Carbon doped GaAs grown in low pressure-metalorganic vapor phase epitaxy using carbon tetrabromide

Carbon tetrabromide was used as carbon source for heavily p-doped GaAs in low pressure metalorganic vapor phase epitaxy (MOVPE). The efficiency of carbon incorporation was investigated at temperatures between 550 and 670°C, at V/III ratios from 1 to 50 and carbon tetrabromide partial pressures from 0.01 to 0.03 Pa. Hole concentrations from 8 × 10¹⁷ to 5 × 10¹⁹ cm⁻³ in as-grown layers were obtained. After annealing in nitrogen atmosphere at 450°C, a maximum hole concentration of 9 × 10¹⁹ cm⁻³ and a mobility of 87 cm²/Vs was found. At growth temperatures below 600°C, traces of bromine were detected in the layers. Photoluminescence mapping revealed an excellent doping homogeneity. Thus, CBr₄ is found to be a suitable carbon dopant source in MOVPE.     

Molecular beam epitaxial growth of carbon doped GaAs with elemental gallium and arsenic sources and a CCI4 gas source

CC1₄ has been used as a carbon acceptor dopant source for GaAs grown by elemental source molecular beam epitaxy. Deposition of CC1₄ during normal arsenic stabilized growth of GaAs resulted in low mobility, p-type material. Attempts to thermally crack the CC1₄ using a heated gas cracking source resulted in an even lower hole concentration and mobility. One possible explanation for this ineffective acceptor doping behavior, relative to growth environments containing hydrogen (metalorganic chemical vapor deposition) where CC1₄ is an effective dopant, is that hydrogen plays a role in the incorporation of the carbon. Another possible explanation for the poor doping behavior is that the CC1₄ was being modified by the gas cracker, even at relatively low gas cracker temperatures. Further experimentation with different injection schemes will be necessary to better understand the doping behavior. Depositing the CC1₄ onto static, gallium-rich surfaces produces GaAs:C with hole mobilities comparable to GaAs:Be. Average hole concentrations as high as 4 x 10¹⁹ have been demonstrated. Carbon doped AlGaAs/GaAs heterojunction bipolor transistors (HBT_s) have been fabricated with the same characteristics as Be doped HBTs grown in the same MBE system.     

Growth and characterization of superconducting V3Si on Si and Al2O3 by molecular beam epitaxial techniques

A study of the growth parameters governing the nucleation of metastable superconducting A15 V₃Si on Si and A1₂O₃ is presented. Nominally, 500Å films of V_1-xSi_x were produced through codeposition of V and Si onto heated (111) Si and (1102) A1₂O₃ substrates. Samples were prepared in a custom-built ultrahigh vacuum (UHV) chamber containing dual e-beam evaporation sources and a high temperature substrate heater. V and Si fluxes were adjusted to result in the desired average film composition. V_0.75Si_0.25 films prepared at temperatures in excess of 550° C on Si show significant reaction with the substrate and are nonsuperconducting while similar films grown on A1₂O₃ exhibit superconducting transition temperatures(@#@ T_c @#@) approaching bulk values for V₃Si (16.6-17.1 K). Codeposition at temperatures between 350 and 550° C results in superconducting films on Si substrates while growth at lower temperatures results in nonsuperconducting films. Lowering the growth temperature to 400° C has been shown throughex situ transmission electron microscopy (TEM) and Auger compositional profiling to minimize the reaction with the Si substrate while still activating the surface migration processes needed to nucleate A15 V₃Si. Variation of film composition aboutx = 0.25 is shown to result in nonsuperconducting films for highx and superconducting films with T_c approaching the bulk V value (5.4 K) for lowx. Finally, lowering the V_0.75Si_0.25 deposition rate is shown to raise T_c.     

两步生长和直接生长GaAs/Si单晶薄膜的比较

报道了采用热壁外延(HWE)技术,在(100),(111)和(211)三种典型Si表面通过两步生长和直接生长法制备GaAs单晶薄膜,经过拉曼光谱、霍尔测试和荧光光谱分析比较,得出结论:(1)相同取向Si衬底,两步生长法制备的GaAs薄膜结晶质量比直接生长法制备的GaAs薄膜的要好;(2)采用HWE技术在Si上异质外延GaAs薄膜,其表面缓冲层的生长是降低位错、提高外延质量的基础;(3)不同取向Si衬底对GaAs外延层结晶质量有影响, (211)面外延的GaAs薄膜质量最好,(100)面次之,(111)面最差.     

Metalorganic vapor phase epitaxial growth of GaInAsP/GaAs

Ga_xAs_yP_1−y lattice matched to GaAs has been grown by low pressure metalorganic phase vapor epitaxy over the entire compositional range. At T_G = 670°C broad peaks of low intensity are observed in the 10K photoluminescence for y = 0.2–0.4 due to the predicted miscibility gap in this compositional region. An increase in growth temperature leads to a smaller miscibility gap. The band gap as well as the morphology show a strong dependence on substrate misorientation. The smoothest GalnAsP surfaces are obtained on exact oriented substrates. For the ternary GalnP the surface roughness is correlated to the degree of ordering in the temperature range of 600 to 750°C. The smallest band gap together with the smoothest surface is obtained on (100) 2° off to (111)B. Ordering effects are also observed in the quaternary GalnAsP. Broad-area lasers processed from the grown layers show high slope efficiency (0.9 W/A) and low internal losses (<3 cm⁻¹).     

Metalorganic vapor phase epitaxial growth and structural characterization of GaAs/InP heterostructures

Highly mismatched GaAs epitaxial layers with thickness ranging from 15 nm to 7 μm have been grown on InP substrates by atomospheric pressure metalorganic vapor phase epitaxy. Layers thinner than 30 nm exhibited 3-D growth mechanism; in the thicker layers, the islands coalesced and then the growth followed the layer by layer mechanism. The elastic strain and the extended defects have been studied by high resolution x-ray diffraction and transmission electron microscopy, respectively. The common observation of planar defects, misfit, and threading dislocations in the layers has been confirmed. The results on the elastic strain release have been discussed on the basis of the equilibrium theory.     

Growth of epitaxial Si1-xGex layers at 750° C by VLPCVD

Silicon-germanium epitaxial layers have been grown on (100) silicon at 750° C by very low pressure chemical vapor deposition (VLPCVD). Pure SiH₄ and GeH₄ were used as the processing gases. Commensurate films of Si_1-x withx < 0.13 have been deposited up to a critical thickness about 2-4 times larger than the equilibrium value. Interrupted growth, controlled by gas switching, was employed to improve interfacial abruptness. The films have been characterized as a function of SiH₄ and GeH₄ flow rates and germanium content. Growth rate and germanium incorporation as a function of GeH₄:SiH₄ input ratio and total gas flow rate have been studied. We observed that the growth rate of the Si_1-x Ge _x layer decreases as the germanium content in the film or the GeH₄:SiH₄ ratio increases at 750° C using VLPCVD. We also found that, for a given GeH₄:SiH₄ ratio, the germanium incorporated in the solid is independent of the total gas flow rate.     

Large area depositon of Cd1-xZnxTe on GaAs and Si substrates by metalorganic chemical vapor deposition

Results of large-area (up to 1000 cm²/run) Cd_1-xZn_xTe heteroepitaxy on both GaAs and GaAs/Si substrates by metalorganic chemical vapor deposition (MOCVD) are presented. Cd_1-xZn_xTe (x = 0-0.1) films exhibited specular surface morphology, 1% thickness uniformity (standard deviation), and compositional uniformity (Δx) of ±0.002 over 100 mm diam substrates. For selected substrate orientations and deposition conditions, the only planar defects exhibited by (lll)B Cd_1-xZn_xTe/GaAs/Si films were lamella twins parallel to the CdTe/GaAs interface; these do not propagate through either the Cd_1-xZn_xTe layer or subsequently deposited liquid phase epitaxy (LPE) HgCdTe layer(s). Background Ga and As-impurity levels for Cd_1-xZn_xTe on GaAs/Si substrates were below the secondary ion mass spectroscopy detection limit. Preliminary results of HgCdTe liquid phase epitaxy using a Te-rich melt on Si-based substrates resulted in x-ray rocking curve linewidths as narrow as 72 arc-sec and etch-pit densities in the range 1 to 3 x 10⁶ cm².     

Low temperature cleaning of Si by a H2/AsH3 plasma prior to heteroepitaxial growth of GaAs by metalorganic chemical vapor deposition (MOCVD)

A method using a H₂/AsH₃ plasma to clean the Si surface before GaAs heteroepitaxy was investigated and the dependence of the effectiveness of this treatment on arsine partial pressure was studied. Thin GaAs-on-Si films deposited on the plasma-cleaned Si were analyzed using plan-view TEM, HRXTEM and SIMS. Although not optimized, this method of Si cleaning makes heteroepitaxial deposition of GaAs possible. Some roughening of the Si surface was observed and a possible explanation is offered. Using the results of this study, thick (2.5–3.0μm) epitaxial GaAs films were then deposited and their quality was evaluated using RBS, XTEM and optical Nomarski observation. All Si surface cleaning and GaAs deposition were carried out at temperatures at or below 650°.     

High purity and chrome-doped GaAs buffer layers grown by liquid phase epitaxy for mesfet application

High purity GaAs buffer layers of carrier concentration in the low (l-5)×l0^l4/cm³ range with 77K electron mobility over 100,000 cm²/V-sec and 300K mobility around 8000 cm?/ V-sec have been grown by liquid phase epitaxy on Cr-doped GaAs substrates using the graphite sliding boat method. The high purity has been achieved with systematic and concurrent long term bake-outs (24 hrs) of both LPE melt and substrate, both exposed to the H₂ ambient gas stream at 775?C, prior to epitaxial growth at 700?C. Substrate surface degradation was reduced by using Ga:GaAs etch melts that were undersaturated at 700?C by 5? to 40?C. Best buffer layer morphologies with regard to surface planarity were obtained using etch melts that were saturated by near 85% of weight of GaAs at 700°C. The importance of substrate preconditioning in order to achieve the low ( 1 -2)×l0¹⁴ was examined and found to be critical. Melt and substrate bake outs at 800?C, and use of a 40?C undersaturated etch melt prior to epitaxial growth at 800?C resulted in a p-type layer of carrier concentration, 1 .9×l0^l2/cm³ and resistivity 1×10⁵ ohm-cm. Chromium doping at 700?C resulted in buffer layers with sheet resistivities greater than 10 ohms/sq and low pinhole densities.     

MIS characterization and modeling of the electrical properties of the epitaxial Caf2/Si(111) interface

CaF₂ layers have grown by molecular beam epitaxy on bothn-type andp- type Si(111). Capacitance-voltage (C-V) and current-voltage (I-V) measurements have been made on metal-insulator-semiconductor (MIS) capacitors to characterize these structures. For devices onp-type Si, C-V characteristics show only the insulator value of the capacitance over a wide range of applied voltages, indicating an accumulated surface. At room temperature, C-V characteristics ofn-type devices show the minimum value of the capacitance (corresponding to inversion) for small voltages, but modulation of the capacitance at larger voltages. At 200 K, this modulation is no longer present in the C-V curves. I-V curves show a rapid increase in the leakage current at relatively low fields at room temperature, and this leakage decreases dramatically with temperature. These results are largely independent of cleaning procedure, growth temperature, and the degree of misalignment of the substrate. The characteristics are modeled by assuming the Fermi level to be pinned at the valence-band edge, and the modulation in the C-V characteristics ofn-type samples to be driven by leakage currents. Work done at GE while a graduate student in the School of Electrical Engineering, Cornell University. Present address: Jet Propulsion Laboratory, 4800 Oak Grove Dr., Pasadena, CA 91109.     

FEC法生长Si和In双掺GaAs单晶生长技术

研究了几种消除LEC GaAs材料的位错措施以降低温度梯度从而尽可能降低晶体的热应力。掺入等电子In或Si使杂质硬化,为了抑制晶体表面产生位错,开发了全液封切克劳斯基(FEC)晶体生长技术。结合以上三种技术开发出了Si和In双掺FEC GaAs单晶生长技术以消除位错。采用此技术已生长出半导体低位错密度的GaAs晶体,经证实这种掺Si和In低位错GaAs衬底可以满足GaAs LED制作。     

In situ P-doped Si and Si1−xGex epitaxial films grown by remote plasma enhanced chemical vapor deposition

Remote plasma-enhanced chemical vapor deposition has been applied to growin- situ doped n-type epitaxial Si and Si_1−xGe_x with the introduction of phosphine. Growth rates and dopant incorporation have been studied as a function of process parameters (temperature, rf power, and dopant gas flow). Growth rates remain unaltered with the introduction of PH₃ during deposition, unlike in many other low temperature growth techniques. Phosphorus incorporation shows a linear dependence on PH₃ flow rate, but has little if any dependence on the other growth parameters, such as radio frequency power and substrate temperature, for the ranges of parameters that were examined. Phosphorus concentrations as high as 4 × 10¹⁹ cm⁻³ at 14 W have been obtained.     

Growth and characterization of germanium and boron doped silicon epitaxial films

The epitaxial growth and characterization of in-situ germanium and boron (Ge/B) doped Si epitaxial films is described. As indicated by secondary ion mass spectroscopy and spreading resistance measurements, the total and electrically activated B concentrations are essentially identical and independent of Ge incorporation. The B and Ge concentrations are uniformly distributed in these Ge/B doped films. A slight enhancement of Hall mobility is obtained, possibly due to the stress relief induced by Ge counterdoping. Carrier conduction in these films is due to the activated B with an activation energy of 0.04 eV as revealed by conductivity versus temperature measurements. Ge atoms appear to be isoelectronic with Si atoms in these films. A slight degradation of minority carrier diffusion length is observed. Electrical characterization of PN diodes on these Ge/B doped films do not reveal any anomaly. SiO₂ on these Ge/B doped films has similar oxide fixed charge density, interface state density and dielectric breakdown strength compared to silicon dioxide on boron doped epitaxial films. Electron injection reveals a different transport mechanism of the SiO₂ grown on these Ge/B doped films.     

Growth and characterization of GaAs films deposited on Ge/Si composite substrates by metalorganic chemical vapor deposition

We report the results of studies which have been made on heteroepitaxial layers of GaAs and AlGaAs grown by metalorganic chemical vapor deposition on composite substrates that consist of four different types of heteroepitaxial layered structures of Ge and Ge-Si grown by molecular beam epitaxy on (100)-oriented Si substrates. It is found that of the four structures studied, the preferred composite substrate is a single layer of Ge ∼1 μm thick grown directly on a Si buffer layer. The double-crystal X-ray rocking curves of 2 μm thick GaAs films grown on such substrates have FWHM values as small as 168 arc sec. Transmission electron micrographs of these Ge/Si composite substrates has shown that the number of dislocations in the Ge heteroepitaxial layer can be greatly reduced by an anneal at about 750° C for 30 min which is simultaneously carried out during the growth of the GaAs layer. The quality of the GaAs layers grown on these composite substrates can be greatly improved by the use of a five-period GaAs-GaAsP strained-layer superlattice (SLS). Using the results of these studies, low-threshold optically pumped AlGaAs-GaAs DH laser structures have been grown by MOCVD on MBE Ge/Si composite substrates.     

Oxygen and carbon incorporation in low temperature epitaxial Si films grown by rapid thermal chemical vapor deposition (RTCVD)

Using SIMS analysis, we have measured oxygen and carbon concentrations in epitaxial Si films grown between 550 and 900° C. The films were grown by rapid thermal chemical vapor deposition from SiH₄ as well as several different SiH₂Cl₂ sources. We have found that at low deposition temperatures (∼750° C or lower), oxygen incorporation is first dictated by source gas impurities and then by residual chamber gases. For the case of SiH₂Cl₂, which can have substantial oxygen content due to its reactivity with H₂O, oxygen concentrations of about 10²⁰ cm^-3 are typical at low deposition temperatures. SiH₄, however, can be obtained in higher purity, and oxygen concentrations of 10¹⁸ cm^-3 can be realized at low temperatures. At higher deposition temperatures (750-900° C), SiO volatilizes, leaving the films grown from all sources with low oxygen concentrations, typically less than 5 × 10¹⁷ cm^-3. Carbon incorporation is much less of a problem since it is present to a lesser extent both in the chamber background and in the source gases. Carbon levels less than or equal to 10¹⁸ cm^-3 can be obtained at all deposition temperatures greater than about 650° C. The performance ofp/n junctions is shown to degrade significantly for junctions grown below 850° C. We conclude that for growth of long lifetime Si films in the temperature range <800° C, that low residual H₂O partial pressures (<10^-10 Torr) are desired. Therefore, CVD chambers should be loadlocked and also capable of base pressures as low as about 10^-9 Torr.     

Molecular beam epitaxial growth and characterization of lead telluride for laser diodes

The characteristics of PbTe films grown by molecular beam epitaxy (MBE) have been investigated. These films were grown on (100) oriented Tl-doped PbTe substrates under UHV conditions (~5×l0⁻⁹ Torr during deposition). Substrate surface contamination levels were studied with Auger electron spectroscopy. Oxygen, the dominant impurity observed, is rapidly thermally desorbed from PbTe, but is stable on Pb_1−xSn_xTe up to at least 410°C. Carrier concentration and mobility were measured with the Van der Pauw technique. The electron mobility increased strongly with increasing film thickness, varying from 4,000 to 14,000 cm²/volt-sec as the thickness increased from 2.0 to 7.3 μn. The film surface also became smoother with increasing film thickness. These results suggest the need for a buffer layer in a laser structure. Lasers grown with 6 μm thick buffer layers have exhibited extremely low threshold current densities (40 A/cm² at 13 K) and very high junction resistancearea products at zero-bias (0.7 Ω−cm² at 77 K), indicative of very high junction quality.     

A GeSi-buffer structure for growth of high-quality GaAs epitaxial layers on a Si substrate

A SiGe-buffer structure for growth of high-quality GaAs layers on a Si (100) substrate is proposed. For the growth of this SiGe-buffer structure, a 0.8-μm Si_0.1 Ge_0.9 layer was first grown. Because of the large mismatch between this layer and the Si substrate, many dislocations formed near the interface and in the low part of the Si_0.1Ge_0.9 layer. A 0.8-μm Si_0.05Ge_0.95 layer and a 1-μm top Ge layer were subsequently grown. The strained Si_0.05Ge_0.95/Si_0.1Ge_0.9 and Ge/Si_0.05Ge_0.95 interfaces formed can bend and terminate the upward-propagated dislocations very effectively. An in-situ annealing process is also performed for each individual layer. Finally, a 1–3-μm GaAs film was grown by metal-organic chemical vapor deposition (MOCVD) at 600°C. The experimental results show that the dislocation density in the top Ge and GaAs layers can be greatly reduced, and the surface was kept very smooth after growth, while the total thickness of the structure was only 5.1 μm (2.6-μm SiGe-buffer structure +2.5-μm GaAs layer).     

Low temperature Si2H6 Si epitaxy in-situ doped with AsH3/SiH4

The use of disilane (Si₂H₆) as a silicon source for epitaxial deposition was investigated for both very low pressure chemical vapor deposition (thermal CVD) and plasma enhanced chemical vapor deposition (PECVD) from 600 to 800° C. The growth rates observed for temperatures at or below 750° C were at least an order of magnitude higher than those observed for silane (SiH₄) using similar deposition conditions. An argon plasma was used to sputter clean the silicon surface, in-situ, immediately before the deposition. It was found that a low dc bias on the substrate during the argon sputter cleaning process helped remove carbon and oxide from the surface of the silicon substrate. A 16 min Ar sputter clean at 650° C, 2.5 W rf power, and •50 V dc bias resulted in a carbon and oxygen concentration at the epilayer-substrate of less than 4 × 10¹⁸/cm³ and 2 × 10¹⁸/cm³, respectively. In situ arsenic doping during disilane epitaxial growth was carried out by thermal CVD and PECVD using arsine (AsH₃) diluted in silane (SiH₄) at 800° C. The results were compared to similar experiments using only SiH₄ as the silicon source. Up to 500 ppm of arsine was diluted in the reactant gas and it was found that the Si₂H₆ growth rates were insensitive to the arsine concentraton in the gas phase.     

Growth by CVT and characterization of Hg1-xCdxTe epitaxial layers

Single crystal epitaxial layers of Hg_1-x Cd _x Te were grown on CdTe substrates employing the chemical vapor transport technique. Different growth temperatures, substrate orientations, and various pressures of Hgl₂ as a transport agent were used while the source materials had a fixed composition ofx = 0.2. The epilayers are of nearly uniform composition to a depth of about one-half of the layer thickness. Chemical etching of the as-grown epilayers revealed low etch pit densities in the range of 10³–10⁴ cm⁻². Rectangle-shaped etch pits are observed for the first time on the (100) oriented epilayers of this material. The growth temperature and Hgl₂ pressure used for the growth experiments have significant effects on the layer morphology and composition.