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炭黑表面聚合物接枝改性的研究进展 总被引:1,自引:0,他引:1
介绍了各种单体通过自由基聚合、阴离子聚合、阳离子聚合等机理在炭黑表面的接技改性及活性聚合物在炭黑表面的接枝反应的研究进展,归纳了改性炭黑的性能及其表征方法。 相似文献
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本文提出聚合物填料表面化学处理的方法有二,即光氯化法和液相化学处理法,经论证,是改善聚合物填料润湿性能的有效途径。该法具有简单易行、处理费用低廉、收效显著等优点。 相似文献
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Norihiro Inagaki 《Polymer International》2009,58(6):585-593
How to improve adhesion between poly(oxybenzoate‐co‐oxynaphthoate) (Vecstar OC and FA films) and copper metal by Ar, O2, N2 and NH3 plasma modification was investigated. The mechanism of adhesion improvement is discussed from the viewpoint of chemical and physical interactions at the interface between the Vecstar film and copper metal layer. The adhesion between Vecstar OC film and copper metal was improved by chemical rather than physical interactions. Polymer chain end groups that occur at Vecstar OC film surfaces contribute effectively to adhesion. This improvement in adhesion is due to interactions between copper metal and O?C groups formed by plasma modification. Aggregation of the O?C groups to the copper metal/Vecstar OC film interface is a key factor for good adhesion. From this aspect, heat treatment of plasma‐modified Vecstar OC films on glass plates is effective in the aggregation, and the peel strength for the copper metal/Vecstar OC film system reached 1.21 N (5 mm)?1. Copyright © 2009 Society of Chemical Industry 相似文献
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《Journal of Adhesion Science and Technology》2013,27(11):1205-1219
An aqueous method for chemically pretreating polyetherimide substrates to promote adhesion to electrolessly deposited copper or nickel is described. The process consists of cleaning the polymer surface followed by surface normalization and debris removal. In contrast to previously developed processes, no separate adhesion promotion step is required. Peel strengths between 150-250 and 120-150 g/mm were achieved for copper and nickel, respectively. Scanning electron microscopy and X-ray photoelectron spectroscopy were utilized to investigate changes in the polymer surface morphology and chemistry during processing. Possible candidates for the different steps are presented, as are analyses of the failure loci following peel strength assessment. 相似文献
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Herein we report on metallization of Cu on to surface‐modified polyimide resin, the method of which relies on potassium hydroxide‐induced modification of the polyimide surface to introduce carboxylic acid groups and incorporation of gold colloids as a seed layer through reduction of chloroauric acid. The contact angle of modified polyimide surface with water changed from 70 to 35° due to the hydrolysis of polyimide. Secondary amine group on the surface was detected with attenuated total reflection (ATR) Fourier transform infrared (FTIR) spectrophotometry, suggesting that tertiary amine group has turned into secondary group. In addition, on the basis of hydrophilic behavior, we succeeded in depositing gold colloids on the chemically modified surface. SEM image of copper electroless plated on polyimide surface indicated that copper particles were compact and about ~ 300 nm in diameter. It showed that gold colloids provide an excellent conductive layer to catalyze the electroless plating of Cu on polyimide surface. © 2008 Wiley Periodicals, Inc. J Appl Polym Sci, 2009 相似文献
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Xinyu Geng Qi Qiang Juan Zhao Junjun Yang 《Journal of Adhesion Science and Technology》2013,27(8):705-715
In this study, a surface modification of the poly (ethylene terephthalate) (PET) film using TiO2 photocatalytic treatment was investigated. In order to enhance the adhesion strength between the PET film and the electroless copper film, the effects of TiO2 crystal forms, TiO2 particle sizes, and TiO2 content, as well as treatment condition, upon the surface contact angle, surface characterization, and adhesion strength were investigated. Anatase TiO2 with a particle size of 5 nm had a high catalytic activity and dispersibility in aqueous solution. After the optimal photocatalytic treatment, the surface contact angle of the PET film decreased from 84.4° to 19.8°, and the surface roughness of the PET film increased from 36 to 117 nm. The adhesion strength between the PET film and the electroless copper film reached 0.89?KN?m?1. X-ray photoelectron spectroscopy analyses indicated the carbonyl group was formed on the PET surface after photocatalytic treatment, and the surface hydrophilicity was improved. Consequently, TiO2 photocatalytic treatment is an environmentally friendly and effective method for the surface modification of the PET film. 相似文献
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Poly(tetrafluoroethylene) (PTFE) sheet was modified with the remote hydrogen plasma, and the effect of the modification on adhesion between the PTFE sheet and copper metal was investigated. The remote hydrogen plasma was able to make PTFE surfaces hydrophilic without etching. In the modification process, defluorination and oxidation occurred on the PTFE surface. Reactivity of defluorination was 25% (estimated from the concentration of CF2 component) −39% (estimated from the F/C atom ratio). Surface modification of PTFE surface by remote hydrogen plasma contributed to the adhesion between PTFE and copper metal. Peel strength was improved from 7.5 to 92 mN/5 mm by surface modification by a factor of 12. Failure of the PTFE/copper adhesive joint occurred at the interface between the PTFE and copper metal layers, rather than in the inner layer of the PTFE polymer or copper metal layers. Remote hydrogen plasma treatment is a preferable pretreatment of PTFE surface for the fabrication of PTFE and copper metal composites. © 1999 John Wiley & Sons, Inc. J Appl Polym Sci 71: 2191–2200, 1999 相似文献
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