电子束蒸发沉积Al-Cr合金涂层研究

研究了电子束蒸发镀沉积Al-Cr合金涂层的工艺，探讨了铬含量对涂层耐蚀性的影响。对涂层的物相、形貌以及热处理对涂层和基体之间热扩散的影响进行了分析．结果表明：涂层中铬含量与膜料中铬含量有较大差异；在温度为283K，30g／L NaCl溶液中含1.5％Cr、2.5％Cr、5％Cr的Al-Cr合金涂层的自腐蚀电位均比普通钢基材的电位负，因此它们作为阳极性涂层对普通钢基材能起到较好的电化学保护；涂层为晶态组织，其物相为Al和少量的Cr9Al17。随膜料中Cr含量的增加，其生成的Cr9Al17的量也随之增多；在真空蒸镀时涂层沉积有方向性；对涂层进行600℃，lh热处理后，涂层与基体间元素产生了互扩散．     

环氧树脂表面化学镀镍层制备及结合力评价

采用化学镀的方法在环氧树脂表面制备镍镀层。观察了镀层表面和横截面形貌,研究了温度对镀层的表面形貌、沉积速率和结合力的影响,以及镀液pH值对镀层质量和沉积速率的影响,并对镀层与基体的结合力进行了评价。结果表明,环氧树脂化学镀镍的沉积速率随温度的升高而增大,但温度不宜太高,温度太高会增大镀层内部应力,降低镀层结合力。最佳施镀温度为35℃,镀液的最佳pH值为10,制备的镀层表面平整、均匀致密,镀层沉积速率为12μm/h,镀层与基体的结合力可达22.06 N。     

弧离子镀TiAlN涂层与模具钢基材的结合力的优化

采用弧离子镀方法在SKD61模具钢基体上制备TiAIN薄膜,分析了工艺参数对膜层与模具钢基体结合力的影响.应用正交法.依据涂层与基体的临界载荷越大结合力越好的原则,得出了最优涂层的工艺参数:基体温度220℃、弧流60A、沉积基体偏压-800V、气体压强1.3 Pa、预处理基体偏压-450V和预处理时间15min.优化后的涂层与基体的临界载荷达到56 N,比优化前最大临界载荷增加43%.TiAIN薄膜与模具钢基体结合力的改进主要归功于涂层的高硬度和TiAIN相(111)、(200)和(220)取向的竞争生长.     

Al箔溅射沉积Cu膜的工艺研究

为了研究溅射工艺对膜-基间结合力的影响,获得成本较低、膜-基间结合较好的表层导电薄膜电磁屏蔽材料,利用磁控溅射镀膜方法在Al箔基体上溅射沉积Cu膜,采用胶粘带拉剥法测试了膜-基间的结合力,使用扫描电子显微镜观察了Cu膜的组织和Al/Cu的界面形貌.结果表明:溅射工艺对膜-基间的结合力有着明显的影响,镀Cu前对Al箔进行反溅射和在溅射沉积过程中对工件施加负偏压都可有效地提高膜-基间的结合力.分析认为:镀Cu前反溅射可有效地去除Al箔表面的氧化膜,使Al箔表面得到净化;在磁控溅射沉积过程中对工件施加较高负偏压将产生辉光放电,使工艺转化成溅射离子镀,从而获得与基体结合良好、晶粒细小、致密的镀层.     

PVC塑料上微波辅助化学镀镍

研究了在微波辅助下PVC塑料上沉积Ni-P合金的工艺,以及镀液的主要成分对沉积速率和镀层性能的影响,确定了镀液的最佳配方,且与常规镀进行了比较。结果表明,利用微波加热可显著提高化学镀Ni-P合金的镀速、降低施镀温度,可以在PVC塑料上获得表面平整致密、与基体结合良好、耐蚀性良好、具有银白色金属光泽的镍磷镀层。     

化学复合镀镍-磷-金刚石镀层性能的研究

研究了化学复合镀Ni—P-金刚石镀层的金相组织、显微硬度、结合力及耐磨性能。结果表明：采用合适的工艺条件，可获得金刚石微粒含量较高、微粒分布均匀的镀层，镀层硬度可达1850HV左右，且镀层与基体结合力良好、耐磨性比化学镀Ni—P镀层大大提高。     

高硼硅玻璃表面化学镀Ni-P合金研究

为实现对玻璃表面的金属化改性,试验研究了高硼硅玻璃表面化学镀镍工艺。在前处理阶段采用喷砂和酸蚀结合的方法对玻璃基体表面进行粗化,使用PdCl2对玻璃基体表面进行活化。采用划线、划格试验法对镀层与基体的结合力进行了测试,并利用扫描电镜（SEM）、能谱成分分析（EDS）和X射线衍射（XRD）等方法对镀镍层的表面形貌、镀层成分及物相结构进行了分析表征。结果表明,施镀速度约为20μm／h,当施镀时间达到1h,所得镀层致密且厚度均匀,得到的非晶态镀层与玻璃基体之间的结合力良好。     

高速电喷镀纳米复合镀层组织与性能研究

采用高速电喷镀工艺制备纳米Ni/PTFE复合镀层.研究了电流密度、镀液中纳米PTFE含量等工艺参数对镀层性能的影响.研究结果表明,提高电流密度可显著提高复合镀层的沉积速率、镀层与基体的结合强度以及镀层的耐腐蚀性;镀层与基体的结合强度随镀液中PTFE的加入量的改变而变化,当加入量为10ml/L时,镀层经30次热震试验后,镀层无明显剥落;Ni与纳米PTFE共沉积可显著改善镀层的酎腐蚀性能.     

贵金属刷镀技术的研究和应用

金属刷镀是快速局部电镀新技术,其工艺名称目前提法不一,美国称之为选择性电镀(Selective plating)或刷镀(Brush plating),英国和法国称之为达力克工艺(Dalic process),我国国家标准则正式命名为刷镀.从原理上讲,刷镀与普通槽镀无异,同属于电化学沉积技术.但刷镀阳极、刷镀液及工艺形式与普通槽镀迥然不同.因而在阴极极化、镀层结构、镀层与基体的结合型式、镀层的机械性能等与槽镀有明显区别,而发     

膜基-体化耐高温蒙皮材料的制备及抗热震性能研究

采用电子束物理气相沉积技术(Electron Beam Physical Vapor Disposition, EB-PVD)通过连续蒸镀成功制备陶瓷ZrO_2涂层和以镍基合金为基体的一体化薄板材料.结果表明,ZrO_2涂层致密,具有柱状晶组织,无明显的织构存在.涂层与基体材料间有明显的成分连续梯度变化区域.抗热震性能测试结果显示,一体化材料的ZrO_2梯度涂层能明显延缓热震裂纹的形成和扩展,具有良好的抗热震性能.     

电子束蒸发与磁控溅射制备Al/PI复合薄膜的性能研究

利用磁控溅射法和电子束蒸发法在聚酰亚胺（PI）薄膜基底上沉积了铝功能膜。测试了两种方法薄膜的膜厚、附着力、反射率、折射率和电导率。结果表明,磁控溅射法制备的铝膜的综合性能较电子束蒸制备的铝膜的性能优越。     

SiO2/TiO2变折射率光学薄膜制造技术研究

探讨了单源混蒸技术制备SiO2/TiO2变折射率薄膜的可行性,分别蒸发SiO2和TiO2质量比为1:1和1:2的混料,研究分析了薄膜折射率的变化情况,并将其与双源共蒸的方法进行了比较.实验中发现,两种材料蒸发方式的差异是影响SiO2/TiO2变折射率薄膜制备的主要因素,尚未发现混料中SiO2和TiO2的质量比与SiO2...     

不同工艺制备的铁电薄膜底电极Pt／Ti

采用高真空电子束蒸与直流溅射在ＳｉＯ２／Ｓｉ基底上制备Ｐｔ／Ｔｉ底电极,对Ｐｔ／Ｔｉ在不同热处理温度下的结构与形貌进行对比研究。结果表明;由于采用不同的制备工艺,Ｐｔ晶粒在成核与生长方式上有所不同,导致了Ｐｔ薄膜在结构与形貌的差异。     

Electron beam deposition and characterization of thin film Ti-Ni for shape memory applications

Thin film of Ti-Ni alloy has a potential to perform the microactuation functions required in the microelectromechanical system (MEMS).It is essential, however, to have good uniformity in both chemical composition and thickness to realize its full potential as an active component of MEMS devices.Electron beam evaporation technique was employed in this study to fabricate the thin films of Ti-Ni alloy on different substrates.The targets used for the evaporation were first prepared by electron beam melting.The uniformity of composition and microstructure of the thin films were characterized by electron probe microanalysis (EPMA), Auger electron spectroscopy (AES), X-ray diffraction (XRD), scanning electron microscopy (SEM), atomic force microscopy (AFM) and transmission electron microscopy (TEM).The mechanical property of the thin films was evaluated by the nano-indentation test.The martensitic transformation temperature was measured by differential scanning calorimetry (DSC).It is confirmed that the chemical composition of deposited thin films is identical to that of the target materials.Furthermore, results from depth profiling of the chemical composition variation reveal that the electron beam evaporation process yields better compositional homogeneity than other conventional methods such as sputtering and thermal evaporation.Microstructural observation by TEM shows that nanometer size precipitates are preferentially distributed along the grain boundaries of a few micron size grains.The hardness and elastic modulus of thin films decreases with an increase in Ti contents.     

硼碳氮薄膜的制备与表征

用电子束蒸发的方法在单晶硅(100)基片上制备了硼碳氮薄膜,通过椭圆偏振仪、X射线衍射仪(XRD)、X光电子能谱仪(XPS)、傅立叶红外光谱仪(FTIR),测试分析了薄膜厚度均匀性、成分与结构.结果表明,薄膜均匀性较好,薄膜的沉积速率非常慢;薄膜在衬底温度为常温下沉积已是晶态的,随着衬底温度升高到450 ℃,其结晶性逐渐增强;薄膜不是石墨与BN的混和膜而是C、B、N相互结合成键.     

PREPARATION OF TiN FILMS BY N_2 ASSISTED Xe~+ ION BEAM ENHANCED DEPOSITION AND THEIR MECHANICAL PROPERTIES

A new method for preparation of hard TiN films has been developed by using electronbeam evaporation-deposition of Ti and bombardment with 40 keV Xe~+ ion beam ina N_2 gas environment.The synthesized TiN films were superior to PVD and CVDones in respects of improved adhesion to substrate and low preparing temperature.Theyexhibited good wear resistance and high hardness up to 2200 kg/mm~2.Some industrialapplications have been reported.     

Deposition and characteristics of chromium nitride thin film coatings on precision balls for tribological applications

Thin film hard coatings on rolling element surfaces can enhance the overall wear resistance of rolling element bearings, as demonstrated previously for coated tapered, cylindrical, and spherical roller bearings. Hard coatings in ball bearings are less common because of the difficulty in achieving uniform film thickness on a ball surface. This limitation is overcome by a new process for depositing chromium nitride coatings with uniform thickness on precision balls using ion beam assisted deposition (IBAD) e-beam evaporation. Scanning electron microscopy indicated that the deposited films were smooth and conformal on the ball surfaces with no areas of localized delamination. Auger electron spectroscopy confirmed that Cr₂N and CrN bulk film stoichiometry was achievable by modulating the argon to nitrogen process gas ratio during deposition. Transmission electron microscopy revealed dense, polycrystalline film structure. Film hardness and elastic modulus as measured using nanoindentation on the coated balls met expectations for chromium nitride, and tribological testing of the coated balls in angular contact ball bearings under moderate contact stress levels demonstrated adequate film adhesion for practical use of these coatings in bearing applications.     

MAGNETORESISTANCE EFFECT OBSERVED IN Fe／Mo MULTILAYERS PREPARED BY ELECTRON BEAM EVAPORATION

The Fe/Mo multilayers were prepared by electron beam evaporation, the micro structure and magnetic properties of the multilayers were studied by X-ray diffraction, vibrating-sample magnetometer (VSM) et al. The experimental results revealed that the Fe/Mo multilayers in our experimental conditions behaved magnetoresistance effect with a sharp peak on magnetoresistance (MR) ratio curve, and magnetoresistance is easily saturated at low applied magnetic fields. For [Fe(1.5nm)/Mo(1.0nm)]4,2 multilayers, MR ratio could arrive to 0.1%. The antiferromagnetic interlayer coupling could be observed in some films at room temperature. The strength of the antiferromagnetic interlayer coupling J in the films is low because of the low saturation field Hs. The relationship between magnetic properties and micro structure was also discussed in this paper.     

Effect of Substrate Temperature on Electroluminescence of SrS:HoF3 Thin Film

The SrS:HoF3 Electroluminescent (EL) thin films are prepared at the different substrate temperature by electron beam evaporation. The crystallinity and EL characteristics of the samples are analyzed. It is found that the main diffraction peak is (200) at the higher substrate temperature and the main diffraction peak is (111) at the lower substrate temperature. The blue emission intensity and EL brightness of the SrS∶HoF3 thin films increase with the increase of the substrate temperature. Annealing the samples can change the cyrstal phase and strengthen the blue emission of EL thin film.     

Tensile behavior of free-standing gold films. Part II. Fine-grained films

The room temperature mechanical behavior of thin gold films (0.2–2.0 μm thickness) was investigated through uniaxial tensile testing. Films were deposited by electron beam and thermal evaporation, under varying conditions, in order to produce films with different microstructures. This particular study concentrated on the behavior of the films with grain sizes of less than about 0.5 μm. The testing showed that these fine-grained films exhibited significant strain rate dependence, in contrast with a previous study of gold films with more coarse grain sizes [1]. The results are discussed in terms of existing theories for rate-dependent metals.