Experimental investigation of flow boiling heat transfer of jet impingement on smooth and micro structured surfaces

Flow boiling heat transfer experiments using R134a were carried out for jet impingement on smooth and enhanced surfaces. The enhanced surfaces were circular micro pin fins, hydrofoil micro pin fins, and square micro pin fins. The effects of saturation pressure, heat flux, Reynolds number, pin fin geometry, pin fin array configuration, and surface aging on flow boiling heat transfer characteristics were investigated. Flow boiling experiments were carried out for two different saturation pressures, 820 kPa and 1090 kPa. Four jet exit velocities ranging from 1.1–4.05 m/s were investigated. Flow boiling jet impingement on smooth surfaces was characterized by large temperature overshoots, exhibiting boiling hysteresis. Flow boiling jet impingement on micro pin fins displayed large heat transfer coefficients. Heat transfer coefficients as high as 150,000 W/m² K were observed at a relatively low velocity of 2.2 m/s with the large (D = 125 μm) circular micro pin fins. Jet velocity, surface aging, and saturation pressure were found to have significant effects on the two-phase heat transfer characteristics. Subcooled nucleate boiling was found to be the dominant heat transfer mechanism.     

Modeling and optimization of designing parameters for a parallel-plain fin heat sink with confined impinging jet using the response surface methodology

The parallel-plain fin (PPF) array structure is widely applied in convective heat sinks in order to create extended surface for the enhancement of heat transfer. In the present study, for investigating the influences of designing parameters of PPF heat sink with an axial-flow cooling fan on the thermal performance, a systematic experimental design based on the response surface methodology (RSM) is used. The thermal resistance and pressure drop are adopted as the thermal performance characteristics. Various designing parameters, such as height and thickness of fin, width of passage between fins, and distance between the cooling fan and the tip of fins, are explored by experiment. Those parameters affect the structure arrangement, geometry of fins and the status of impinging jet from an axial-flow cooling fan installed over the heat sink. A standard RSM design called a central composite design is selected as experimental plan for the four parameters mentioned above. An effective procedure of response surface methodology (RSM) has been proposed for modeling and optimizing the thermal performance characteristics of PPF heat sink with the design constrains. The most significant influential factors for minimizing thermal resistance and pressure drop have been identified from the analysis of variance. The confirmation experimental results indicate that the proposed model is reasonably accurate and can be used for describing the thermal resistance and pressure drop with the limits of the factors studied. The optimum designing parameters of PPF heat sink with an axial-flow cooling fan under constrains of mass and space limitation, which are based on the quadratic model of RSM and the sequential approximation optimization method, are found to be fin height of 60 mm, fin thickness of 1.07 mm, passage width between fins of 3.32 mm, and distance between the cooling fan and the tip of fins of 2.03 mm.     

Experimental analysis of flow and heat transfer in a miniature porous heat sink for high heat flux application

A novel miniature porous heat sink system was presented for dissipating high heat fluxes of electronic device, and its operational principle and characteristics were analyzed. The flow and heat transfer of miniature porous heat sink was experimentally investigated at high heat fluxes. It was observed that the heat load of up to 280 W (heat flux of 140 W/cm²) was removed by the heat sink with the coolant pressure drop of about 34 kPa across the heat sink system and the heater junction temperature of 62.9 °C at the coolant flow rate of 6.2 cm³/s. Nu number of heat sink increased with the increase of Re number, and maximum value of 323 for Nu was achieved at highest Re of 518. The overall heat transfer coefficient of heat sink increased with the increase of coolant flow rate and heat load, and the maximal heat transfer coefficient was 36.8 kW(m² °C)^?1 in the experiment. The minimum value of 0.16 °C/W for the whole thermal resistance of heat sink was achieved at flow rate of 6.2 cm³/s, and increasing coolant flow rate and heat fluxes could lead to the decrease in thermal resistance. The micro heat sink has good performance for electronics cooling at high heat fluxes, and it can improve the reliability and lifetime of electronic device.     

Boiling heat transfer in a hydrofoil-based micro pin fin heat sink

Flow boiling of R-123 in a hydrofoil-based micro pin fin heat sink was investigated. Average two-phase heat transfer coefficients were obtained over effective heat fluxes ranging from 19 to 312 W/cm² and mass fluxes from 976 to 2349 kg/m² s. The paper presents a flow map, which divides the data into three flow pattern regions: bubbly, wavy intermittent and spray-annular flows. Heat transfer coefficient trends and flow morphologies were used to infer boiling heat transfer mechanisms. Existing conventional scale correlations for circular tubes resulted in large scatter and were not able to predict the heat transfer coefficients accurately.     

Sintered porous heat sink for cooling of high-powered microprocessors for server applications

This paper experimentally investigates the sintered porous heat sink for the cooling of the high-powered compact microprocessors for server applications. Heat sink cold plate consisted of rectangular channel with sintered porous copper insert of 40% porosity and 1.44 × 10^?11 m² permeability. Forced convection heat transfer and pressure drop through the porous structure were studied at Re ? 408 with water as the coolant medium. In the study, heat fluxes of up to 2.9 MW/m² were successfully removed at the source with the coolant pressure drop of 34 kPa across the porous sample while maintaining the heater junction temperature below the permissible limit of 100 ± 5 °C for chipsets. The minimum value of 0.48 °C/W for cold plate thermal resistance (R_cp) was achieved at maximum flow rate of 4.2 cm³/s in the experiment. For the designed heat sink, different components of the cold plate thermal resistance (R_cp) from the thermal footprint of source to the coolant were identified and it was found that contact resistance at the interface of source and cold plate makes up 44% of R_cp and proved to be the main component. Convection resistance from heated channel wall with porous insert to coolant accounts for 37% of the R_cp. With forced convection of water at Re = 408 through porous copper media, maximum values of 20 kW/m² K for heat transfer coefficient and 126 for Nusselt number were recorded. The measured effective thermal conductivity of the water saturated porous copper was as high as 32 W/m K that supported the superior heat augmentation characteristics of the copper–water based sintered porous heat sink. The present investigation helps to classify the sintered porous heat sink as a potential thermal management device for high-end microprocessors.     

Experimental investigations on phase change material based finned heat sinks for electronic equipment cooling

This paper reports the results of an experimental investigation of the performance of finned heat sinks filled with phase change materials for thermal management of portable electronic devices. The phase change material (PCM) used in this study is n-eicosane and is placed inside a heat sink made of aluminium. Aluminium acts as thermal conductivity enhancer (TCE), as the thermal conductivity of the PCM is very low. The heat sink acts as an energy storage and a heat-spreading module. Studies are conducted for heat sinks on which a uniform heat load is applied for the unfinned and finned cases. The test section considered in all cases in the present work is a 80 × 62 mm² base with TCE height of 25 mm. A 60 × 42 mm² plate heater with 2 mm thickness is used to mimic the heat generation in electronic chips. Heat sinks with pin fin and plate fin geometries having the same volume fraction of the TCE are used. The effect of different types of fins for different power level (ranging from 2 to 7 W) in enhancing the operating time for different set point temperatures and on the duration of latent heating phase were explored in this study. The results indicate that the operational performance of portable electronic device can be significantly improved by the use of fins in heat sinks filled with PCM.     

Forced convective heat transfer across a pin fin micro heat sink

This paper investigates heat transfer and pressure drop phenomena over a bank of micro pin fins. A simplified expression for the total thermal resistance has been derived, discussed and experimentally validated. Geometrical and thermo-hydraulic parameters affecting the total thermal resistance have been discussed. It has been found that very low thermal resistances are achievable using a pin fin heat sink. The thermal resistance values are comparable with the data obtained in microchannel convective flows. In many cases, the increase in the flow temperature results in a convection thermal resistance, which is considerably smaller than the total thermal resistance.     

An experimental study of pressure loss and heat transfer in the pin fin-dimple channels with various dimple depths

An experimental study was conducted to investigate the effects of dimple depth on the pressure loss and heat transfer characteristics in a pin fin-dimple channel, where dimples are located on the endwall transversely between the pin fins. The pin fin-dimple channels considered consist of ten rows of pin fin-dimple combined structure. The pin fin transverse spacing-to-diameter ratio S/D = 2.5, the streamwise spacing-to-diameter ratio X/D = 2.5, the pin fin height-to-diameter ratio H/D = 1.0. The dimples have a print diameter the same with the pin fins, but have three different dimple depth-to-diameter ratios, i.e. δ/D = 0.1, 0.2 and 0.3. The experimental results, mainly the average Nusselt number and friction factor, for the pin fin-dimple channels with various dimple depths have been obtained and compared with each other for the Reynolds number range of 8200–50,500. The study showed that, compared to the baseline pin fin channel, the pin fin-dimple channels have further improved convective heat transfer performance by up to 19.0%, and the pin fin-dimple channel with deeper dimples shows relatively higher Nusselt number values. The study still showed dimple depth-dependent pressure loss behaviors for the pin fin-dimple channels compared to the pin fin channel, and the pin fin-dimple channel with shallower dimples shows relatively lower friction factors by up to 17.6% over the studied Reynolds number range. Furthermore, three-dimensional conjugate computations have been carried out for similar experimental conditions, and the computations showed the detailed characteristics in the distribution of the velocity and turbulence level in the flow, which revealed the underlying mechanisms for the associated dimple depth-dependent pressure loss and heat transfer characteristics in the pin fin-dimple channels.     

Numerical study of laminar heat transfer and pressure drop characteristics in a water-cooled minichannel heat sink

With the rapid development of the information technology (IT) industry, the heat flux in integrated circuit (IC) chips cooled by air has almost reached its limit about 100 W/cm². Some applications in high technologies require heat fluxes well beyond such a limitation. Therefore the search of a more efficient cooling technology becomes one of the bottleneck problems of the further development of IT industry. The microchannel flow geometry offers large surface area of heat transfer and a high convective heat transfer coefficient. However, it has been hard to implement because of its very high pressure head required to pump the coolant fluid though the channels. A normal channel could not give high heat flux although the pressure drop is very small. A minichannel can be used in heat sink with a quite high heat flux and a mild pressure loss. A minichannel heat sink with bottom size of 20 mm × 20 mm is analyzed numerically for the single-phase laminar flow of water as coolant through small hydraulic diameters and a constant heat flux boundary condition is assumed. The effects of channel dimensions, channel wall thickness, bottom thickness and inlet velocity on the pressure drop, thermal resistance and the maximum allowable heat flux are presented. The results indicate that a narrow and deep channel with thin bottom thickness and relatively thin channel wall thickness results in improved heat transfer performance with a relatively high but acceptable pressure drop. A nearly-optimized configuration of heat sink is found which can cool a chip with heat flux of 256 W/cm² at the pumping power of 0.205 W. The nearly-optimized configuration is verified by an orthogonal design. The simulated thermal resistance agrees quite well with the result of conventional correlations method with the maximum difference of 12%.     

Scroll heat sink: A novel heat sink with the moving fins inserted between the cooling fins

In this paper, a new type of a fan-integrated heat sink named a scroll heat sink is proposed and demonstrated. The most striking feature of the scroll heat sink is that heat dissipation and fluid pumping occurs simultaneously in the whole cooling space without requiring any additional space for a fan module. In the scroll heat sink, the moving fins, which rotate with two eccentric shafts, are inserted between the fixed (cooling) fins. By a relative motion between the moving fins and the cooling fins, a coolant is drawn into the space between them, takes heat away from the cooling fins, and the heated coolant is discharged out of the heat sink. In the present study, an experimental investigation is performed in order to demonstrate the concept of the scroll heat sink. Average coolant velocities and thermal resistances of the scroll heat sink are measured for various rotating speeds of the moving fins from 200 rpm to 500 rpm. Experimental results show that measured flow rates of the coolant are almost linearly proportional to the rotating speed of the moving fins. A theoretical model is also developed to estimate the required pumping power and the thermal resistance, and validated using experimental results. The theoretical model shows that optimized scroll heat sinks have lower thermal resistances than optimized plate-fin heat sinks under the fixed pumping power condition.     

Thermal performance of plate-fin heat sinks under confined impinging jet conditions

This paper utilizes the infrared thermography technique to investigate the thermal performance of plate-fin heat sinks under confined impinging jet conditions. The parameters in this study include the Reynolds number (Re), the impingement distance (Y/D), the width (W/L) and the height (H/L) of the fins, which cover the range Re = 5000–25,000, Y/D = 4–28, W/L = 0.08125–0.15625 and H/L = 0.375–0.625. The influences of these parameters on the thermal performance of the plate-fin heat sinks are discussed. The experimental results show that the thermal resistance of the heat sink apparently decreases as the Reynolds number increases; however, the decreasing rate of the thermal resistance declines with the increase of the Reynolds number. An appropriate impingement distance can decrease the thermal resistance effectively, and the optimal impingement distance is increased as the Reynolds number increases. Moreover, the influence of the impingement distance on the thermal resistance at high Reynolds numbers becomes less conspicuous because the magnitude of the thermal resistance decreases with the Reynolds number. An increase of the fin width reduces the thermal resistance initially. Nevertheless, the thermal resistance rises sharply when the fin width is larger than a certain value. Increasing the fin height can increase the heat transfer area which lowers the thermal resistance. Moreover, the influence of the fin height on the thermal resistance seems less obvious than that of the fin width. To sum up all experimental results, Reynolds number Re = 20,000, impingement distant Y/D = 16, fin width W/L = 0.1375, and fin height H/L = 0.625 are the suggested parameters in this study.     

Air-side thermal hydraulic performance of offset strip fin aluminum heat exchangers

Experimental studies on the air-side heat transfer and pressure drop characteristics for 16 types offset strip fins and flat tube heat exchangers were performed. Parameters including fin space s, fin height h, fin thickness t, fin length l and flow length d, a series of tests were conducted in region of air-side Reynolds number 500–7500, at a constant tube-side water flow rate of 2.5 m³/h. The air-side thermal performance data were analyzed using the effectiveness-NTU method. The heat transfer coefficients and pressure drop data with different fin space s, fin height h, and fin length l were reported in terms of frontal air velocity. The general correlations for Colburn j-factor and Fanning fraction f-factor were derived by regression analysis and F significance test. The correlations for j and f factors can predict 95% and 90% of the experimental data within  ± 10%. And the average deviations of predictive data for the j and f factors are 0.2% and 1.2%, mean deviations are 4.2% and 5.3%.     

Fluid flow and heat transfer characteristics of cross-cut heat sinks

In this study, effects of cross-cuts on the thermal performance of heat sinks under the parallel flow condition are experimentally studied. To find effects of the length, position, and number of cross-cuts, heat sinks with one or several cross-cuts ranging from 0.5 mm to 10 mm were fabricated. The pressure drop and the thermal resistance of the heat sinks are obtained in the range of 0.01 W<P_p < 1 W. Experimental results show that among the many cross-cut design parameters, the cross-cut length has the most significant influence on the thermal performance of heat sinks. The results also show that heat sinks with a cross-cut are superior to heat sinks containing several cross-cuts in the thermal performance. Based on experimental results, the friction factor and Nusselt number correlations for heat sinks with a cross-cut are suggested. Using the proposed correlations, thermal performances of cross-cut heat sinks are compared to those of optimized plate-fin and square pin-fin heat sinks under the constant pumping power condition. This comparison yields a contour map that suggests an optimum type of heat sink under the constraint of the fixed pumping power and fixed heat sink volume. The contour map shows that an optimized cross-cut heat sink outperforms optimized plate-fin and square pin-fin heat sinks when 0.04 < log L1 < 1.     

Pool boiling heat transfer on horizontal rectangular fin array in saturated FC-72

The flow patterns and pool boiling heat transfer performance of copper rectangular fin array surfaces immersed in saturated FC-72 were experimentally investigated. The effects of the geometry parameters (fin spacing and fin length) on boiling performance were also examined. The test surfaces were manufactured on a copper block with a base area of 10 mm × 10 mm with three fin spacing (0.5 mm, 1.0 mm and 2.0 mm) and four fin lengths (0.5 mm, 1.0 mm, 2.0 mm and 4.0 mm). All experiments were performed in the saturated state at 1 atmospheric condition. A plain surface was used as the reference standard and compared with the finned surfaces. The photographic images showed different boiling flow patterns among the test surfaces at various heat fluxes. The test results indicated that closer and higher fins yielded a greater flow resistance that against the bubble/vapor lift-off in the adjacent fins. Moreover, as the heat flux approached to critical heat flux (CHF), numerous vapor mushrooms periodically appeared and extruded from the perimeter of the fin array, causing dry-out in the center of the fin array. Closer and higher fins provide more heat transfer. The results also showed that overall heat transfer coefficient decayed rapidly as the fin spacing decreased or the fin length increased. The maximum value of CHF on the base area was 9.8 × 10⁵ W m⁻² for the test surface with a 0.5 mm fin spacing and a 4.0 mm fin length, which has a value five times greater than that of the plain surface.     

Analysis of effectiveness and pressure drop in micro cross-flow heat exchanger

A theoretical model that predicts the thermal and fluidic characteristics of a micro cross-flow heat exchanger is developed in this study. The theoretical model is validated by comparing the theoretical solutions with the experimental data from the relative literature. This model describes the interactive effect between the effectiveness and pressure drop in the micro heat exchanger. The analytical results show that the average temperature of the hot and cold side flow significantly affects the heat transfer rate and the pressure drop at the same effectiveness. Different effectiveness has a great influence upon the heat transfer rate and pressure drop. When the micro heat exchanger material is changed from silicon to copper, the thermal conductivity changes from 148 to 400 W/m K. The heat exchanger efficiency is also similar. Therefore, the (1 1 0) orientation silicon based micro heat exchanger made using the MEMS fabrication process is feasible and efficient. Furthermore, the dimensions effect has a great influence upon the relationship between the heat transfer rate and pressure drop. Therefore, the methodology presented in this paper can be used to design a micro cross-flow heat exchanger.     

Heat transfer enhancement from micro pin fins subjected to an impinging jet

An experimental investigation was carried out to study the single-phase stagnation point jet impingement heat transfer on smooth and micro pin fin structures using water and R134a. The experiments were carried out for a single jet (d_j = 2.0 mm) impinging on a 2 × 2 mm micro-heater over a wide range of Reynolds numbers. Both an unfinned and a micro structured impingement surfaces were investigated. The micro structures consisted of an array of 64 circular micro pin fins fabricated using MEMS microfabrication. The micro pin fins had diameters of 125 μm, heights of 230 μm, and pitches of 250 μm with an area enhancement of A_total/A_base = 2.44. The jet stand-off ratio and area ratio (A_j/A_base) were 0.86 and 0.785, respectively. Nusselt numbers were found to increase with increasing Reynolds numbers. Correlations from the literature for impingement zone Nusselt numbers were found to underpredict the experimental results. Significant enhancement of the heat transfer coefficients were observed as a result of the presence of the micro pin fins on the impingement surface. Enhancement factors as high as 3.03 or about 200% increase in the heat transfer coefficients were demonstrated. Enhancements are attributed to flow mixing, interruption of the boundary layers, and augmentation of turbulent transport.     

Experimental investigation and flow visualization to determine the optimum dimension range of microgap heat sinks

The rapid increase of heat flux in high performance electronic devices has necessitated the development of high capacity thermal management techniques that can support extremely high heat transfer rates. Flow boiling in microgap is very promising for this purpose due to its high heat transfer rate and ease of fabrication. However, the effects of microgap dimension on heat transfer and pressure drop characteristics along with flow visualization have not been investigated extensively. This paper focuses on flow boiling experiments of deionized water in silicon microgap heat sink for ten different microgap dimensions from a range of 80 μm–1000 μm to determine the most effective and efficient range of microgap dimensions based on heat transfer and pressure drop performance. High speed flow visualization is conducted simultaneously along with experiments to illustrate the bubble characteristics in the boiling flow in microgap. The results of this study show that confinement in flow boiling occurs for microgap sizes 500 μm and below and confined slug/annular flow is the main dominant regime whereas physical confinement does not occur for microgap sizes 700 μm and above and bubbly flow is the dominant flow regime. The microgap is ineffective below 100 μm as partial dryout strikes very early and the wall temperature is much higher for a fixed heat flux as microgap size increases above 500 μm. In addition, results show that pressure drop and pressure fluctuation decrease with the increases of gap size whereas wall temperature and wall temperature fluctuation increase with the increases of gap size. A strong dependence of heat transfer coefficient on microgap sizes is observed for microgap sizes 500 μm and below. However, the heat transfer coefficient is independent of microgap size for microgap sizes 700 μm and above.     

Numerical study of the heat sink with un-uniform fin width designs

The thermal performances of the heat sink with un-uniform fin width designs with an impingement cooling were investigated numerically. The governing equations are discretized by using a control-volume-based finite-difference method with a power-law scheme on an orthogonal non-uniform staggered grid. The coupling of the velocity and the pressure terms of momentum equations are solved by the SIMPLEC algorithm. The well-known k ? ε two-equations turbulence model is employed to describe the turbulent structure and behavior. The parameters include the five Reynolds number (Re = 5000–25000), three fin heights (H = 35, 40, 45 mm), and five fin width designs (Type-1–Type-5). The objective of this study is to examine the effects of the fin shape of the heat sink on the thermal performance. The results show that the Nusselt number increases with the Reynolds number. The increment of the Nusselt number decreases gradually with the increasing Reynolds number. Furthermore, the effects of fin dimensions on the Nusselt number at high Reynolds numbers are more significant than that at low Reynolds numbers. It is also found that there is potential for optimizing the un-uniform fin width design.     

Convective flow of refrigerant (R-123) across a bank of micro pin fins

An experimental study has been performed on single-phase heat transfer, boiling inception, and pressure drop of R-123 over a bank of shrouded micro pin fins 243 μm long with hydraulic diameter of 99.5 μm. Heat transfer coefficients and Nusselt numbers have been obtained over effective heat fluxes ranging from 3.5 to 65.5 W/cm² and Reynolds numbers from 134 to 314. A delay in boiling incipience has been observed and a meta-stable single-phase region was apparent at liquid exit temperatures noticeably exceeding the saturation temperature. Once boiling was initiated, vapor burst instabilities resembling the compound relaxation instabilities were attained. It has also been found that endwalls effects on heat transfer diminished for Re > 100.     

Effect of fin pitches on the optimum heat transfer performance of crimped spiral fin-and-tube heat exchangers

This study conducted experiments on the optimized fin pitch for crimped spiral fin-and-tube heat exchangers. The experiments covered a size range of 2.4–6.5 mm, which is the manufacturing limitation for this kind of fin. The water-flow arrangement used in this experiment combined the parallel cross-flow and the counter cross-flow in a two-row configuration. Ambient air was used as the working fluid on the air-side, and hot water was used on the tube-side. The effects of fin pitches on the heat transfer coefficient and pressure drop characteristics were studied. The results clearly showed that the convective heat transfer coefficient (h_o) for a fin pitch of 2.4 mm is relatively low compared with that of other fin pitches with the same air frontal velocity. Using larger fin pitches (i.e., 4.2, 6.2, and 6.5 mm) resulted in negligible differences in the pressure drop. Moreover, this work introduces the parameter of three performances indexes, which can be expressed as the ratio of the desired output to the required input, for optimization purposes. Due to the difference in optimum fin pitch obtained by these performance indexes, an intersection analysis was conducted. The results indicated that the optimum fin pitch is 4.2 mm for this work, which could be valuable for the effective design for industrial thermal-system applications.