of 555°C–621°C, a 10% weight loss temperature of 560°C–636°C, and a glass‐transition temperature of 280°C–326°C. Flexible and tough polyimide films showed good tensile properties, with tensile strength of 121–138 MPa, elongation at break of 9%–12%, and tensile modulus of 2.2–2.9 GPa. The polyimide films were good dielectric materials, and surface and volume resistance were on the order of a magnitude of 1014 and 1015 Ω cm, respectively. The dielectric constant of the films was below 3.0 at 1 MHz. The polyfluorinated films showed good transparency in the visible‐light region, with a cutoff wavelength as low as 302 nm and transmittance higher than 70% at 450 nm. © 2006 Wiley Periodicals, Inc. J Appl Polym Sci 103: 1442–1449, 2007  相似文献   

3.
Having previously demonstrated that the polyimide derived from 3,3′,4,4′‐biphenyltetracarboxylic dianhydride (BPDA) and 1,2‐bis(4‐aminophenoxy)benzene [termed triphenyl ether catechol diamine (TPEC)] exhibited superior tensile properties in addition to good thermal properties, we now provide a preliminary assessment of the properties of the copolyimides prepared from BPDA, TPEC, and another aromatic diamine. The homopolyimides derived from BPDA and many aromatic diamines generally possessed good mechanical properties and thermal properties; however, they were insoluble in available organic solvents. In several cases, organosoluble BPDA copolyimides could be prepared from BPDA and equimolar mixtures of TPEC and another aromatic diamine. All the copolyimides could be formed into tough films with high moduli and strengths and, in most cases, high extensions to break. © 2002 Wiley Periodicals, Inc. J Appl Polym Sci 84: 351–358, 2002; DOI 10.1002/app.10342  相似文献   

4.
A novel aromatic diamine, 1,1‐bis(4‐amino‐3,5‐dimethylphenyl)‐1‐(3,4,5‐trifluorophenyl)‐2,2,2‐trifluoroethane, containing a pendant polyfluorinated phenyl group, a trifluoromethyl group, and methyl groups ortho‐substituted to the amino groups in the structure was synthesized and characterized. The diamine was polymerized with several aromatic dianhydrides, including 3,3′,4,4′‐biphenyltetracarboxylic dianhydride, 3,3′,4,4′‐benzophenonetetracarboxylic dianhydride, 4,4′‐oxydiphthalic anhydride, and 4,4′‐hexafluoroisopropylidene diphthalic anhydride, via a high‐temperature one‐step procedure to afford four polyimides (PIs) with inherent viscosities of 0.47–0.70 dL/g. The PIs exhibited excellent solubilities in a variety of organic solvents. They were soluble not only in polar aprotic solvents but in many common solvents, such as cyclopentanone, tetrahydrofuran, and even toluene at room temperature. The tough and flexible PI films cast from the PI solutions exhibited good thermal stabilities and acceptable tensile properties. The glass‐transition temperatures were in the range 312–365°C, and the 5% weight loss temperatures were all higher than 480°C in nitrogen. The films had tensile strengths in the range 76–99 MPa, tensile moduli of 2.2–2.8 GPa, and elongations at break of 5–8%. In addition, the PI films exhibited excellent transparency in the visible light region with cutoff wavelength as low as 302 nm and transmittance higher than 88% at the wavelength of 450 nm. The PI films showed low dielectric constants ranging from 2.50–2.68 and low moisture absorptions of less than 0.56%. The good combined properties of the PIs mainly resulted from the synergic effects of the different substituents. © 2008 Wiley Periodicals, Inc. J Appl Polym Sci, 2009  相似文献   

5.
New polyimides with enhanced thermal stability and high solubility were synthesized in common organic solvents from a new dianhydride, 2,2′‐dibromo‐4,4′,5,5′‐benzophenone tetracarboxylic dianhydride (DBBTDA). DBBTDA was used as monomer to synthesize polyimides by using various aromatic diamines. The polymers were characterized by IR and NMR spectroscopy and elemental analysis. These polyimides had good inherent viscosities in N‐methyl‐2‐pyrrolidinone (NMP) and also high solubility and excellent thermo‐oxidative stability, with 5 % weight loss in the range 433 to 597 °C. Copyright © 2004 Society of Chemical Industry  相似文献   

6.
A series of nine films were prepared via phenol‐catalyzed thermal crosslinking reactions of 1,9‐bis‐ [glycidyloxypropyl]pentasiloxanes {1,9‐bis[glycidyloxypro‐ pyl]decamethylpentasiloxane (I), 1,9‐bis[glycidyloxypropyl]‐3,5,7‐tris(3′,3′,3′‐trifluoropropyl)heptamethylpentasiloxane (II), and 1,9‐bis[glycidyloxypropyl]‐3,5,7‐tris(1H,1H,2H, 2H‐perfluorooctyl)heptamethylpentasiloxane (III)} with α,ω‐diaminoalkanes [1,6‐diaminohexane (a), 1,8‐diaminooctane (b), and 1,12‐diaminododecane (c)]. The crosslink density was controlled by the choice of a–c. The cure behavior of I–III with a–c was studied with differential scanning calorimetry. The mechanical properties of the films were determined by dynamic mechanical thermal analysis. Their thermal stability was analyzed by thermogravimetric analysis. The surface properties of the films were evaluated with static contact‐angle measurements. These films represented a novel class of epoxies with an unusual combination of properties: high flexibility (low glass‐transition temperature), good thermal stability, and hydrophobic surfaces. © 2004 Wiley Periodicals, Inc. J Appl Polym Sci 94: 203–210, 2004  相似文献   

7.
A soluble polyimide was synthesized from 2,2′‐bis[4‐(3,4‐dicarboxyphenoxy)phenyl]propane dianhydride (BPADA) and 3,3′‐dimethyl‐4,4′‐diaminodiphenylmethane (DMMDA) by a two‐step method, and it had good solubility both in strong bipolar solvents and in common low‐boiling‐point solvents. The BPADA–DMMDA polyimide was dissolved in chloroform (CHCl3) and cast onto a glass substrate in a humid atmosphere. The BPADA–DMMDA/CHCl3 solution easily formed honeycomb films. Some affecting factors, such as the polymer solution concentration, atmospheric humidity, and solvent volatility, were tested. © 2007 Wiley Periodicals, Inc. J Appl Polym Sci, 2008  相似文献   

8.
A series of polyimides were prepared from 2,3,2′,3′‐oxydiphthalic anhydride (3,3′‐ODPA) with various aromatic diamines via three different synthetic procedures. The one‐step and two‐step methods with the thermal imidization of poly(amic acids) (PAAs) yielded polyimides with a relatively low inherent viscosity; these produced brittle films. The polyimides prepared by the two‐step method via the chemical imidization of PAA precursors exhibited a higher inherent viscosity and afforded tough and creaseable films. All the 3,3′‐ODPA based polyimides had a significantly higher solubility than the corresponding polyimides from 3,4,3′,4′‐oxydiphthalic anhydride. The films cast from 3,3′‐ODPA polyimides also showed high optical transparencies and less color, with an ultraviolet–visible absorption edge of 370–397 nm and low yellowness index values of 11.3–29.8. These polyimides exhibited glass‐transition temperatures in the range 211–289°C and showed no significant decomposition below 500°C under nitrogen or air atmospheres. © 2005 Wiley Periodicals, Inc. J Appl Polym Sci 97: 1352–1360, 2005  相似文献   

9.
The microwave assisted polycondensation of two polyimides were studied using pyromellitic dianhydride (PMDA), and 4,4′‐(hexafluoroisopropyliden)diphthalic anhydride (6FDA) as dianhydride monomers and 2,4,6‐trimethyl‐m‐phenylenediamine (TrmPD), as diamine monomer, under microwave irradiation in DMF and DMSO solvents. The structure and performance of polymers were characterized by Fourier Transform Infrared Spectroscopy (FTIR), viscosity, density, and Thermogravimetric Analysis (TGA). The results show that the polyimides can be obtained in a short reaction time with high intrinsic viscosity and high yield. The effect of the presence of a bridging group, ? C(CF3)2? , in the monomer structure is apparent in the permeability parameters of the macromolecules as polymer (6FDA‐TrmPD) always presents better results than polymer (PMDA‐TrmPD). Properties as density and Tg increases with the time exposition to the microwave irradiation. Polyimides obtained present good thermal properties because they began to lose weight in a range of 8–16% at high temperature as 450°C. © 2010 Wiley Periodicals, Inc. J Appl Polym Sci, 2010  相似文献   

10.
A series of polyimide (PI) thin films were synthesized based on bis[3,5‐dimethyl‐4‐(4‐aminophenoxy)phenyl]methane and conventional aromatic dianhydrides. The structures and properties of the thin films were measured with Fourier transform infrared, NMR, thermogravimetric analysis, dynamic mechanical analysis, and impedance analysis. The PI films exhibited glass‐transition temperatures in the range of 211–300°C and possessed initial thermal decomposition temperature reaching up to 457–482°C in air and 461–473°C in nitrogen. Some PI films had high solubility in organic solvents such as 1‐methyl‐2‐pyrrolidinone, N,N‐dimethylformamide, N,N‐dimethylacetamide, dimethyl sulfoxide, m‐cresol, tetrahydrofuran, and CHCl3. The mechanical properties of these films were also examined. The dielectric constants of the films were in the range of 2.8–3.3 at 25°C. © 2007 Wiley Periodicals, Inc. J Appl Polym Sci 104: 1265–1270, 2007  相似文献   

11.
As one member of high performance fibers, aromatic polyimide fibers possess many advantages, such as high strength, high modulus, high and low temperature resistance, and radiation resistance. However, the preparation of the high performance fibers is so difficult that the commercial fibers have not been produced except P84 with good flame retardancy. In this report, a polyimide was synthesized from 3,3′,4,4′‐biphenyltetracarboxylic dianhydride (BPDA) and 4,4′‐oxydianiline (ODA) and the fibers were prepared from its solution by a dry‐jet wet‐spinning process. The formation of the as‐spun fibers in different coagulation bath composition was discussed. Scanning electron microscope (SEM) was employed to study the morphology of the as‐spun fibers. As a result, the remnant solvent existed in the as‐spun fibers generated from coagulation bath of alcohol and water. There were many fibrils and microvoids with the dimension of tens of nanometers in the fibers. One could observe the obvious fibrillation and the drawn fibers. The measurement for the mechanical properties of the fibers with a drawing ratio of 5.5 indicated that tensile strength and initial modulus were 2.4 and 114 GPa, respectively. © 2004 Wiley Periodicals, Inc. J Appl Polym Sci 93: 669–675, 2004  相似文献   

12.
A series of bismaleimides was synthesized from bis(4‐amino‐3, 5‐dimethylphenyl) (X) phenyl methane (X = 3′chloro, 3′‐bromo, 3′‐benzyloxy, 4′‐chloro, 4′‐fluoro) and maleic anhydride. The bismaleimides were subsequently polymerized with various diamines by Michael addition to yield novel polyaspartimides. All the polymers exhibited good solubility in organic solvents and the inherent viscosity of the polymers were in the range of 0.40–0.56 dL/g, which is good enough to fabricate composites and films. The temperature at which 10% weight loss occurred was in the range of 390–441°C. The polymers had high glass transition temperature in the range of 205–275°C and left about 31.95–84.20% char yield at 800°C indicating that they have good self‐extinguishing property. © 2008 Wiley Periodicals, Inc. J Appl Polym Sci, 2008  相似文献   

13.
Most polyolefins that are used for dielectric materials exhibit a low dielectric constant and operating temperatures up to 70°C. Polyimides offer a means to a higher dielectric constant material by the introduction of a polar group in the polymer backbone and are thermally stable at temperatures exceeding 250°C. A common dianhydride, pyromellitic dianhydride (PMDA), is reacted with various short‐chain diamines to produce polymers with high imide density. Homopolymers and copolymers synthesized had dielectric constants ranging from 3.96 to 6.57. These materials exhibit a dielectric constant twice that of biaxially oriented polypropylene and therefore a twofold increase in capacitance as well as maintaining low dissipation factors that are acceptable for this application. The experimental dielectric constants of these materials are also compared to density functional theory calculations and exhibit a close relationship. © 2013 Wiley Periodicals, Inc. J. Appl. Polym. Sci. 130: 1276‐1280, 2013  相似文献   

14.
A new kind of aromatic unsymmetrical diamine monomer containing thiazole ring, 2-amino-5-[4-(4′-aminophenoxy)phenyl]-thiazole (APPT), was synthesized. A series of novel polyimides were prepared by polycondensation of APPT with various aromatic dianhydrides via one-step process. The resulting polyimides held inherent viscosities of 0.40-0.71 dL/g and were easily dissolved in strong dipolar solvents. Meanwhile, strong and flexible polyimide films were obtained, which had thermal stability with the glass transition temperatures (Tg) of 268.2-328.8 °C in nitrogen, the temperature at 5% weight loss of 452-507 °C in nitrogen and 422-458 °C in air, and the residue at 800 °C of 54.18-63.33% in nitrogen, as well as exhibited outstanding mechanical properties with the tensile strengths of 105.4-125.3 MPa, elongations at breakage of 6-13%. These films also held dielectric constants of 3.01-3.18 (10 MHz) and showed predominantly amorphous revealed by wide-angle X-ray diffraction measurements.  相似文献   

15.
A series of novel aromatic polyimides were synthesized from N,N‐di(4‐aminophenyl)‐N′,N′‐diphenyl‐4,4′‐oxydianiline and aromatic tetracarboxylic dianhydrides through a conventional two‐step procedure. Most of the polyimides exhibited reasonable solubility in organic solvents and could afford robust films via solution casting. The polyimides exhibited high thermal stability, with glass transition temperatures in the range 227–273 °C and 10% weight‐loss temperatures in excess of 550 °C. All the polyimide films showed ambipolar redox and multi‐electrochromic behaviors. They exhibited two reversible oxidation redox couples at 0.94–0.98 and 1.09–1.12 V versus Ag/AgCl in acetonitrile solution. A coupling reaction between the radical cations of the pendent triphenylamine units occurred during the oxidative process forming a tetraphenylbenzidine structure which resulted in an additional redox state and color change. © 2014 Society of Chemical Industry  相似文献   

16.
Two new aromatic diamines, 2,2′‐dibromo‐4,4′‐oxydianiline (DB‐ODA 4 ) and 2,2′,6,6′‐tetrabromo‐4,4′‐oxydianiline (TB‐ODA 5 ), have been synthesized by oxidation, bromination, and reduction of 4,4′‐oxydianiline (4,4′‐ODA). Novel polyimides 6a–f and 7a–f were prepared by reacting DB‐ODA ( 4 ) and TB‐ODA ( 5 ) with several dianhydrides by one‐step method, respectively. The inherent viscosities of these polyimides ranged from 0.31 to 0.99 dL/g (0.5 g/dL, in NMP at 30°C). These polyimides showed enhanced solubilities compared to those derived from 4,4′‐oxydianiline and corresponding dianhydrides. Especially, polyimides 7a , derived from rigid PMDA and TB‐ODA ( 5 ) can also be soluble in THF, DMF, DMAc, DMSO, and NMP. These polyimides also exhibited good thermal stability. Their glass transition temperatures measured by thermal mechanical analysis (TMA) ranged from 251 to 328°C. When the same dianhydrides were used, polyimides 7 containing four bromide substituents had higher glass transition temperatures than polyimides 6 containing two bromide substituents. The effects of incorporating more polarizable bromides on the refractive indices of polyimides were also investigated. The average refractive indices (nav) measured at 633 nm were from 1.6088 to 1.7072, and the in‐plane/out‐of‐plane birefringences (Δn) were from 0.0098 to 0.0445. It was found that the refractive indices are slightly higher when polyimides contain more bromides. However, this effect is not very obvious. It might be due to loose chain packing resulted from bromide substituents at the 2,2′ and 2,2′,6,6′ positions of the oxydiphenylene moieties. © 2010 Wiley Periodicals, Inc. J Appl Polym Sci, 2010  相似文献   

17.
We report a new method for the preparation of asymmetric diamines using 4,4′‐oxydianiline (4,4′‐ODA) as the starting material. By controlling the equivalents of bromination agent, N‐bromosuccinimide, we were able to attach bromide and phenyl substituents at the 2‐ or 2,2′,6‐positions of 4,4′‐ODA. Thus, four new asymmetric aromatic diamines, 2‐bromo‐4,4′‐oxydianiline (6), 2,2′,6‐tribromo‐4,4′‐oxydianiline (7), 2‐phenyl‐4,4′‐oxydianiline (8) and 2,2′,6‐triphenyl‐4,4′‐oxydianiline (9), were synthesized by this method. Their structural asymmetry was confirmed using 1H NMR spectroscopy. Asymmetric polyimides (PI10–PI13) were prepared from these diamines and three different dianhydrides (pyromellitic dianhydride (PMDA), 3,3′,4,4′‐biphenyltetracarboxylic dianhydride and 2,2‐bis(3,4‐dicarboxyphenyl)hexafluoropropane dianhydride) in refluxing m‐cresol. The formed polyimides, except PI10a derived from 6 and PMDA, were all soluble in m‐cresol without premature precipitation during polymerization. These polyimides with inherent viscosity of 0.41–0.96 dL g?1, measured at a concentration of 0.5 g dL?1 in N‐methyl‐2‐pyrrolidone at 30 °C, can form tough and flexible films. Because of the structural asymmetry, they also exhibited enhanced solubility in organic solvents. Especially, polyimides PI11a and PI13a derived from 7 and 9 with rigid PMDA were soluble in various organic solvents at room temperature. The structural asymmetry of the prepared polyimides was also evidenced from 1H NMR spectroscopy. In the 1H NMR spectrum of PI11a, the protons of pyromellitic moiety appeared in an area ratio of 1:2:1 at three different chemical shifts, which were assigned to head‐to‐head, head‐to‐tail and tail‐to‐tail configurations, respectively. These polyimides also exhibited good thermal stability. Their glass transition temperatures ranged from 297 to 344 °C measured using thermal mechanical analysis. © 2013 Society of Chemical Industry  相似文献   

18.
A novel fluorinated diamine monomer, 2,2‐bis[4‐(4‐amino‐2‐trifluoromethylphenoxy)phenyl]propane (2), was prepared through the nucleophilic substitution reaction of 2‐chloro‐5‐nitrobenzotrifluoride with 2,2‐bis(4‐hydroxyphenyl)propane in the presence of potassium carbonate, followed by catalytic reduction with hydrazine and Pd/C. Polyimides were synthesized from diamine 2 and various aromatic dianhydrides 3a–f via thermal imidization. These polymers had inherent viscosities ranging from 0.73 to 1.29 dL/g. Polyimides 5a–f were soluble in amide polar solvents and even in less polar solvents. These films had tensile strengths of 87–100 MPa, elongations to break of 8–29%, and initial moduli of 1.7–2.2 GPa. The glass transition temperatures (Tg) of 5a–f were in the range of 222–271°C, and the 10% weight loss temperatures (T10) of them were all above 493°C. Compared with polyimides 6 series based on 2,2‐bis[4‐(4‐aminophenoxy)phenyl]propane (BAPP) and polyimides 7 based on 2,2‐Bis[4‐(4‐aminophenoxy)phenyl]hexafluoropropane (6FBAPP), the 5 series showed better solubility and lower color intensity, dielectric constant, and lower moisture absorption. Their films had cutoff wavelengths between 363 and 404 nm, b* values ranging from 8 to 62, dielectric constants of 2.68–3.16 (1 MHz), and moisture absorptions in the range of 0.04–0.35 wt %. © 2004 Wiley Periodicals, Inc. J Appl Polym Sci 95: 922–935, 2005  相似文献   

19.
A novel dianhydride, trans‐1,2‐bis(3,4‐dicarboxyphenoxy)cyclohexane dianhydride (1,2‐CHDPA), was prepared through aromatic nucleophilic substitution reaction of 4‐nitrophthalonitrile with trans‐cyclohexane‐1,2‐diol followed by hydrolysis and dehydration. A series of polyimides (PIs) were synthesized from one‐step polycondensation of 1,2‐CHDPA with several aromatic diamines, such as 2,2′‐bis(trifluoromethyl)biphenyl‐4,4′‐diamine (TFDB), bis(4‐amino‐2‐trifluoromethylphenyl)ether (TFODA), 4,4′‐diaminodiphenyl ether (ODA), 1,4‐bis(4‐aminophenoxy)benzene (TPEQ), 4,4′‐(1,3‐phenylenedioxy)dianiline (TPER), 2,2′‐bis[4‐(3‐aminodiphenoxy)phenyl]sulfone (m‐BAPS), and 2,2′‐bis[4‐(4‐amino‐2‐trifluoromethylphenoxy)phenyl]sulfone (6F‐BAPS). The glass transition temperatures (Tgs) of the polymers were higher than 198°C, and the 5% weight loss temperatures (Td5%s) were in the range of 424–445°C in nitrogen and 415–430°C in air, respectively. All the PIs were endowed with high solubility in common organic solvents and could be cast into tough and flexible films, which exhibited good mechanical properties with tensile strengths of 76–105 MPa, elongations at break of 4.7–7.6%, and tensile moduli of 1.9–2.6 GPa. In particular, the PI films showed excellent optical transparency in the visible region with the cut‐off wavelengths of 369–375 nm owing to the introduction of trans‐1,2‐cyclohexane moiety into the main chain. © 2015 Wiley Periodicals, Inc. J. Appl. Polym. Sci. 2015 , 132, 42317.  相似文献   

20.
Polycondensation‐type poly(amic acid) (PAA) was synthesized with 3,3′,4,4′‐benzophenonetetracarboxylic dianhydride as a dianhydride monomer and 4,4′‐diaminodiphenylmethane and 4,4′‐oxydianiline as diamine monomers under microwave irradiation in dimethylformamide. Then, PAA was used to make polyimide (PI) by imidization at a low temperature. The structure and performance of the polymers were characterized with Fourier transform infrared (FTIR), proton nuclear magnetic resonance (1H‐NMR), viscosity, X‐ray diffraction (XRD), and thermogravimetry (TG) curve analyses. The FTIR spectra of the polymers showed characteristic peaks of PI around 1779 and 1717 cm?1. The 1H‐NMR spectrum of PAA indicated a singlet at 6.55 ppm assigned to ? NHCO? and a singlet at 10.27 ppm assigned to carboxylic acid protons. The XRD spectrum demonstrated that the obtained PI had a low‐order aggregation structure with a d‐spacing of 0.5453 nm. The TG results revealed that the PI was thermally stable with 10% weight loss at 565°C in an N2 atmosphere. © 2007 Wiley Periodicals, Inc. J Appl Polym Sci 2008  相似文献   

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