High-dose reactor irradiation of iron at 4.6 K: Dose and recovery curves of electrical resistivity

The increase of residual resistivity ?_o of iron during reactor irradiation at 4.6 K has been studied up to a fast neutron dose as high as 1.07 × 10¹⁹ n/cm². The outstanding result is a negative curvature of the differentiated dose curve which probably has to do with the ferromagnetic nature of Fe. Isochronal annealing showed pronounced stages I and II but only little recovery between 300 and 400 K (formerly called stage III).     

Electrical Characterization of Deep Trap Properties in High-k Thin-Film HfO2 Dielectric

Deep-trap properties of high-dielectric-constant （k） HfO2 thin films are investigated by deep-level transient spectroscopy and capacitance-voltage methods. The hole traps of the HfO2 dielectric deposited on a p-type Si substrate by sputtering are investigated in a metal-oxide-semiconductor structure over a temperature range of 300-500K. The potential depth, cross section and concentration of hole traps are estimated to be about 2.5eV, 1.8 ×10^-16 cm^2 and 1.0 × 10^16 cm^-3, respectively.     

High-Temperature Characteristics of Ti/Al/Ni/Au Ohmic Contacts to n-GaN

We present the high-temperature characteristics of Ti/Al/Ni/Au（15 nm/220 nm/40 nm/50 nm） multiplayer contacts to n-type GaN （Nd = 3.7 × 10^17 cm^-3, Nd = 3.0 × 10^18 cm^-3）. The contact resistivity increases with the measurement temperature. Furthermore, the increasing tendency is related to doping concentration. The higher the doped, the slower the contact resistivity with decreasing measurement temperature. Ti/Al/Ni/Au ohmic contact to heavy doping n-GaN takes on better high temperature reliability. According to the analyses of XRD and AES for the n-GaN/Ti/Al/Ni/Au, the Au atoms permeate through the Ni layer which is not thick enough into the AI layer even the Ti layer.     

The bulk effect of point defects on young's modulus in electron irradiated copper

Abstract

Pairs of copper samples—one for electrical resistivity, the other for Young's modulus measurements - were irradiated simultaneously at 120°K with 3 MeV electrons up to an integrated dose of 2 × 10²⁰ el/cm². The effect of dislocation pinning and the bulk effect of point defects on Young's modulus E could clearly be separated. The following relation between the bulk effect ΔE/E and the resistivity increase Δρ[Ωcm] was found: ΔE/E = ?25 × 10⁴ × Δρ. Besides strong annealing in stages II and III (180–300°K) and some annealing between 300–500°K, stage V annealing (500–600°K) also was found. In stage III the resistivity annealed more than Young's modulus. whereas the converse occurred in stage V. These measurements are discussed in connection with the electron microsopical observation of point defect clusters after electron irradiation at 120°K and heating to room temperature.

Probenpaare, bestehend aus einer Widerstandsprobe und einer Probe zur Messung des Elastizitätsmoduls, wurden gleichzeitig bei 120°K mit 3 MeV-Elektronen bis zu einer Dosis von 2 × 10²⁰ el/cm² bestrahlt. Die direkte Reein-flussung des E-Moduls durch die im Gitter verteilten Punktdefekte (Volumeneffekt) konnte getrennt von der Beeinflussung durch Versetzungsverankerung gemessen werden. Es ergab sich dabei folgende Beziehung zwischen relativer Modulanderung ΔE/E und strahlungsinduziertem Widerstand Δρ[Ωcm]: ΔE/E = ?25 × 10⁴ × Δρ. Neben starker Erholung in den Stufen II und III (180–300 °K) und schwacher Erholung zwischen 300–500°K wurde auβerdem Stufe V (500–600°K) beobachtet. In Stufe III erholte sich der Widerstand starker als der E-Modul, wahrend in Stufe V das umgekehrte der Fall war. Die Messungen werden diskutiert in Zusammenhang mit der elektronenmikroskopischen Beobachtung von Punktdefektclustern nach Elektronenbestrahlung bei 120°K und anschlieβender Erwärmung auf Raumtemperatur.     

Measurement of the KLL Dielectronic Recombination Resonances in He-like to C-like Kr Ions

The KLL dielectronic recombination processes of highly charged He-like to C-like Kr ions have been studied experimentally. The measurement was performed on the newly developed Shanghai electron beam ion trap （Shanghai-EBIT） facility. Characteristic x-rays from both dielectronic recombination and radiative recombination are detected as the electron beam energy is scanned through the resonances. The KLL resonant strengths obtained are 5.41×10^-19, 4.33×10^-19, 3.59×10^-19, 2.05×10^-19 and 0.98×10^-19 cm^2 eV for He-like to C-like Kr ions, respectively.     

Artificial Modulation of Ferroelectric Thin Films into Antiferroelectric through H+ Implantation for High-Density Charge Storage

Hydrogen ions are implanted into Pb（Zro.3Tio.7）03 1014 ions/cm^2. Pseudo-antiferroelectric behaviour in thin films at the energy of 40keV with a flux of 5 x the implanted thin films is observed, as confirmed by the measurements of polarization versus electric hysteresis loops and capacitance versus voltage curves. X-ray diffrac- tion patterns show the film structures before and after H＋ implantation both to be perovskite of a tetragonal symmetry. These findings indicate that hydrogen ions exist as stable dopants within the films. It is believed that the dopants change domain-switching behaviour via the boundary charge compensation. Meanwhile, time dependence of leakage current density after time longer than lOs indicates the enhancement of the leakage cur- rent nearly in one order for the implanted film, but the current at time shorter than i s is mostly the same as that of the original film without the ionic implantation. The artificial tailoring of the antiferroelectric behaviour through H＋ implantation in ferroelectric thin films is finally proven to be achievable for the device application of high-density charge storage.     

Resistance anomaly due to displacive phase transition in SnTe

The effect of displacive phase transition on electrical transport properties is investigated in a p-type single crystal of SnTe with carrier concentration of 1.2 × 10²⁰/cm³ at 77 K. The resistivity vs temperature curve shows an anomalous increase in the vicinity of the transition temperature. An attempt is made to interpret the temperature dependence of the resistivity increment on the basis of the carrier-soft TO-phonon interaction.     

Controlled Evolution of Silicon Nanocone Arrays Induced by Ar+ Sputtering at Room Temperature

Controlled evolution of silicon nanocone arrays induced by Ar^＋ sputtering at room temperature, using the coating carbon as a mask, is demonstrated. The investigation of scanning electron microscopy indicates that the morphology of silicon nanostructures can be controlled by adjusting the thickness of the coating carbon film. Increasing the thickness of the coating carbon film from 50-60 nm, 250-300 nm and 750-800 nm to 1500 nm, the morphologies of silicon nanostructures are transformed from smooth surface ripple, coarse surface ripple and surface ripple with densely distributed nanocones to nanocone arrays with a high density of about 1 × 10^9- 2 × 10^9 cm^-2.     

DX-Like behavior of Se-impurity centers in gasb under hydrostatic pressure

Abstract

Hall coefficient (R_H) and electrical resistivity measurements have been performed as a function of temperature (between 77 K and 300 K) and under hydrostatic pressures (up to 15 kbar) on a set of Se-doped GaSb samples with impurity concentrations in the range 8×10¹⁷ cm^?3 - 1×10¹⁸ cm^?3. With increasing pressure at 300 K, the electrons are strongly trapped into a resonant impurity level. The pressure induced occupation of this level leads to time-dependent effects at T<120 K. The activated thermal electron emission over a potential barrier E<sb>B = 300×30 meV gives clear evidence for a large lattice relaxation around the impurity centers characteristic for DX-like behavior.     

PDC材料烧结过程中钴在金刚石层中的扩散熔渗迁移机制

 讨论了PDC材料烧结过程中钴在金刚石层中的固相扩散、钴液熔渗、两次钴高浓度峰的“波浪”式迁移过程中的运动规律及其作用机制,并根据实验观测的数据进行了有关计算。结果表明：在5.8 GPa、1 300 ℃条件下,钴的扩散系数D≈1.6×10^-7 cm²/s,是一般常压及相同温度条件下钴固相扩散系数（3×10^-10 cm²/s）和相同压力条件下钴的液相扩散系数（5×10^-5 cm²/s）的中间值;对于粒度W≥10 μm的金刚石烧结体系,钴液熔渗作用时间非常短暂,略大于0.5 s,而对于W≤1 μm的超细金刚石烧结体系而言,钴熔渗作用时间为28 s,比粒度W≥10 μm的金刚石烧结要长得多;两次钴高浓度峰的迁移速度分别约为50 μm/s和100 μm/s。     

Features of the Temperature Dependence of Graphene Oxide Resistivity

The Raman spectra and the temperature dependence of the resistivity of graphene oxide grown upon continuous heating and cooling on a glass substrate is studied in air in the temperature interval of 300–550 K. It is established that the intensity of the D-peak falls relative to the G-peak, the maximum of which shifts toward lower frequencies in Raman spectra. Partial removal of oxygen-containing functional groups is accompanied by a reduction in resistivity from 5.6 × 10⁹ to 5.4 × 10⁹ Ω. In the temperature intervals of 300–350 K and 300–375 K, the resistivity is constant upon graphene oxide heating and cooling, respectively.     

Effects of Helium and Oxygen Common Implantation in Silicon Wafer

Defect engineering for SiO2 precipitation is investigated using He-ion implantation as the first stage of separation by implanted oxygen （SIMOX）. Cavities axe created in Si by implantation with helium ions. After thermal annealing at different temperatures, the sample is implanted with 120 keV 8.0 ×1016 cm 2 0 ions. The Q ion energy is chosen such that the peak of the concentration distribution is centred at the cavity band. For comparison, another sample is implanted with O ions alone. Cross-sectionM transmission electron microscopy （XTEM）, Fourier transform infrared absorbance spectrometry （FTIR） and atomic force microscopy （AFM） measurements are used to investigate the samples. The results show that a narrow nano-cavity layer is found to be excellent nucleation sites that effectively assisted SiO2 formation and released crystal lattice strain associated with silicon oxidation.     

氧化镍（绿镍矿）等温压缩及高压相变研究

 本文采用DAC（金刚石压砧高压腔）装置，对氧化镍进行了静水压、非静水压、电导率测量等系统高压实验，获取了氧化镍等温压缩、高压相变及电导率压力效应的新结果，并在实验数据的基础上，对其高压相变与电性及磁性变化关系及体弹性模量作了分析讨论。     

Blistering of rhenium irradiated with 21keV helium ions

This paper describes blistering of rhenium following 21 keV He⁺-ion irradiation at temperatures between 300 K and 1200 K. Blistering starts at 300 K at a dose of 3×10¹⁷ ions/cm². The most probable blister diameter varies from 4400 ? at 300 K to 10100 ? at 1200 K. The blister depth τ _bl , the blister diameter φ _bl and the blister heighth _bi show a distribution. From the observations one could derive the following relationships:h _bl = 0.35φ _bl ; τ _bl =3.43φ _bl ^2/3 . The erosion yieldE _y due to blistering is function of doseE _y =0.51 atoms/ion at 3×10¹⁷ ions/cm²,E _y =0.56 atoms/ion at 6×10¹⁷ ions/cm² andE _y =0.14 atoms/ion at 3×10¹⁸ ions/cm². The sputtering yieldS (21 keV) is estimated to be ∼0.1 atom/ion. The corresponding surface regression is 44? at 3×10¹⁷ ions/cm² and 1323 ? at 9×10¹⁸ ions/cm². Surface regression has therefore little influence on the observations at low doses. Work performed at the Mathematicals Science Department of S.C.K./C.E.N. at Mol (Belgium)     

Structural Deformation of CO22+ in Intense Femtosecond Laser Fields

The angular distributions of CO^＋ from the dissociation of CO2^2＋ and CO2^＋ in intense femtosecond laser fields （45 fs, about 5 × 10^15 W/cm^2） are studied at a laser wavelength of 800nm based on the time-of-flight mass spectra of CO^＋ fragment ions. The experimental results show that structural deformation occurs in the charge state of CO2^2＋ and the CO^＋ maintains linear geometrical structure.     

Effects of Proton Irradiation on a CMOS Image Sensor

We perform 9 MeV proton irradiation of a complementary metal oxide semiconductor （CMOS） image sensor at doses from 1 × 10^9 to 4 × 10^10 cm^-2. In general, the average brightness of dark output images increases with an increasing dose, and reaches the maximum at 1 × 10^10 cm^-2. The captured colour images become very blurry at 4 × 10^10 cm^-2. These can be explained by change of concentrations of irradiation-induced electron-hole pairs and vacancies in the various layers of CMOS image sensor calculated by the TRIM simulation programme with dose.     

DLTS and PTIS of new donors in oxygen-doped germanium

Two new DLTS bands I and II have been observed in n-type germanium containing 10¹⁶ cm^-3 interstitial oxygen. The signature of II is: E_c?E_II = 0.031 eV, K = 4 × 10⁷ cm^?2s^?1; level I is about half as deep. In addision, the excitation spectrum of I is recorded by PTIS. It is composed of three hydrogenic donor series Ia, b, c with activation energies 17.25, 17.6 and 18.1 meV. The donors I and II are thought to correspond with the well known thermal oxygen donors. Energies for the latter were determined at 0.017 and 0.04 eV from Hall effect by Fuller and Doleiden. The possibility of double donors is examined, in analogy with the case of oxygen donors in silicon.     

Effect of swift heavy ion irradiation on dilute Fe-doped Sb0.95Se0.05 magnetic semiconductor

A thin film of dilute Fe (0.008)-doped Sb_0.95Se_0.05 alloy was grown on silicon substrate using the thermal evaporation technique. This film was irradiated with swift heavy ions (SHIs) Ag⁺¹⁵ having 200?MeV energy at ion fluences of 1?×?10¹² and 5?×?10¹² ions per cm², respectively. The thickness of the thin film was ～500?nm. We study the effect of irradiation on structural, electrical, surface morphology and magnetic properties of this film using grazing angle XRD (GAXRD), DC resistivity, atomic force microscopy (AFM) and magnetic force microscopy (MFM), respectively. GAXRD suggests that no significant change is observed in this system due to SHI irradiation. The average crystallite size increases with fluence, whereas the AFM image shows the rms roughness decreases due to irradiation with respect to the un-irradiated thin film. The MFM image shows that the magnetic interaction in irradiated film decreases due to the irradiation effect. Although the un-irradiated sample shows metal to semiconducting transition, but after irradiation with fluence of 5?×?10¹² ions per cm², the sharpness of the metal to semiconducting phase transition is observed to increase dramatically at ～300?K. This characteristic of the thin film makes it a promising candidate for an electrical switching device after irradiation.     

Energy dependence of electron-induced radiation damage in tungsten

Abstract

The energy dependence of low dose damage production in commercial and high purity polycrystalline tungsten wires was studied near 350 K with 1.6 to 2.4 MeV electrons. From resistivity measurements at 291 K the threshold energy for the onset of observable damage was determined as 50 × 2 eV. An ‘effective’ threshold of 52 ±2 eV was also determined by directly fitting the energy dependence of the damage rates to theoretical displacement cross sections calculated from step-function displacement probabilities. A decrease of two orders of magnitude in impurity content reduced damage rates by about a factor of two but did not affect threshold. These results combined with current defect recovery models for tungsten, low temperature threshold data, and computer-calculated bcc damage theory suggest: (1) Observed damage consisted of equal concentrations of vacancies and impurity-trapped Stage I free interstitials. (2) Across Stage II (100 K to 600 K) onset threshold should be within 50 ±2 eV. (3) Minimum recoil energy required for free interstitial production near 0 K is 53 ± 5 eV. (4) Threshold has little dependence on crystal direction. An empirical method is presented for predicting threshold energies in the bcc transition metals by assuming the directional dependence of threshold is directly proportional to that of Young's modulus. By the use of one universal proportionality constant (1.2 × 10^?11 eV.cm²/dyne), thresholds for a number of metals and directions are calculated and shown to have significantly better agreement with experiment than the best available theoretical estimates.     

On the high-resistivity contacts to YBa2Cu3O7 thin films, electrical behavior in the regime of high temperatures and high-bias voltages

We prepared in-situ Au contacts on high-quality epitaxial YBa₂Cu₃O₇ (YBCO) films. Very high specific contact resistivity values up to ∼10⁻² Ω cm² at 4.2 K were obtained on 12×5 μm² contact areas. This resistivity value decreased by two orders of magnitude as the temperature was raised to room temperature. In the temperature range T<200 K, the contacts showed non-ohmic behavior suggesting the presence of a well-defined insulating native Y-Ba-Cu-O barrier between the two electrodes. The electrical transport in this barrier layer was analyzed in the limit of high temperatures and high voltages to follow Mott's variable-range hopping conduction mechanism with physically reasonable parameters describing the localized states in the barrier. The high-resistivity contacts were tested successfully in quasiparticles injection experiments where the critical current I_c of the YBCO microbridge could be strongly suppressed on injection of an additional current through the contact into the superconducting channel.