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1.
采用磁控溅射法,在衬底温度300 ℃制备CdS薄膜,并选取370 ℃、380 ℃、390℃三个温度退火,获得在干燥空气和CdCl2源+干燥空气两种气氛下退火的CdS薄膜.通过研究热处理前后CdS薄膜的形貌、结构和光学性能表明,CdS薄膜在干燥空气中退火,晶粒度、表面粗糙度和可见光透过率变化不明显,光学带隙随退火温度的升高而增大; 在CdCl2源+干燥空气中退火,随退火温度的升高发生明显的再结晶和晶粒长大,表面粗糙度增大,可见光透过率和光学带隙随退火温度的升高而减小.分析得出: 上述性能的改变是由于不同的退火条件对CdS薄膜的再结晶温度和带尾态掺杂浓度改变的结果.  相似文献   

2.
采用化学水浴法和磁控溅射法分别在AZO、FTO、ITO透明导电玻璃衬底上制备了CdS薄膜,利用扫描电镜、XRD以及透射光谱等测试手段,研究了两种制备方法对不同衬底生长CdS薄膜形貌、结构和光学性能的影响.研究结果表明,不同方法制备的CdS薄膜表面形貌均依赖于衬底的类型,水浴法制备的CdS薄膜晶粒度较大,表面相对粗糙.不同方法制备的CdS薄膜均为立方相和六角相的混相结构,溅射法制备的多晶薄膜衍射峰清晰、尖锐,结晶性较好.水浴法制备的CdS薄膜透过率整体低于溅射法,但在短波处优势明显.  相似文献   

3.
采用直流磁控溅射法在柔性衬底上镀制ITO透明导电薄膜,全面研究了薄膜厚度、氧气流量、溅射速率、溅射气压和镀膜温度等工艺条件对ITO薄膜光电性能的影响。结果表明,当膜厚大于80nm、氧氩体积比为1∶40、溅射速率为5nm/min、溅射气压在0.5Pa左右、镀膜温度为80~160℃时,ITO薄膜的光电性能较好,其电阻率小于5×10–4?·cm、可见光透光率大于80%。  相似文献   

4.
采用射频磁控溅射法在室温柔性衬底PET上制备了掺锆氧化锌(ZZO)透明导电薄膜.利用不同方法提高了ZZO薄膜的电阻率而未使其可见光透过率降低.X射线衍射(XRD)和扫描电子显微镜(SEM)表明,ZZO薄膜为六角纤锌矿结构的多晶薄膜.在有机衬底和玻璃衬底上制备ZZO薄膜的择优取向不同,前者为(100)晶面,而后者为(002)晶面.在有ZnO缓冲层的PET衬底上制备的ZZO薄膜电阻率比直接生长在玻璃衬底样品上的小.通过优化参数,在PET衬底上制备出了最小电阻率为1.7×10-3Ω·cm、可见光透过率超过93%的ZZO薄膜.实验表明,镀膜之前在柔性衬底上沉积ZnO缓冲层能有效地提高ZZO薄膜的质量.  相似文献   

5.
为使Ⅱ-Ⅵ族化合物ZnS薄膜具有可弯曲性,选用柔性的聚酰亚胺作为衬底材料,用射频磁控溅射法沉积ZnS薄膜,对所制备薄膜的结晶结构、组分和光学特性进行分析.实验结果表明,所制备薄膜为结晶态的闪锌矿ZnS结构,择优取向为(111)晶面,晶粒尺寸为25.6 nm.薄膜组分接近化学计量比,并具有少量的S损失.薄膜在可见光区和近红外光区的平均透射率分别为82.0%和90.5%,透光特性良好.作为对比,在钠钙玻璃衬底上溅射的ZnS薄膜的结晶度高于聚酰亚胺衬底薄膜,但其透射率略低于柔性ZnS薄膜.实验结果表明了用磁控溅射法在柔性聚酰亚胺衬底上制备ZnS薄膜的可行性.  相似文献   

6.
利用射频磁控溅射法首次在室温水冷柔性衬底PET上制备出了可见光透过率高、电阻率低的掺锆氧化锌(ZnO:Zr)透明导电薄膜。X射线衍射和扫描电子显微镜表明,ZnO:Zr薄膜为六角纤锌矿结构的多晶薄膜,且具有平行于衬底方向的择优取向。实验获得ZnO:Zr薄膜的最小电阻率为1.55×10^-3Q·cm。实验制备的ZnO:Zr薄膜具有良好的附着性能,其可见光区平均透过率超过90%。  相似文献   

7.
采用反应热蒸发的方法,在聚对苯二甲酸乙二醇酯(PET)塑料衬底上制备In2O3:Sn(ITO)薄膜.鉴于塑料对温度的敏感性,详细研究了衬底温度对其上沉积的ITO薄膜的微观结构及光电性能的影响,在低温条件下(Ts=140℃)获得电阻率为7.52×10-4Ωcm,可见光范围内的透过率大于80%和结构特性良好的薄膜,并将其应用于PIN型太阳电池的前电极,获得了转换效率为4.41%的柔性非晶硅(a-Si)薄膜太阳电池.  相似文献   

8.
采用石英晶体微天平实时监测薄膜生长速率,控制衬底温度和生长速率,分别在柔性聚乙烯吡咯烷酮(PVP)绝缘层和柔性氧化铟锡(ITO)透明导电层上真空蒸发沉积了分子有序排列的六噻吩薄膜.X射线衍射分析表明,对PVP层而言,六噻吩薄膜有序生长的条件为衬底温度90°c、生长速率10 nm/min,六噻吩分子链始终与衬底平行,降低衬底温度将导致薄膜结晶度的下降.而对ITO层来说,六噻吩薄膜有序生长的条件为衬底温度50℃、生长速率10 nm/min,衬底温度显著影响了六噻吩分子取向,室温下六噻吩分子链与衬底成一定夹角,随着温度的提高六噻吩分子链趋向与衬底平行.对PVP和ITO衬底,生长速率太高或太低都将导致薄膜结晶度的下降.  相似文献   

9.
利用射频磁控溅射法首次在室温水冷柔性衬底 PET上制备出了可见光透过率高、电阻率低的掺锆氧化锌(ZnO∶Zr)透明导电薄膜.X射线衍射和扫描电子显微镜表明,ZnO∶Zr薄膜为六角纤锌矿结构的多晶薄膜,且具有平行于衬底方向的择优取向.实验获得ZnO∶Zr薄膜的最小电阻率为1.55×10-3 Ω·cm.实验制备的ZnO∶Zr薄膜具有良好的附着性能,其可见光区平均透过率超过90%.  相似文献   

10.
退火对不同基底上氧化钒薄膜电阻的影响   总被引:1,自引:0,他引:1  
张鹏  路远  乔亚 《半导体光电》2012,33(6):850-852,905
采用直流磁控溅射的方法分别在普通玻璃与硅片上制备了氧化钒薄膜,在大气及真空氛围下分别对样品采取了退火处理,测量了退火前后薄膜的电阻,结合样品的XRD图谱进行了分析。结果表明,在普通玻璃和硅片上均得到了V2O5薄膜。经过大气氛围退火处理后,薄膜的结晶度明显增强,硅片上薄膜的电阻明显变小,而玻璃基底上的薄膜电阻变化则不明显。在温度升高的过程中,Si片上薄膜电阻变化范围为56~0.54MΩ。而经过真空退火处理的薄膜其电阻均发生改变,升温过程中,玻璃基底与Si片上薄膜的电阻变化范围分别为52~16MΩ、4.3~0.46MΩ,说明经过退火后硅片上沉积的薄膜具有较好的电学性能。  相似文献   

11.
12.
Sol-gel-derived, crack-free, and condensed TiOx thin films with improved barrier properties were successfully fabricated on polymeric substrates with a simple two-step heat treatment at low temperatures. To assess the barrier properties of the TiOx thin films, Ca corrosion tests were conducted and their water vapor transmission rates (WVTRs) were measured. We found that the two-step heat treatment (at 45 °C for 90 min and 110 °C for 60 min) produces a close-packed TiOx structure that substantially reduces the WVTRs of the coated polymeric substrates. The WVTRs of 86 nm thick TiOx thin films on polyethylene naphthalate (PEN) substrates at a relative humidity (RH) of 90% were found to be 0.133 g m−2 day−1 at 38 °C and 0.0387 g m−2 day−1 at 25 °C. In addition, the WVTR value of the TiOx thin films on PEN substrates are stable with respect to bending: it was found to increase by only ∼13% after 100 repetitions of bending with a 20 mm radius.  相似文献   

13.
ZnO thin films were grown by the pulsed laser deposition technique on c-plane sapphire substrates at a substrate temperature of 500 °C with 1×10−4 Torr ambient gas. After the deposition process, ZnO thin films were annealed at 1000 °C for 5 min under N2 or O2 ambient gas, respectively. In the X-ray patterns, the (0 0 2) peak of the annealed sample was shifted from that of the as-grown sample, which indicates a reduced lattice constant of about 1%. Even though the X-ray diffraction patterns in the samples annealed under O2 and N2 annealing gases were almost the same, photoluminescence spectra showed the generation of a shallow level with a few meV, and deep-level states were generated at Ev+0.594 eV. In addition, a defect state appeared at Ec−0.607 eV, which originated from hydrogen plasma irradiation on the ZnO sample.  相似文献   

14.
The growth modes of CdS thin films on glass in a chemical bath were analysed using scanning electron microscopy and optical microscopy. The results of these studies show that the film growth occurs by ion-by-ion condensation and by colloidal particles of CdS adhering to the substrate. Both mechanisms are operative from the initial stages of film growth. The predominance of one or other of these two growth modes depends on the abundance of Cd and S ions present in the solution, which is determined by the amount of complexing and sulphurising agents and ammonia used for the controlled release of Cd and S ions into the solution. The growth mode influences the optical properties of the films.  相似文献   

15.
利用低压金属有机化学气相沉积(LP-MOCVD)技术在PET柔性衬底上低温生长绒面结构ZnO-TCO薄膜,DEZn和H2O作为源材料,B2H6作为掺杂剂.详细研究了薄膜掺杂流量对ZnO薄膜微观结构以及光电性能影响.优化获得的PET/ZnO:B薄膜厚约为1 500nm时,绒面结构PET/ZnO薄膜的方块电阻约为10Ω,可...  相似文献   

16.
VO2作为相变材料在激光防护领域有着广阔的应用前景,为了提高透过率,采用在红外波段透过率为70%的ZnSe做基片,用磁控溅射法制备了VO2薄膜.对不同条件下制备的VO2薄膜用X射线电子能谱仪(XPS)测试,并通过拟合来得到VO,V2O3,VO2和V2O5在薄膜中所占的比例.为提高4价钒的含量对薄膜进行了退火处理,根据薄膜中的钒氧的比例,采用了充氧加热退火,退火时间4 h,退火温度450℃,退火真空度2.5×10-2Pa,氧气流量6.5 sccm.4价钒含量提高到了接近60%,分析了退火对氧化钒薄膜中4价钒含量的影响.  相似文献   

17.
Rapid thermal annealing which involves fast heating and cooling rates, is used to activate dopants in thin-film structures yet minimize the dopant diffusion that occurs with excessive thermal exposure. Although the proper resulting electrical properties are the main concern, the structural behavior must also be considered. At the elevated annealing temperature, the heterostructure may be susceptible to both relaxation and yielding. However, the relative effect of these deformations is a function of the material properties, ramp-rate, annealing conditions, and wafer geometry, In particular, for a high-melting-point film on a lower-melting-point substrate, the substrate will experience the inelastic effects prior to the film. More specifically, because germanium has a significantly lower melting point than silicon, previously developed processing technology for silicon cannot be applied directly to germanium processing. A numerical model has been developed to account for the thermo-mechanical effects associated with rapid thermal annealing of relaxing materials. Numerical parametric studies have been conducted for rapid thermal annealing of a thin polysilicon film on a (111) germanium substrate in order to determine the optimum processing window. Results reveal that lower annealing temperatures that still fall within the RTA regime will minimize or even eliminate the plastic damage that could occur during thermal processing  相似文献   

18.
CdTe nanocrystalline thin films have been prepared on glass, Si and Al2O3 substrates by radio-frequency magnetron sputtering at liquid nitrogen temperature. The crystal structure and morphology of the films were charac-terized by X-ray diffraction (XRD) and field-emission scanning electron microscopy (FESEM). The XRD examinations revealed that CdTe films on glass and Si had a better crystal quality and higher preferential orientation along the (111) plane than the Al2O3. FESEM observations revealed a continuous and dense morphology of CdTe films on glass and Si substrates. Optical properties of nanocrystalline CdTe films deposited on glass substrates for different deposited times were studied.  相似文献   

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