电流密度对甲基磺酸盐电沉积亚光锡的影响

在甲基磺酸盐电镀溶液中进行恒电流电沉积亚光锡镀层实验,考察电流密度对镀液极化性能、阴极过电位、电流效率、沉积速率及镀液分散能力的影响。利用SEM和XRD分析不同电流密度所得锡镀层的表面形貌和结晶取向。结果表明:随着电流密度增大(0.5～4A.dm-2),镀液的阴极极化增大,电流效率先增加后降低,沉积速率不断加快,但镀液分散能力有所下降;晶体由"向上生长"模式逐渐转变为"侧向生长"模式,择优取向由(321),(431)晶面转变为(112),(332)晶面;添加剂吸附在晶体表面,降低了被吸附晶面的表面自由能,使这些晶面的生长速率下降,从而改变了镀层择优取向和晶体生长的方式。     

聚乙烯亚胺添加剂对碱性镀铜电沉积行为的影响

为了研究碱性镀铜中添加剂对铜电沉积行为的影响,采用一种新型柠檬酸碱性镀铜工艺制备了铜镀层,研究了聚乙烯亚胺添加剂在新型柠檬酸盐碱性镀铜中的作用机理.运用SEM,XRD和电化学方法对镀液、镀层进行了分析.结果表明:聚乙烯亚胺有利于获得较宽的电流密度范围和均匀细致的镀层,使铜镀层表现出(111)晶面的择优取向,铜的沉积为侧向生长;聚乙烯亚胺优先吸附在阴极高电流密度处,并对铜沉积产生较强的阻化作用;铜电沉积的初期行为服从扩散控制和三维连续成核方式生长规律.     

Cr颗粒含量对Ni-Cr纳米复合镀层组织结构的影响

使用Ni与纳米Cr颗粒共沉积方法制备Ni-Cr纳米复合镀层,研究了镀液中Cr颗粒浓度、搅拌强度和阴极电流密度等工艺参数对镀层中沉积Cr量的影响.结果表明:镀层中纳米Cr颗粒的复合改变了电沉积Ni的生长方向,Ni晶粒由原来沿(200)晶面取向生长,转变为沿(200)、(111)和(220)晶面均匀生长.镀层中Cr复合量越多,Ni晶粒的形核位置越多,Ni晶粒越细化.也探讨了Ni-Cr纳米复合镀的沉积机理.     

用脉冲喷射电沉积法制备纳米晶镍镀层

采用脉冲喷射电沉积方法制备了纳米晶镍镀层,用扫描电子显微镜(SEM)、透射电子显微镜(TEM)和X射线衍射(XRD)等方法研究了镀层的生长形貌和微观结构,并考察了脉冲电流密度对镀层微观结构如晶粒尺寸、织构等的影响.结果表明:镀层内表面(基体一侧)具有比外表面(镀液一侧)更为精细的晶粒结构,说明随着厚度的增加,镀层中的晶粒逐渐粗化.随着电流密度从45 A/dm2增加到180 A/dm2,镀层中晶粒生长的择优取向由(111)织构逐渐转变为强(220)织构.当电流密度从45 A/dm2增加到120 A/dm2时,镀层平均晶粒尺寸逐渐减小;而进一步增加电流密度到180 A/dm2,镀层晶粒尺寸又会有轻微的增大.     

酸性镀铜有机添加剂的研究

研究了有机添加剂在酸性电镀铜工艺中的作用和效果,并与使用较多的2种国内和国外染料体系酸铜添加剂的阴极极化曲线、镀液的深镀能力、镀层表面形貌作了对比.结果表明,本研究所用的无染料酸铜有机添加剂深镀能力、铜镀层光亮面积与国外添加剂基本相当.其阴极极化曲线也与国外酸铜添加剂的阴极极化曲线形状相似,峰值电位和峰值电流密度相近,极化值近乎相等.     

添加剂对四羟丙基乙二胺-乙二胺四乙酸二钠体系化学镀厚铜的影响

为解决目前四羟丙基乙二胺(THPED)-EDTA·2Na盐化学镀铜体系存在的镀速慢、稳定性不佳等问题,重点考察了不同添加剂对THPED-EDTA·2Na盐化学镀铜的影响。结果表明:硫脲(3 mg/L)、2-巯基苯并噻唑(2-MBT)和有机物M(含巯基的咪唑类化合物)对镀液的稳定效果较好;硫脲会极大地降低沉积速率,且镀层较差;2-MBT可以提高沉积速率,但稳定镀液的能力有限;有机物M兼有加速剂、稳定剂和光亮剂的功能,对镀液的稳定效果最好,且镀层光亮细致;吐温-80和亚铁氰化钾均能改善镀层外观质量,但对沉积速率及镀液稳定性的影响不大;通过正交试验,以有机物M与2-MBT,吐温-80和亚铁氰化钾复配,确定了最优复合添加剂配方:2-MBT 7mg/L,有机物M 20 mg/L,亚铁氰化钾10 mg/L,吐温-80 20 mg/L;在适宜工艺条件(温度40℃,p H值12.5)下,镀速达到16.3μm/h,镀液稳定时间可达146 min,所得镀层平整、光亮、细致,沉积层为立方晶系铜,PCB孔覆背光级数达到9级,满足PCB工业生产要求。     

改性甲壳胺在酸性镀铜中的应用研究

在甲壳胺作为一种添加剂可用于铵盐、钠盐镀锌的基础上 ,对改性甲壳胺在酸性镀铜中的应用作了进一步研究。通过赫尔槽试验及镀液电流效率、深镀能力、均镀能力、镀层沉积厚度等测试表明 ,改性甲壳胺作为酸性镀铜的一种光亮剂 ,对镀层的平整性和光亮性起到了明显的作用。     

防变色Ag/C纳米复合镀层的制备工艺研究

为了研发具有良好防变色能力的银镀层,采用复合电镀技术,在以酒石酸钾钠为配位剂的无氰复合镀银溶液中制备了Ag/C纳米复合镀层.采用SEM和XRD对Ag/C纳米复合镀层的形貌、结构进行了表征,测试了其电阻及防变色能力.结果表明,Ag/C复合镀层中的碳粉含量随镀液中纳米碳粉浓度的增加而增大,当镀液中纳米碳粉浓度超过10g/L时,镀层中的碳粉含量又开始下降.Ag/C复合镀层中碳粉的复合量随着电流密度的增加先增大后减小,在电流密度为0.6～0.8A/dm2范围内,镀层中碳粉的复合原子分数接近8%.Ag/C复合镀层中基质金属银的晶粒尺寸在纳米级,其择优取向沿(220)晶面.Ag/C复合镀层的电阻与光亮银镀层的相当,但其抗变色能力较光亮银镀层显著提高.     

亚铁氰化钾对以次磷酸钠为还原剂化学镀铜的影响

研究亚铁氰化钾对化学镀铜沉积速度、镀层成分、电阻率、微观结构、表面形貌和化学镀铜过程中氧化还原反应的影响.添加亚铁氰化钾可以显著降低沉积速度,使镀层变得均匀致密,颜色也从棕黑色变为亮铜色,电阻率明显降低.添加亚铁氰化钾还可使镀层P含量略微降低,改善镀层微观结构,晶粒尺寸增大,镀层由(111)晶面择优取向变为(220)晶面择优取向.亚铁氰化钾主要通过吸附作用抑制在镀层表面发生的次磷酸钠氧化反应而降低化学镀铜沉积速度.亚铁氰化钾还可明显降低化学镀铜过程中NaH2PO2/CuSO4消耗摩尔比.     

无氰高密度镀铜工艺及其在汽车轮毂中的应用

无氰碱性镀铜技术已发展多年,终因镀液不稳定、预镀层结合力不稳定等问题而不能大规模生产应用.采用无氰高密度镀铜工艺制备了SF-8639无氰高密度铜镀层,对镀液的电流效率、分散能力、覆盖能力、沉积速度以及镀层的结合力、韧性、孔隙率进行了测试,并和国外同类技术及常用的电镀预镀工艺(氰化预镀铜、预镀哑镍)进行对比.结果表明:本工艺镀液稳定,容易控制,分散能力和覆盖能力超过氰化预镀铜;镀液和镀层各项性能达到或超过进口同类无氰碱铜;镀层致密,孔隙率比进口同类无氰碱铜低,结合力好,适用于铝合金轮毂沉锌后的预镀;本工艺在实际生产中已得到了很好的应用,具有良好的发展前景.     

4 μm SiC颗粒表面化学镀铜工艺

为了增强微米级SiC陶瓷颗粒与金属基体的结合力,采用化学镀铜法对SiC颗粒表面进行了改性处理,使SiC颗粒在金属基体液中分散更均匀、镀覆更好。通过正交试验法优化了化学镀铜工艺的主要参数,研究了其主要工艺条件对化学镀铜的影响;分别通过JSM7500F,S-3400N扫描电镜(SEM)对微米级SiC颗粒镀铜前后的表观形貌进行了观察分析,利用X射线衍射仪(XRD)对其镀铜前后的组成进行了表征,并测试了镀铜层与SiC颗粒的结合力;同时对比了微米级SiC颗粒镀铜前后对锌基复合材料微观形貌的影响;讨论了镀液中配位剂、pH值、还原剂等对铜镀层的影响。结果表明:随着镀液中配位剂、还原剂含量的增加,单位时间内微米级SiC颗粒表面镀铜层的质量先增加后降低,pH值的升高显著降低了镀铜的诱导时间;可实现微米级SiC颗粒表面化学镀铜层的均匀镀覆,且结合良好。     

Ni-Cu-P化学镀层的制备及其耐烟气冷凝液的腐蚀性能

为了解决冷凝式燃气利用设备的腐蚀问题,采用化学镀工艺在紫铜基体上沉积Ni-Cu-P层.利用扫描电镜(SEM)、电子能谱(EDX)、电子探针(EPMA)分析镀层的形貌和成分,利用极化曲线和交流阻抗谱考察了紫铜基材及其Ni-Cu-P镀层在15℃和60℃煤气烟气冷凝液中的耐腐蚀性能.结果表明:Ni-Cu-P化学镀层表面均匀平...     

新型环保型化学镀铜工艺

为了开发一种成本低廉、环境友好且镀层性能好的化学镀铜工艺,以草酸电解还原溶液为还原剂在A3钢表面进行化学镀铜。探讨了镀液组成、pH值及温度对镀铜速度、镀液稳定性及镀层附着力的影响。结果表明：最佳工艺为12～15g／L CuSO4,30～40g／LEDTA,10～20mg／L2,2’-联吡啶,10～12g／L乙醛酸＋5—...     

铜包覆碳化硅复合粉体材料的制备及表征

选用平均粒径约为50～100μm的碳化硅颗粒作为基料,以水合联氨为还原剂、氨水为络合剂,利用非均相成核法制备铜包覆碳化硅复合粉体材料,在温度为83℃时得到了分散效果较好的复合粉体,采用XRD、SEM、EDS对复合粉体进行了表征,结果表明,制备的铜微晶粒径为100nm左右,碳化硅颗粒表面的铜包覆层均匀、连续.     

新配位剂AZO—b对弱碱性无氰镀铜的作用

至今还没有一个效果完美的无氰镀铜液配方。从对铜螯合力方面考虑,合成了配位剂AZO-b,研究了其对碱性无氰镀铜液和镀铜层的作用。结果表明：无氰镀铜镀液中加入AZO-b配位剂,长时间不调整镀液的稳定性较好;且可镀出较厚、与其体结合优良的镀层,无污染。     

PbO_2-CeO_2电极的制备及其电化学性能

为解决传统铅银合金存在的铅污染和钛基PbO2(DSA)基体易钝化、使用寿命短等问题,以不锈钢为基体,用稀土Ce改性,制备了PbO2-CeO2电极。分析了PbO2的形成机理,通过析氧曲线、Tafel曲线、EDS能谱及扫描电镜考察了温度、电流密度、稀土Ce等对电极性能的影响及所制备电极的元素分布及表面形貌。结果表明:最佳制备工艺为190 g/L Pb(NO3)2,15 g/L Cu(NO3)2,0.5 g/L NaF,30 g/L CeO2,pH值为2～3,机械搅拌,温度70℃,电流密度10～20 mA/cm2,时间30 min;所制备的镀层平整、均匀,电化学性能优良,镀层中CeO2质量分数约为4%～6%;PbO2-CeO2电极析氧电位1 500 mV左右,节能性能明显优于传统惰性阳极。     

Chrome-free neodymium-based protective coatings for magnesium alloys

The microstructure of chrome-free neodymium-based conversion coating on magnesium alloy was investigated and the corrosion resistance was evaluated as well. The micro-morphology, transverse section, crystal structure and composition of the coating were observed by scanning electron microscopy (SEM), X-ray diffraction (XRD) and energy dispersive spectroscopy (EDS), respectively. The corrosion resistance was evaluated by potentiodynamic polarization curve and electrochemical impedance spectroscopy (EIS).The results revealed that the morphology of neodymium conversion coating is of crack-mud structure. Tiny cracks distribute in the compact coating deposited by neodymium oxides. EDS results characterize that the coating is made of neodymium oxides. The potentiodynamic polarization curve, EIS and OCP indicate that the neodymium conversion coating can improve the corrosion resistance of magnesium alloys.     

Schottky barrier versus surface ferroelectric depolarization at Cu/Pb(Zr,Ti)O3 interfaces

The band bending at Cu/PZT(001) interfaces is investigated by X-ray photoelectron spectroscopy (XPS) for a PZT(001) layer which exhibits initial outwards ferroelectric polarization. Two competitive processes are identified: (a) formation of the Schottky barrier between the ferroelectric and unconnected Cu islands, and (b) coalescence of the Cu islands, realisation of an electrical contact to the ground of the system, inducing the apparent loss of the component of the ferroelectric polarization perpendicular to the sample surface, at least as it manifests in band bending. Three mechanisms are proposed to explain this loss of band bending when a full metal layer connected to ground is formed on the surface: (i) over-compensation of depolarization field in the sub-surface region, (ii) formation of domains with in-plane orientation of the polarization vector and (iii) loss of polarization in the near-surface layers of the ferroelectric due to electrons provided by the metal. These result in a non-monotonous variation of binding energies with the amount of Cu deposited. High resolution transmission electron microscopy and piezoresponse force microscopy confirmed these hypotheses. The XPS data allowed also to derive the surface PZT composition, its evolution with the deposition of copper and the formation of surface compounds.     

Properties of cu-doped low resistive ZnSe films deposited by two-sourced evaporation

Two-sourced evaporation technique is used to prepare hard ZnSe films by controlling the evaporation rates of both Zn and Se at substrate temperature of 400 °C. The films are doped with Cu by immersion in the Cu(NO₃)₂-H₂O solution for different periods of time. The XRD has not shown a drastic change in the film structure while the electrical resistivity of the deposited film dropped from 10⁹ Ω-cm to about 1.6 Ω-cm for solution immersed films after heat treatment. Optical properties of deposited and doped films, such as film thickness, absorption coefficient and optical band gap have been calculated from the normal transmission spectra in the range of 300-2200 nm.The optical results show a decrease of the transmission and an increase of the refractive index and a slight shift in the optical band gap. Chemical composition of the Cu is determined by using absorption of immersed films. The composition of Cu is also compared with the composition detected by electron microprobe analyzer (EMPA).     

Study of Electroless Copper Deposition on Fe Powder

The electrolytic deposition of an electropositive metal is often accompanied by electroless deposition. However, this process is very difficult to control. For that reason, our study has been aimed at the conditions of the electroless deposition of copper coating onto the iron powder particles from sulphate electrolyte. The process consists of two partial reactions; solid iron substrate dissolves into the solution, thus providing the electrons necessary for reduction of copper. The course of the electroless process depends to a large extent on the composition and pH of the electrolyte as well as on the size and concentration of the iron powder particles in the electrolyte. In order to suppress the spontaneous electroless deposition of copper, sodium citrate as complexing agent was used. The following parameters were determined to characterize the reaction course: the heterogeneous rate constant of Fe powder dissolution and degree of Fe conversion as well as thickness of the Cu layer on the Fe powder, both of the latter evaluated upon attaining the stationary state. The main influence exhibited on the reaction course is the efficient surface area available for electroless deposition.