Influence of buffer layer thickness on DC performance ofGaAs/AlGaAs heterojunction bipolar transistors grown on siliconsubstrates

The DC performance of GaAs/AlAs heterojunction bipolar transistors (HBTs) grown on silicon substrates with buffer layers ranging from 0 to 5 μm was investigated. Current gain, collector-emitter breakdown voltage, emitter-base and collector-base diode ideality factors, and breakdown voltages were measured as the buffer layer thickness was varied between 0 and 5 μm. The current gain steadily increases with increasing buffer layer thickness until the layer reaches 3 μm. However, the other DC parameters are relatively insensitive to the buffer layer thickness. A small-signal current gain of 60 is typically achieved for devices with 6×6-μm² emitters at a density of 6×10⁴ A/cm² when the buffer layer is ⩾3 μm     

Effect of bulk recombination current on the current gain ofGaAs/AlGaAs heterojunction bipolar transistors in GaAs-on-Si

The effect of bulk recombination current on the current gain of heterojunction bipolar transistors (HBTs) in GaAs-on-Si has been studied. A thin AlGaAs emitter layer is used to prevent an exposed extrinsic base region, which has previously masked the effect of the bulk recombination current on the current gain in HBTs. It is found that once the surface recombination current is removed, the current grain due to bulk recombination alone is approximately ten times lower for the HBTs in GaAs-on-Si than for HBTs in GaAs. The difference in the current gain is probably due to electrically active dislocations in the base in the HBTs in GaAs-on-Si, where the density is about 10⁸ cm^-2 as measured by transmission electron microscopy     

Experimental comparison of base recombination currents in abrupt and graded AlGaAs/GaAs heterojunction bipolar transistors

The relative importance of the base bulk recombination current and the base-emitter junction space charge recombination current is examined for AlGaAs/GaAs HBTs with different grading schemes in the base-emitter junction. Experimental results demonstrate that, in abrupt HBTs, the base bulk recombination current is larger, and the base current increases with the base-emitter bias with an ideality factor of approximately 1. In contrast, in graded HBTs, the space charge recombination current dominates and the base current ideality factor is approximately 2. These experimental results agree well with a published theoretical calculation.<>     

Numerical investigation of the effects of graded layer on the performance of AlGaAs/GaAs heterojunction bipolar transistors

The effects of grading on the performance of heterojunction bipolar transistors (HBTs) are studied by numerically solving the basic semiconductor equations. The numerical modelling is based on the extended drift–diffusion formulation with inclusion of thermionic emission current at the heterointerface of abrupt emitter HBTs. The results of the simulation show that the graded layer improves significantly the current driving capability of the HBT and lowers its offset voltage. However, owing to the increase in the recombination in the graded layer, the current gain of the graded HBT is lower and depends strongly on the bias at low and medium bias range. The simulation also reveals the presence of a potential minimum in the conduction band of the graded emitter HBT, which results in an electron accumulation in the region. This accumulation increases the emitter-base capacitance and its charging time, leading to a smaller unity-gain frequency f _T.     

High-frequency performance of MOVPE npn AlGaAs/GaAs heterojunction bipolar transistors

Base doping densities near 10/sup 20/ cm/sup -3/ and emitter doping densities near 7*10/sup 17/ cm/sup -3/ have been achieved in MOVPE HBT structures and combined with self-aligned processing resulting in f/sub max/=94 GHz and f/sub t/=45 GHz. To the authors' knowledge, these are the first MOVPE HBTs demonstrated to operate at millimetre-wave frequencies.<>     

An investigation of the effect of graded layers and tunneling on the performance of AlGaAs/GaAs heterojunction bipolar transistors

We present the results of theoretical and experimental studies of the heterojunction bipolar transistor. Our calculations are based on a new thermionic field-diffusion model which takes into account the dependence of the emitter efficiency on the height of the interface conduction band spike and tunneling across the spike. Based on this theory we derive analytical expressions for the current-voltage characteristics and relate the short-circuit common emitter current gain to the material parameters, doping levels, grading length, and device temperature. We demonstrate that the thermoemission transport across the interface spike limits the rate of increase in the collector current with the emitter-base voltage and, as a consequence, the maximum common emitter current gain. Tunneling also plays an important role, especially for abrupt heterojunctions. Our calculations reveal an important role played by grading of the composition of the emitter region in the vicinity of the heterointerface. Such grading decreases the barrier height at the interface and greatly enhances the emitter injection efficiency.     

Numerical study on the injection performance of AlGaAs/GaAs abruptemitter heterojunction bipolar transistors

The injection performance of abrupt emitter HBT's and related effects on the device characteristics are studied by taking an Npn Al _0.25Ga_0.75As/GaAs/GaAs HBT as an example. In order to take into account the coupled transport phenomena of drift-diffusion and tunneling-emission processes across the abrupt heterojunction in a single coupled formulation, a numerical technique based on the boundary condition approach is employed. Compared to previous numerical investigations relying on either a drift-diffusion or a tunneling-emission scheme, more complete and accurate characterization of abrupt emitter HBT's has been achieved in this study. It is demonstrated that the presence of abrupt discontinuities of the conduction and valence bands at the emitter-base junction brings several different features to the injection efficiency and recombination characteristics of abrupt emitter HBT's compared to graded emitter HBT's. Based on investigations of the emitter doping effects on the current drive capability and device gain, an optimum emitter doping density is determined for a given structure. When the emitter-base p-n junction of the abrupt emitter HBT is slightly displaced with respect to the heterojunction, significant changes in the electrical characteristics are observed. A small displacement of the p-n junction into the narrow bandgap semiconductor is found to be very attractive for the performance optimization of abrupt emitter HBT's     

Reduction of extrinsic base resistance in GaAs/AlGaAs heterojunction bipolar transistors and correlation with high-frequency performance

Improved high-frequency performance in GaAs/AlGaAs heterojunction bipolar transistors (HBT's) by reduction of extrinsic base resistance is demonstrated. A new self-aligned process which is very simple, yet capable of producing 0.25-µm emitter-to-base contact gaps, is described. By the use of AuBe, we have also been able to produce contact resistances to p-type GaAs (p = 5 × 10¹⁸) as low as 1.2 × 10^-7Ω.cm². This is the lowest value reported to p-type GaAs considering the relatively low doping levels used. By employing these techniques, we have produced HBT's with 2.5-µm-wide emitters having current gain cutoff frequencies fTthat appear to be greater than 35 GHz and maximum oscillation frequenciesf_{max}of 22 GHz.     

High-frequency characteristics of AlGaAs/GaAs heterojunction bipolar transistors

The fabrication and high-frequency performance of MBE-grown AlGaAs/GaAs heterojunction bipolar transistors (HBT's) is described. The achieved gain-bandwidth product fTis 25 GHz for a collector current density Jcof 1 × 10⁴A/cm²and a collector-emitter voltage VCEof 3 V.fTcontinues to increase with the collector current in the high current density region over 1 × 10⁴A/cm²with no emitter crowding effect nor Kirk effect. The limitation on fTin fabricated devices is found to be caused mainly by the emitter series resistance.     

The effect of base grading on the gain and high-frequencyperformance of AlGaAs/GaAs heterojunction bipolar transistors

A comprehensive one-dimensional analytical model of the graded-base Al_xGa_1-xAs/GaAs heterojunction bipolar transistor is presented and used to examine the influence of base grading on the current gain and the high-frequency performance of a device with a conventional pyramidal structure. Grading is achieved by varying the Al mole fraction x linearly across the base to a value of zero at the base-collector boundary. Recombination in the space-charge and neutral regions of the device is modeled by considering Schockley-Read-Hall, Auger, and radiative processes. Owing to the different dependencies on base grading of the currents associated with these recombination mechanisms, the base current is minimized, and hence the gain reaches a maximum value, at a moderate level of base grading ( x=0.1 at the base-emitter boundary). The maximum improvement in gain, with respect to the ungraded base case, is about fourfold. It is shown that the reduction in base transit time due to increased base grading leads to a 30% improvement in f_T in the most pronounced case of base grading studied (x=0.3 at the base-emitter boundary). The implications this has for improving f _max via increases in base width and base doping density are briefly examined     

Monte Carlo simulation of AlGaAs/GaAs heterojunction bipolar transistors

A first demonstration of one-dimensional Monte Carlo simulations of AlGaAs/GaAs heterojunction bipolar transistors is reported. The electron motion is solved by a particle model, while the hole motion is solved by a conventional hydrodynamic model. It is shown that the compositional grading of AlxGa1-xAs in the base region is effective to cause the ballistic acceleration of electrons in the base region, resulting in a high collector current density of above 1 mA/µm². The current-gain cutoff frequency fT reaches 150 GHz if the size of a transistor is properly designed. Also shown is the relation between the device performances and the electron dynamics investigated.     

High-frequency output characteristics of AlGaAs/GaAs heterojunction bipolar transistors

A model has been developed which generates the high-frequency i/sub c/-v/sub ce/ output characteristics of bipolar transistors from computed cutoff frequency against current density data. The presented results, which can be used directly for large-signal modelling are the first report of high-frequency output characteristics of bipolar transistors.<>     

Fabrication and characterization of AlGaAs/GaAs heterojunction bipolar transistors

The fabrication and characterization of MBE-grown AlGaAs/GaAs heterojunction bipolar transistors (HBT's) are described, A Be redistribution profile in the HBT epi-layer at the emitter-base heterojunction interface is investigated using secondary ion mass spectrometry, A relatively high substrate temperature of 650°C during growth can be employed by introducing a 100-Å undoped spacer layer between the emitter and base layer. A simple wafer characterization method using phototransistors is demonstrated for accurately predicting current gain in a three-terminal device. A dc current gain of up to 230 is obtained for the fabricated HBT with a heavy base doping of 1 × 10¹⁹/cm³. A gain-bandwidth product fTof 25 GHz is achieved with a 4.5-µm-width emitter HBT.     

Ideality factor of extrinsic base surface recombination current in AlGaAs/GaAs heterojunction bipolar transistors

Various structures of npn AlGaAs/GaAs heterojunction bipolar transistor have been fabricated to examine the ideality factor for extrinsic base surface recombination. Comparison of the measured results indicates that the base surface recombination current increases exponentially with the base-emitter voltage with an ideality factor of 1, rather than 2. This finding agrees with a published theoretical analysis (see Tiwari et al., J. Appl. Phys., vol.64, p.5009, 1988).<>     

GaAs/AlGaAs heterojunction emitter-down bipolar transistors fabricated on GaAs-on-Si substrate

GaAs/AlGaAs heterojunction bipolar transistors with emitter-down structure were fabricated on GaAs-on-Si substrate for the first time. A maximum current gain of 25 was measured at a collector current density of 6250 A/cm². This value is comparable with that from similar devices fabricated on GaAs substrates. This result, along with previous work on large-scale integration of emitter-down transistors, demonstrates the potential for high-level integration of bipolar devices on GaAs-on-Si substrates.     

(GaAl)As/GaAs heterojunction bipolar transistors with graded composition in the base

The first fabrication and high-speed operation of a three-terminal (AlGa)As/GaAs heterojunction bipolar transistor with graded bandgap base is reported. Cutoff frequencies up to 16 GHz have been achieved in devices fabricated from material made by molecular beam epitaxy. This work demonstrates the feasibility of using a graded (AlGa)As base to enhance the speed of heterojunction bipolar transistors.     

Planar AlGaAs/GaAs heterojunction bipolar transistors fabricatedusing selective W-CVD

The authors describe a planar process for the AlGaAs/GaAs HBTs in which collector vias are buried selectively, even to the base layers, with chemical vapor deposited tungsten (CVD-W) films. By using WF₆ /SiH₄ chemistry, W could be deposited on Pt films, which were overlapped 50 nm thick on the AuGe-based collector electrodes, without depositing W on the surrounding SiO₂ layers. Current gains of planar HBTs with 3.5-μm×3.5-μm emitters were up to 150, for a collector current density of about 2.5×10⁴ A/cm²     

GaAs/AlGaAs heterojunction bipolar transistors for integrated circuit applications

Molecular-beam epitaxy (MBE) and ion implantation were used to fabricate GaAs/AlGaAs heterojunction bipolar transistors with buried wide bandgap emitters. Inverted-mode current gains of ∼ 100 were obtained, demonstrating the feasibility of this technology for I²L types of digital integrated circuits.     

Collector-top GaAs/AlGaAs heterojunction bipolar transistors for high-speed digital ICs

GaAs/AlGaAs collector-top heterojunction bipolar transistors with magnesium and phosphorus double-implanted external bases were fabricated. A cutoff frequency of 17 GHz and a gate delay time of 63 ps for DCTL were obtained. These results indicate the potential of collector-top HBTs for high-speed ICs.     

High-speed frequency dividers using self-aligned AlGaAs/GaAs heterojunction bipolar transistors

A divide-by-four frequency divider and ring oscillators have been fabricated employing self-aligned AlGaAs/GaAs heterojunction bipolar transistors (HBT's). Maximum toggle frequency of 13.7 GHz and propagation delay time of 17.2 ps are achieved in ECL gate circuitry. These values are the highest and the lowest in ECL circuits and in bipolar circuits, respectively, ever reported.