炭黑—环氧树脂导电复合材料的研究

本文研究了炭黑－环氧树脂合材料的制备工艺及炭黑填充率对材料电阻率的影响。实验结果表明，加入表面活性剂，明显改善了炭黑在环氧树脂中分布的均匀性、炭黑－环氧树脂材料具有明显的渗流效应，正温度系数效应即ＰＴＣ效应，非线性伏安特性和电磁波屏蔽效应。     

炭黑－环氧树脂导电复合材料的研究

本文研究了炭黑－环氧树脂复合材料的制备工艺及炭黑填充率对材料电阻率的影响。实验结果表明，加入表面活性剂，明显改善了炭黑在环氧树脂中分布的均匀性。炭黑－环氧树脂材料具有明显的渗流效应，正温度系数效应即ＰＴＣ效应，非线性伏安特性和电磁波屏蔽效应。     

环氧树脂/碳纳米管复合材料制备及导电性能研究进展

简要介绍了环氧树脂/碳纳米管复合材料的组成以及碳纳米管在环氧树脂中的分散方法;综述了环氧树脂/碳纳米管复合材料的制备方法,包括溶液浇铸法、原位聚合法、化学改性法、混合固化剂辅助叠层法和树脂传递模塑法;总结了国内外对环氧树脂/碳纳米管复合材料导电性能的研究现状,并分析了影响其导电性能的因素,包括碳纳米管的比表面积、表面功能化和制备方法,剪切速率及固化条件等。     

炭黑/环氧树脂复合材料的制备及电性能研究

介绍了以二氧化硅为分散剂的炭黑/二氧化硅/环氧树脂基复合材料的组成、制备、导电机理,渗流阈值及PTC效应。分析了影响其PTC效应的因素,包括炭黑粒子、聚合物基体以及材料的加工工艺等。     

聚烯烃/炭黑导电复合材料研究

研究了聚烯烃种类、聚烯烃共混物、炭黑种类及用量和加工方法对聚烯烃／炭黑导电复合材料电学和力学性能的影响     

炭黑/环氧树脂复合材料的电性能研究进展

介绍了炭黑/环氧树脂(EP)复合材料的制备工艺,讨论了炭黑/EP复合材料导电性能的影响因素,评述了炭黑/EP复合材料电阻正温度系数效应的机理解释和研究进展,展望了这一类材料的研究重点和发展前景。     

SBS/导电炭黑复合材料的导电性能研究

导电高分子复合材料是高聚物与导电填料共混制成的功能性材料。导电炭黑由于具有分散性好、可赋予高聚物较好的导电性能而广泛用作导电填料。本工作探讨导电炭黑和混炼工艺条件对苯乙烯-丁二烯-苯乙烯嵌段共聚物（SBS）／导电炭黑复合材料导电性能的影响。     

导电炭黑对玻璃纤维增强环氧树脂复合材料电性能的影响

以导电炭黑填充玻璃纤维增强环氧树脂复合材料,通过测定复合材料的静电屏蔽电压、静电衰减时间、表面电阻率数值,对影响电性能的几个主要因素进行了研究。结果表明,导电炭黑填充复合材料的防静电效果显著,导电炭黑适宜用量为1.1~1.2份,粒度为7~9 nm;填充时,将导电炭黑直接加入到环氧树脂体系中,然后用高速分散机搅拌10~15 min。     

炭黑/环氧树脂复合材料阻温特性研究

分别以低结构炭黑(F101)和高结构导电炭黑(XE2)作为导电填料,不同牌号(E-54,E-51和E-44)的环氧树脂(EP)作为基体树脂,采用超声分散溶液混合法制备了炭黑/环氧树脂(CB/EP)复合材料.研究了CB结构、CB含量和EP基体等对复合材料正温度因数(PTC)效应的影响.结果表明:F101/EP复合材料具有...     

CTBN对CB/EP基导电复合材料电性能的影响

以低结构CB(炭黑)为导电填料、EP(环氧树脂)为基体、CTBN(端羧基液体丁腈橡胶)为改性剂和2,4-EMI(2-乙基-4-甲基咪唑)为固化剂,采用超声分散法制备CB/EP基导电复合材料.研究结果表明:CB/EP基导电复合材料具有明显的导电渗流行为,其渗流阈值为w(CB)=7.1％;当w(CTBN)=12％时,含CT...     

Agglomeration and electrical percolation behavior of carbon black dispersed in epoxy resin

In conductive polymer compounds, the filler volume fraction at which a network of touching particles is formed is not a constant but depends on the manufacturing process. By applying three main features—particle-particle interaction, dynamics of agglomeration, and structure of agglomerates—which are well known in colloid science to filled polymers, the electrical percolation behavior can be understood. Thus, it is possible to explain the hitherto found low percolation thresholds of less than 0.5 vol% in carbon-black-filled resins and, hence, further reduce the threshold to 0.06 vol%. © 1997 John Wiley & Sons, Inc. J Appl Polym Sci 63: 1741–1746, 1997     

Polyurethane/conducting carbon black composites: Structure,electric conductivity,strain recovery behavior,and their relationships

The polyurethane composites with conducting carbon black (CB) were prepared by a solution‐precipitation process, which was followed by melt compression molding. The polyurethane used has good shape memory effect. The morphology of CB fillers in polyurethane matrix and the resulting conductivity of the composites were investigated. It has been found that CB fillers exist in the forms of aggregates. The percolation threshold is achieved at the CB concentration of 20 wt %. The presence of CB fillers decreases the degree of crystallinity of polycaprolactone (PCL) soft segments of the polyurethane. However, the composites still have enough soft‐segment crystals of polyurethane to fulfil the necessary condition for the shape memory properties. Dynamic mechanical data show that CB is an effective filler for the reinforcement of the polyurethane matrix, but does not deteriorate the stable physical cross‐link structure of the polyurethane, which is necessary to store the elastic energy in the service process of the shape memory materials. Addition of CB reinforcement in the polyurethane has influenced the strain recovery properties, especially for those samples with CB concentrations above the percolation threshold. The response temperature of the shape memory effect T_r has not been affected too much. Strain fixation S_f, which expresses the ability of the specimens to fix their strain, has been improved in the presence of the CB fillers. The final recovery rates R_f and strain recovery speeds V_r of the shape memory measurements, however, have decreased evidently. It is expectedly ascribed to the increased bulk viscosity as well as the impeding effect of the inter‐connective structure of CB fillers in the polymer matrix. © 2000 John Wiley & Sons, Inc. J Appl Polym Sci 75: 68–77, 2000     

碳纤维增强环氧树脂基复合材料的性能研究

研究了WBS-3环氧树脂固化体系的反应特性,分析了该固化体系浇铸体的性能;并以碳纤维(T-700S)为增强材料,采用手糊成型螺栓加压工艺制备了WBS-3/T-700S复合材料,研究了复合材料的常温力学性能、高温力学性能、水煮后力学性能和动态力学性能,并对弯曲断面进行分析。研究结果表明,WBS-3树脂基体黏度低、适用期长且韧性好,适合于手糊成型、缠绕成型等低成本制造工艺;由此制得的WBS-3/T-700S复合材料具有优良的力学性能和耐高温性能,其弯曲强度为1434MPa,拉伸强度为1972MPa,剪切强度为76.1MPa,玻璃化温度(Tg)超过210℃;该WBS-3/T-700S复合材料具有很好的界面粘接性(树脂对纤维的浸润性良好)、较低的空隙率且纤维分布均匀。     

天然鳞片石墨/环氧树脂复合材料的制备及导热性能研究

以天然鳞片石墨为导热填料,E44型环氧树脂为基体,采用超声分散法制备天然鳞片石墨/环氧树脂复合导热材料.系统考察了天然鳞片石墨用量、石墨粒度和炭黑添加量等因素对复合材料导热性能的影响.结果表明:随着天然鳞片石墨用量增加,复合材料的导热系数增大,抗压强度先增加后减小;复合材料的导热系数随天然石墨粒径的增大而增大,抗压强度先减小后增加;在石墨/环氧树脂复合导热材料中添加不同用量的炭黑时,随着炭黑添加量的增加,复合材料的抗压强度增大,导热系数先增大后减小.制备天然鳞片石墨/环氧树脂复合导热材料的最佳配方为天然鳞片石墨用量45％,粒径≤270 μm,炭黑用量2％.     

碳化硅/环氧树脂导热复合材料的制备与性能

采用浇铸成型法制备碳化硅/环氧树脂(SiC/EP)导热复合材料,研究了SiC种类、粒径、用量和表面改性方法对SiC/EP复合材料的导热性能、力学性能和热性能等影响。结果表明:SiC/EP复合材料的导热系数随纳米级SiC用量增加而增大,当φ(纳米级SiC)=17.80%时,导热系数为0.954 6 W/(m.K);SiC/EP复合材料的弯曲强度和冲击强度随纳米级SiC用量增加均呈先升后降态势,当φ(纳米级SiC)=3.50%时,两者均达到最大值。SiC经表面改性后可有效提高复合材料的导热性能和力学性能,并且改性SiC的加入可有效降低EP的玻璃化转变温度。     

碳纳米管在环氧树脂改性中的应用研究进展

阐述了碳纳米管(CNTs)在EP(环氧树脂)基复合材料中的应用情况,着重讨论了CNTs表面改性的原因及其对EP基复合材料性能(包括力学性能、热性能和电性能等)的影响,并介绍了国内外该类复合材料的研究成果。最后对CNTs/EP基复合材料的研究方向进行了展望。