AlInN/AlN/GaN HEMT Technology on SiC With 10-W/mm and 50% PAE at 10 GHz

High-frequency high-electron-mobility transistors (HEMTs) were fabricated on AlInN/AlN/GaN heterostructures grown by low-pressure metal-organic chemical vapor deposition on a SiC substrate. The results presented in this letter confirm the high performance that is reachable by AlInN-based technology with an output power of 10.3 W/mm and a power-added efficiency of 51% at 10 GHz with a gate length of 0.25 ?m. A good extrinsic transconductance value that is greater than 450 mS/mm and exceeding AlGaN/GaN HEMT results was also measured on these transistors. To our knowledge, these results are the best power results published on AlInN/GaN HEMTs. These good results were attributed to optimized heterostructure properties associated with low-resistance ohmic contacts and an effective passivation layer minimizing drain current slump in high-frequency operations.     

100 nm gate AlGaN/GaN HEMTs on silicon with fT = 90 GHz

The realisation of 0.1 mum gate AlGaN/GaN high electron mobility transistors grown on high-resistivity silicon substrates is reported. A maximum current density of 750 mA/mm and an extrinsic transconductance of 225 mS/mm are achieved. The devices feature a record current gain cutoff frequency as high as f _T=90 GHz, the highest value ever reported from a GaN-based device grown on a silicon substrate. The results demonstrate the great potential of GaN-on-silicon technology for low-cost millimetre-wave applications.     

AlGaN/GaN HEMTs on silicon substrates with fT of 32/20GHz and fmax of 27/22 GHz for 0.5/0.7 μm gate length

AlGaN/GaN HEMTs on silicon substrates have been realised and their static and small signal characteristics investigated. The AlGaN/GaN (x=0.23) material structures were grown on (111) p-Si by LP-MOVPE. Devices exhibit a saturation current density of 0.53 to 0.68 A/mm and a peak extrinsic transconductance of 110 mS/mm. A unity gain frequency of 20 and 32 GHz and a maximum frequency of oscillation of 22 and 27 GHz are obtained for devices with a gate length of 0.7 and 0.5 μm, respectively. These values are the highest reported so far on AlGaN/GaN/Si HEMTs and are comparable to those known for devices using sapphire and SiC substrates     

Output power density of 5.1/mm at 18 GHz with an AlGaN/GaN HEMT on Si substrate

Microwave frequency capabilities of AlGaN/GaN high electron mobility transistors (HEMTs) on high resistive silicon (111) substrate for power applications are demonstrated in this letter. A maximum dc current density of 1 A/mm and an extrinsic current gain cutoff frequency (F/sub T/) of 50 GHz are achieved for a 0.25 /spl mu/m gate length device. Pulsed and large signal measurements show the good quality of the epilayer and the device processing. The trapping phenomena are minimized and consequently an output power density of 5.1 W/mm is reached at 18 GHz on a 2/spl times/50/spl times/0.25 /spl mu/m/sup 2/ HEMT with a power gain of 9.1dB.     

CW operation of short-channel GaN/AlGaN doped channelheterostructure field effect transistors at 10 GHz and 15 GHz

We report on a 0.15-μm gate length AlGaN/GaN doped channel heterostructure field effect transistor (DC-HFET) with maximum frequency of oscillation in excess of 97 GHz. HFETs based on our doped channel design exhibited CW microwave operation up to 15 GHz with a maximum output power of approximately 270 mW/mm at 10 GHz. These values are still limited by parasitics and can be significantly improved by optimizing the device design     

Lattice-Matched InP-Based HEMTs with fT of 120GHz

Lattice-matched InP-based InAlAs/InGaAs HEMTs with 120GHz cutoff frequency are reported.These devices demonstrate excellent DC characteristics:the extrinsic transconductance of 600mS/mm,the threshold voltage of －1.2V,and the maximum current density of 500mA/mm.     

Submicron AlInAs/InGaAs HBT with 160 GHz fT at 1 mAcollector current

We have demonstrated a submicron heterojunction bipolar transistor (SHBT) with a unity current gain cutoff frequency (f_t) of 160 GHz at the very low current level of 1 mA. The AlInAs/InGaAs SHBT has a thin collector and uses stepper lithography with 0.1 μm registration accuracy to reduce the parasitic elements that typically limit the performance of small transistors. The same device has 100 GHz f_t at 200 μA. The result substantially improves upon the cutoff frequency of submicron compound semiconductor devices. The technology is appropriate for high speed, low power, high-density circuits     

A 210-GHz fT SiGe HBT with a non-self-aligned structure

A record 210-GHz f_T SiGe heterojunction bipolar transistor at a collector current density of 6-9 mA/μm² is fabricated with a new nonself-aligned (NSA) structure based on 0.18 μm technology. This NSA structure has a low-complexity emitter and extrinsic base process which reduces overall thermal cycle and minimizes transient enhanced diffusion. A low-power performance has been achieved which requires only 1 mA collector current to reach 200-GHz f_T. The performance is a result of narrow base width and reduced parasitics in the device. Detailed comparison is made to a 120-GHz self-aligned production device     

Power Performance of AlGaN/GaN HEMTs Grown on SiC by Ammonia-MBE at 4 and 10 GHz

In this letter, we report on the microwave power and efficiency performance of AlGaN/GaN high-electron mobility transistors (HEMTs) grown by ammonia molecular beam epitaxy (ammonia-MBE) on SiC substrates. At 4 GHz, an output power density of 11.1 W/mm with an associated power-added efficiency (PAE) of 63% was measured at V _ds = 48 V on passivated devices. At 10 GHz, an output power density of 11.2 W/mm with a PAE of 58% was achieved for V _ds = 48 V. These results are the highest reported power performance for AlGaN/GaN HEMTs grown by ammonia-MBE and the first reported for ammonia-MBE on SiC substrates.     

MBE生长的跨导为186mS/mm的AlGaN/GaN HEMT

用分子束外延 ( MBE)技术研制出了 Al Ga N/Ga N高电子迁移率晶体管 ( HEMT)材料 ,其室温迁移率为 10 35cm2 /V· s、二维电子气浓度为 1.0× 10 13 cm - 2 ;77K迁移率为 2 6 53cm2 /V· s、二维电子气浓度为 9.6× 10 12 cm- 2 。用此材料研制了栅长为 1μm、栅宽为 80μm、源 -漏间距为 4μm的 Al Ga N/Ga N HEMT,其室温最大非本征跨导为 186 m S/mm、最大漏极饱和电流密度为 92 5m A/mm、特征频率为 18.8GH z。另外 ,还研制了具有 2 0个栅指 (总栅宽为 2 0× 80μm =1.6 mm )的大尺寸器件 ,该器件的最大漏极饱和电流为 1.33A。     

GaAs/AlGaAs heterojunction MISFET's having 1-W/mm power density at 18.5 GHz

The previously reported GaAs/AlGaAs heterojunction MISFET with an undoped AlGaAs layer as an insulator has been further optimized for power operation at upper Ku band. A 300-µm gate-width device generated 320 mW of output power with 33-percent efficiency at 18.5 GHz. The corresponding power density exceeds 1 W/mm. When optimized for efficiency, the device has achieved a power added efficiency of 43 percent at 19 GHz.     

An 0.03 μm gate-length enhancement-mode InAlAs/InGaAs/InPMODFET's with 300 GHz fT and 2 S/mm extrinsictransconductance

We have developed high-performance enhancement-mode InP-based modulation-doped field-effect transistors with 0.03 μm gate-length. A record high current gain cutoff frequency exceeding 300 GHz has been achieved, and the maximum extrinsic transconductance is as high as 2 S/mm with an associated drain current of 0.5 A/mm at a drain bias of 1 V. This high performance is a result of the reduction or gate length, the use of the high barrier metal Pt as gate electrodes, and most importantly the employment of the well-developed wet-etching technology that allows the formation of a very deep gate groove while retaining small side etching. The excellent E-MODFET performance opens up the possibility of implementing ever faster high-speed circuits based on direct-coupled FET logic     

跨导为325mS/mm的AlGaN/GaN HFET器件

报道了使用国产GaN外延材料（蓝宝石衬底）的AlGaN/GaN HFET器件的制备以及室温下器件的性能. 器件栅采用场板结构,其中栅长为0.3μm,场板长为0.37μm,源漏间距为3μm. 器件的饱和电流密度为0.572A/mm,最大漏电流密度为0.921A/mm,最大跨导为325mS/mm,由S参数外推出截止频率和最高振荡频率分别为27.9GHz和33.1GHz.     

跨导为325mS/mm的AlGaN/GaN HFET器件

报道了使用国产GaN外延材料(蓝宝石衬底)的AlGaN/GaN HFET器件的制备以及室温下器件的性能.器件栅采用场板结构,其中栅长为0.3μm,场板长为0.37μm,源漏间距为3μm.器件的饱和电流密度为0.572A/mm,最大漏电流密度为0.921A/mm,最大跨导为325mS/mm,由S参数外推出截止频率和最高振荡频率分别为27.9GHz和33.1GHz.     

跨导为220mS/mm的AlGaN/GaN HEMT

介绍了 Al Ga N/ Ga N HEMT器件的研制及室温下器件特性的测试。漏源欧姆接触采用 Ti/ Al/ Pt/ Au,肖特基结金属为 Pt/ Au。器件栅长为 1 μm,获得最大跨导 2 2 0 m S/ mm,最大的漏源饱和电流密度 0 .72 A/ mm。由 S参数测量推出器件的截止频率和最高振荡频率分别为 1 2 GHz和 2 4GHz。     

A 40-Gb/s integrated clock and data recovery circuit in a 50-GHz fT silicon bipolar technology

Clock and data recovery (CDR) circuits are key electronic components in future optical broadband communication systems. In this paper, we present a 40-Gb/s integrated CDR circuit applying a phase-locked loop technique. The IC has been fabricated in a 50-GHz f _T self-aligned double-polysilicon bipolar technology using only production-like process steps. The achieved data rate is a record value for silicon and comparable with the best results for this type of circuit realized in SiGe and III-V technologies     

Fabrication and characterization of AlGaN/GaN HEMTs with high power gain and efficiency at 8 GHz

State-of-the-art AlGaN/GaN high electron mobility structures were grown on semi-insulating 4H-SiC substrates by MOCVD and X-band microwave power high electron mobility transistors were fabricated and characterized.Hall mobility of 2291.1 cm2/(V·s) and two-dimensional electron gas density of 9.954 × 1012 cm-2 were achieved at 300 K.The HEMT devices with a 0.45-μm gate length exhibited maximum drain current density as high as 1039.6 mA/mm and peak extrinsic transconduct-ance of 229.7 mS/mm.The fT of 30.89 GHz and fmax of 38.71 GHz were measured on the device.Load-pull measurements were performed and analyzed under (-3.5,28) V,(-3.5,34) V and (-3.5,40) V gate/drain direct current bias in class-AB,respectively.The uncooled device showed high linear power gain of 17.04 dB and high power-added efficiency of 50.56％ at 8 GHz when drain biased at (-3.5,28) V.In addition,when drain biased at (-3.5,40) V,the device exhibited a saturation output power dens-ity up to 6.21 W/mm at 8 GHz,with a power gain of 11.94 dB and a power-added efficiency of 39.56％.Furthermore,the low fmax/fT ratio and the variation of the power sweep of the device at 8 GHz with drain bias voltage were analyzed.     

10-W/mm AlGaN-GaN HFET with a field modulating plate

AlGaN-GaN heterojunction field-effect transistors (HFETs) with a field modulating plate (FP) were fabricated on an SiC substrate. The gate-drain breakdown voltage (BV/sub gd/) was significantly improved by employing an FP electrode, and the highest BV/sub gd/ of 160 V was obtained with an FP length (L/sub FP/) of 1 /spl mu/m. The maximum drain current achieved was 750 mA/mm, together with negligibly small current collapse. A 1-mm-wide FP-FET (L/sub FP/=1 /spl mu/m) biased at a drain voltage of 65 V demonstrated a continuous wave saturated output power of 10.3 W with a linear gain of 18.0 dB and a power-added efficiency of 47.3% at 2 GHz. To our knowledge, the power density of 10.3 W/mm is the highest ever achieved for any FET of the same gate size.     

fmax大于100GHz的AlGaN背势垒结构InAlN-GaN HEMT研究

We report the DC and RF performance of InAlN/GaN high-electron mobility transistors with AlGaN back barrier grown on SiC substrates.These presented results confirm the high performance that is reachable by InAlN-based technology.The InAlN/GaN HEMT sample showed a high 2DEG mobility of 1550 cm²/（V·s） at a 2DEG density of 1.7×10¹³ cm^-2.DC and RF measurements were performed on the unpassivated device with 0.2μm "T" gate.The maximum drain current density at V_GS = 2 V is close to 1.05 A/mm in a reproducible way. The reduction in gate leakage current helps to increase the frequency performance of AIGaN back barrier devices. The power gain cut-off frequency of a transistor with an AIGaN back barrier is 105 GHz,which is much higher than that of the device without an AIGaN back barrier at the same gate length.These results indicate InAlN/GaN HEMT is a promising candidate for millimeter-wave application.     

最大振荡频率为200GHz的蓝宝石衬底AlGaN/GaN HEMT

报道了最大振荡频率为200 GHz的基于蓝宝石衬底的AlGaN/GaN高电子迁移率晶体管(HEMT).外延材料结构采用InGaN背势垒层来减小短沟道效应,器件采用凹栅槽和T型栅结合的工艺,实现了Ka波段AlGaN/GaNHEMT.器件饱和电流达到1.1 A/mm,跨导为421 mS/mm,截止频率(fT)为30 GHz...