Effect of silicon on relaxation of the crystal lattice in MOCVD–hydride Al<Subscript><Emphasis Type="Italic">x</Emphasis></Subscript>Ga<Subscript>1 − <Emphasis Type="Italic">x</Emphasis></Subscript>As:Si/GaAs(100) heterostructures

The X-ray diffraction and infrared spectroscopy data for MOCVD-hydride Al _x Ga_{1 − x} As:Si/GaAs(100) heterostructures and homoepitaxial GaAs:Si/GaAs(100) structures doped with Si to a content of up to ∼1 at % are reported. It is shown that, in the homoepitaxial heterostructures, the formation of alloys with Si yields a decrease in the crystal lattice parameters of the epitaxial layer and a negative lattice mismatch with the single-crystal substrate (Δa < 0). At the same time, the formation of quaternary alloys in the Al _x Ga_{1 − x} As:Si/GaAs(100) heterostructures is not accompanied by any pronounced strains in the crystal lattice. By introducing Si into the epitaxial layers of these heterostructures, it is possible to attain complete matching of crystal lattice parameters of the film and substrate in the appropriately chosen technological conditions of growth of the epitaxial layers.     

Influence of Substrate Misorientation on the Composition and the Structural and Photoluminescence Properties of Epitaxial Layers Grown on GaAs(100)

The influence of the degree of misorientation and treatment of a GaAs substrate on the structural and optical characteristics of homoepitaxial GaAs/GaAs(100) structures grown by metal–organic chemicalvapor deposition is studied. From the data obtained by a series of structural and spectroscopic techniques, it is shown that the degree of deviation of the substrate from the exact orientation towards the [110] direction by an angle of up to 4° brings about stepwise growth of the GaAs film in the initial stage and a further increase in the degree of misorienration towards the [110] direction to 10° results in an increase in the number of structural defects in the epitaxial film. At the same time, the samples of homoepitaxial structures grown by metal–organic chemical-vapor deposition on GaAs(100) substrates misoriented by 4° towards the [110] direction possess the highest photoluminescence efficiency; it is ~15% higher than the corresponding quantity for structures grown on precisely oriented GaAs(100) substrates. Preliminary polishing of the GaAs substrate (removal of an oxide layer) also yields the intensification of photoluminescence emission compared to emission in the case of an unpolished substrate of the same type. For samples grown on substrates misoriented by 4°, such an increase in the photoluminescence efficiency is ~30%.     

Defect microstructure in low temperature epitaxial silicon grown by RPCVD

Defect characterization of epitaxial silicon films grown by low temperature remote plasmaenhanced chemical vapor deposition (RPCVD) under various conditions is discussed. The film morphology and crystallinity have been examined by defect etching/Nomarski optical microscopy and transmission electron microscopy. Prior to epitaxial growth, anex situ wet chemical clean and anin situ remote hydrogen plasma clean were performed to remove the native oxide as well as other surface contaminants such as carbon. A damage-free (100) Si surface with extremely low concentrations of carbon and oxygen as confirmed byin situ Auger electron spectroscopy can be achieved using this cleaning technique at temperatures as low as 250°. Low temperature Si homoepitaxy was achieved by RPCVD on lightly doped (100) Si substrates. Growth parameters such as silane flow rate (partial pressure), chamber pressure, and substrate temperature were varied during epitaxial growth to investigate the dependence of film quality on these parameters. For comparison,in situ remote hydrogen plasma and epitaxial growth were also performed on heavily dopedp-type (100) Si substrates. Finally, the results of epitaxial growth at temperatures as low as 150° are presented.     

Domain epitaxial growth of TiN/Si(001), TiN/GaAs(001), and Si/TiN/Si(001) heterostructures by laser physical vapor deposition: Theory and experiment

We have successfully deposited epitaxial titanium nitride films on (001) silicon and (001) gallium arsenide substrates and multilayer Si/TiN/Si(001) epitaxial heterostructures using pulsed laser (KrF: λ = 248 nm, τ = 25 ns) physical vapor deposition. The deposition of TiN was carried out at a substrate temperature of 600°C on Si(001) and 400°C on GaAs(00l). The interfaces were sharp without any indication of interfacial reaction. The epitaxial relationships were found to be <001> TiN ‖<001> Si on the silicon substrate, <001> Si ‖<001> TiN |<001> Si on the heterostructure, and [1-10] TiN‖[110] GaAs and [001] TiN ‖[110] GaAs on the GaAs substrate. The growth in these large-mismatch systems is modeled and the various energy terms contributing to the growth of these films are determined. The domain matching epitaxy provides a mechanism of epitaxial growth in systems with large lattice mismatch.The epitaxial growth is characterized by domain epitaxial orientation relationships with m lattice constants of epilayer matching with n of the substrate and with a small residual domain mismatch present in the epilayer. This residual mismatch is responsible for a coherent strain energy. The magnitude of compression of Ti-N bond in the first atomic layer, contributing to the chemical free energy of the interface during the initial stages of growth, is found to be a very important factor in determining the orientation relationship. This result was used to explain the differences in the orientaion relationships between TiN/Si and TiN/GaAs systems. The various energy terms associated with the domain epitaxial growth are evaluated to illustrate that the domain epitaxial growth is energetically favorable compared to the lattice mismatched epitaxial growth. The results of this analysis illustrate that the observed variations in the epitaxial growth are consistent with the minimum energy configurations associated with the domain epitaxial growth.     

Multi-technique characterisation of MOVPE-grown GaAs on Si

The heterogeneous integration of III-V materials on a Si CMOS platform offers tremendous prospects for future high-speed and low-power logic applications. That said this integration generates immense scientific and technological challenges. In this work multi-technique characterisation is used to investigate properties of GaAs layers grown by Metal-Organic Vapour Phase Epitaxy (MOVPE) on Si substrates - (100) with 4° offset towards <1 1 0> - under various growth conditions. This being a crucial first step towards the production of III-V template layers with a relatively lower density of defects for selective epitaxial overgrowth of device quality material. The optical and structural properties of heteroepitaxial GaAs are first investigated by micro-Raman spectroscopy and photoluminescence and reflectance measurements. High-resolution X-ray diffraction (HR-XRD) is used to investigate structural properties. Advanced XRD techniques, including double-axis diffraction and X-ray crystallographic mapping are used to evaluate degrees of relaxation and distribution of the grain orientations in the epilayers, respectively. Results obtained from the different methodologies are compared in an attempt to understand growth kinetics of the materials system. The GaAs overlayer grown with annealing at 735 °C following As pre-deposition at 500 °C shows the best crystallinity. Close inspection confirms the growth of epitaxial GaAs preferentially oriented along (100) embedded in a highly textured polycrystalline structure.     

Formation and characterization of porous silicon films obtained by catalyzed vapor-chemical etching

Porous silicon films obtained by the metal-assisted vapor-chemical etching technique have been characterized. For the film formation, epitaxial (100) N/P⁺, 1–5 Ω cm monocrystalline silicon wafers were used. The vapors of an alcoholic solution of H₂O₂/HF were drawn towards the silicon surface, which was previously covered with a thin layer of gold (~8 nm) for the catalytic etching. For the optical and morphological characterization of porous films, Raman spectroscopy, Ellipsometry, FTIR spectroscopy and SEM images were used. The films thickness kept a linear relationship with etching time. A porosity gradient from the surface towards the interface (65% to 12%) was observed in the films. A large amount of Si–H bonds as related to O–Si–O bonds were observed and the pore size depends on the HF concentration. Irregular morphology was found in films formed with 50% HF.     

Structural and optical properties of low-temperature hydride-MOCVD AlGaAs/GaAs(100) heterostructures based on omission solid solutions

X-ray diffraction, scanning electron microscopy, and IR reflectance spectroscopy were used to study properties of epitaxial low-temperature hydride-MOCVD AlGaAs/GaAs (100) heterostructures. It was found that the variation in the AlGaAs alloy lattice’s parameter with Al content does not obey the classical Vegard’s law, and the lattice parameters are smaller than those of GaAs.     

Si间隔层对利用低温Si缓冲层生长高弛豫SiGe层的影响

利用低温生长Si缓冲层与Si间隔层相结合的方法生长高弛豫SiGe层,研究了Si间隔层在其中的作用. 利用化学腐蚀和光学显微镜，观察了不同外延层厚度处位错的腐蚀图样. 研究了不同温度下生长的Si间隔层对SiGe外延层中位错形成、传播及其对应变弛豫的影响. 结果表明Si间隔层的引入，显著改变了外延层中位错的形成和传播，进而使得样品表面形貌也呈现出较大的差异.     

In situ deposition of Au on plasma-prepared GaAs substrates

In situ deposition of single crystal epitaxial and textured polycrystalline gold films on plasma-cleaned or plasma-etched GaAs substrates is accomplished in an ultrahigh vacuum integrated processing facility. Au/GaAs samples are characterized using reflection high energy electron diffraction, Auger electron spectroscopy, and ion channeling. Au crystallinity in films deposited at 100° C is shown to strongly depend on the GaAs surface cleanliness after plasma processing. Heating the substrate to 250° C after plasma processing subsequently yields epitaxial Au films; omitting the heating procedure results in polycrystalline Au films. The substrate thermal treatment removes residual physisorbed gas molecules and reaction products from the GaAs surface. Epitaxial Au films contain significantly less Ga and As on the free surface of Au than polycrystalline films, and no interaction between epitaxial Au and GaAs is observed.     

Properties of a poly-Si/GaAs layered structure on Si for Si heterojunction bipolar transistor

The properties of poly-Si/GaAs layered films on Si for use in wide bandgap emitters for Si heterojunction bipolar transistors (Si-HBTs), were studied. A smooth GaAs film surface grown on Si was obtained at low temperature (200° C) from the initial stage of growth. The x-ray diffraction (XRD) results indicated that strong GaAs orientation (111) was obtained for the poly-Si/GaAs/Si-substrate layered structure after annealing at 800° C for 20 sec. Secondary ion mass spectroscopy (SIMS) profiles indicated that impurity diffusion from the GaAs layer into the p-type Si substrate was negligible at 800° C. The electrical characteristics forn-poly-Si/n-GaAs/p-Si-substrate heterojunction diodes were also investigated.     

Fabrication of GaAs/Si Heterostructures and Their Photoelectric Properties

Fabrication of GaAs/Si heterostructures and their photoelectric properties are investigated by Raman, photoluminescence and Hall-effect measurements. The crystallinity of GaAs epilayers grown on Si substrate is significantly affected by the substrate orientation and the growth method. The photoelectric properties of GaAs epilayers grown on Si （211） substrates deposited by using a two-step growth method are improved. These results indicate that GaAs epilayersgrownonSi （100） andSi （211） substrates by using two step growth method are promising for potential applications in high-speed and high-frequency photoelectric devices.     

Thin-film /spl lambda//spl sim/3.7 /spl mu/m 'W' laser released from InAs substrate

A mid-infrared type-II 'W' laser fabricated by releasing the epitaxial film from its original InAs substrate is reported. The process exploits the extreme selectivity between GaSb and InAs when etched by hydrochloric acid. The detached film is coated with an Si/sub 3/N/sub 4/ optical cladding layer, grafted to a foreign GaAs substrate, and cleaved into laser bars. For epitaxial-side-up mounting, the device operates to 70 K, with a low threshold (/spl sime/150 W/cm/sup 2/) when pumped with the maximum available CW power of 320 mW from a 980 nm laser diode.     

Potentialities and basic principles of controlling the plastic relaxation of GeSi/Si and Ge/Si films with stepwise variation in the composition

GeSi/Si heterostructures consisting of a plastically relaxed layer that includes various fractions of Ge and which is grown on Si (001) span the values of the lattice parameter from equal to that in silicon to equal to that in germanium. The corresponding substrates are conventionally referred to as artificial. A number of methods exist for growing high-quality GeSi layers with as large as 100% of Ge on Si (001) substrates through an intermediate GeSi layer with a varying composition. However, it is desirable in a number of cases to have ultrathin (<1 μm) GeSi and Ge layers directly on the Si (001) substrate for practical applications. The results of new methods such as the use of a buffer Si layer grown at a comparatively low temperature (300–400°C) in plastic relaxation of the GeSi/Si(001) heterostructures and also the use of surfactants (antimony and hydrogen) are analyzed. The examples of artificial introduction of centers for origination of misfit dislocations as an alternative to their introduction from the rough surface are considered. It can be concluded that, in order to expand the range of potentialities of growing perfect plastically relaxed GeSi (001) films, it is necessary to (i) make it possible to form in a controlled manner the centers for origination of the misfit dislocations and (ii) retard or completely suppress the transition of the growth mechanism from two-to three-dimensional in order to prevent the formation of additional misfit dislocations from the surface of the stressed film and, correspondingly, additional threading dislocations.     

Subpicosecond carrier response of unannealed low-temperature-grown GaAs vs temperature

The subpicosecond carrier lifetime of an unannealed molecular beam epitaxial layer of GaAs grown at ∼210°C has been demonstrated between 10 and 290K through optoelectronic switching and all-optical pump-probe measurements. The low room-temperature resistivity of the as-grown layers, believed to arise from hopping conductivity through defect sites, has been observed to increase as the sample temperature was lowered, allowing ultrafast switching measurements to be performed using the low-temperature-as-grown GaAs as a photoconductive element. After illumination by 100 femtosecond optical pulses, photogenerated carriers in the sample have rapidly relaxed, returning the material to its high-resistivity state in less than 1 ps. This indicates that the precipitates present in post-annealed samples are not required for the fast relaxation of photoexcited carriers in low-temperature-grown GaAs. Ultrafast switching measurements on a post-annealed version of the GaAs film also resulted in the generation of similar, 0.6 ps full width at half maximum pulses.     

Quantitative HRTEM analysis of semiconductor quantum dots

Elastic strains and layer compositions of semiconductor quantum dots are quantified by the measurement of lattice fringe spacings from high-resolution micrographs. Analyses of simulated images, taking thin-specimen relaxation into account by application of finite element simulations, demonstrate that the local slopes of these strain profiles may contain severe artefacts mainly caused by local crystal tilts. Nevertheless, average strain values may be measured with sufficient accuracy and can be used to obtain an estimate on average layer compositions by application of the continuum theory of elasticity when analysing experimental micrographs. Focusing on In(x)Ga1-xAs/GaAs and Ge(x)Si1-x/Si heterostructures, it is demonstrated that elastic strains of nanoscale coherent islands are severely decreased due to an elastic relaxation mechanism compared to fully strained two-dimensional layers. The analysis of self-assembled quantum dots and two-dimensional wetting layers buried by capping layers gives clear evidence for a substantial reduction of the lattice strains compared to the values expected for the nominal layer stoichiometries. This observation originates most presumably from a compositional intermixing during epitaxial growth.     

Improved CdTe layers on GaAs and Si using atomic layer epitaxy

In this paper, we report on the atomic layer epitaxy (ALE) of CdTe on GaAs and Si by the organometallic vapor phase epitaxial process at atmospheric pressure. Self-limiting growth at one monolayer was obtained over the temperature range from 250°C to 320°C, under a wide range of reactant pressure conditions. A study of growth mechanism indicates that DMCd decomposes into Cd on the surface and the Te precursors react catalytically on the Cd covered surface. We have used this ALE grown layer to improve the crystal quality and the morphology of conventionally grown CdTe on GaAs. Improvement in the crystal quality was also observed when ALE CdTe nucleation was carried out on Si pretreated with DETe at 420°C. Atomic layer epitaxy grown ZnTe was used to obtain (100) oriented CdTe on (100) silicon.     

热壁外延生长GaAs／Si薄膜质量研究

本文研究了用热壁外延（HWE）技术在Si衬底上不同工艺下生长的GaAs薄膜的拉曼（Raman)和荧光（PL）光谱。研究表明：在室温下,GaAs晶膜的Raman光谱的265cm^-1横声子（TO）峰和289cm^-1纵声子（LO）峰的峰值之比随晶膜质量的变化而逐渐变大、半高宽（FWHM）变窄且峰值频移动变小,而LC光谱出现在871nm光谱的FWHM较窄,表明所测得的薄膜为单晶晶膜,对同一晶膜也可判断出均匀程度。因此可以通过拉曼光谱和PLC光谱相结合评定外延膜晶体质量。     

Relaxation of crystal lattice parameters and structural ordering in In x Ga1 − x As epitaxial alloys

Epitaxial In _x Ga_{1 − x} As/GaAs(100) heterostructures grown by the MOC-hydride method with a considerable lattice mismatch are studied by X-ray diffraction and scanning electron microscopy. The relaxation coefficient of the crystal lattice of the epitaxial alloy is calculated and the deformation energy is evaluated. It is shown that, at a concentration of the In atoms in metal sublattice close to x = 0.5, the superstructural phase formed on the surface of the epitaxial In _x Ga_{1 − x} As alloy is the InGaAs₂ compound with a layered tetragonal crystal lattice and ordered arrangement of the atoms of the metal sublattice in the growth plane of the epitaxial film.     

GaAs MESFET ring oscillator on Si substrate

GaAs MESFET ring oscillators were fabricated on a Si substrate and successfully operated. Epitaxial techniques to grow a GaAs layer on a Si substrate were investigated. The device-quality GaAs epitaxial layer was obtained by introducing a Ge layer (by ionized cluster-beam deposition) and alternating GaAs/GaAIAs layers (by MOCVD). The typical transconductance of 140 mS/mm was obtained for the FET with a 0.5 µm × 10 µm gate. The minimum delay time was 66.5 ps/ gate at a power consumption of 2.3 mW/gate.     

Shear deformation and strain relaxation in HgCdTe on (211) CdZnTe

Shear strain is present in Hg_0.68Cd_0.32Te epitaxial layers grown by molecular beam epitaxy on (211)-oriented Cd_1−yZn_yTe substrates. Differences in the substrate zinc composition led to lattice mismatch between the epitaxial layer and the substrate. The shear strain induced by the mismatch was measured using reciprocal space maps in the symmetric (422) and asymmetric (511) and (333) reflections. In addition, strain relaxation through the formation of misfit dislocations was confirmed using double crystal x-ray topography. Both the shear strain and the misfit dislocation density increased with increasing mismatch between the epitaxial layer and the substrate. Lattice-matched layers were free of misfit dislocations and exhibited triple axis diffraction rocking curve widths of approximately 6 arcsec. The combination of a thick epitaxial layer, a low index substrate, and the potential for lattice mismatch indicates that both shear strains and misfit dislocations must be considered in the structural analysis of HgCdTe/CdZnTe heterostructures.