重点工程用电子元器件使用失效情况分析

1概况本文通过对重点工程配套中现场失效的3000余只元器件的失效数据进行整理分析，总结出元器件在使用中失效的主要失效模式及其分布，并对引起元器件失效的主要原因进行了分析。文中所分析的失效元器件主要为了115个国内元器件生产单位（其中元件54个，器件61个）的产品，这些失效品全部是在重点工程配套中失效的，其中大部分是在整机的装配和调试阶段失效的，少量是在复测及整机检验中失效的。在失效元器件中，分立器件占37．4％，电阻器占14．7％，电容器占15．2％，集成电路占11．1％，接插件占6．8％，光电器件占5．8％，继电器占3．6…     

机载电子设备可靠性增长与鉴定试验中元器件失效分析

1概况几年来，根据机载电子设备的可靠性增长和鉴定试验中提供的失效样品，我们完成了51种型号的131个失效样品的失效分析，向整机单位共提交了49份失效分析报告，提供了失效分析结果以及在整机设计、元器件正确使用、采购及筛选等方面提出了改进措施建议。通过整机单位落实改进措施，使整机的可靠性得到有效的提高。其中，包括元器件生产单位改进产品结构和工艺，消除了引起失效的因素；整机单位改进整机线路设计或其它措施和改选元器件生产定点厂等。2失效分析结果的失效机理性质分类接送分析样品数的性质比例，批次性占41％；随机性占8％…     

提高电路中元器件的使用可靠性

元器件的使用可靠性是整机可靠性的关键和基础。结合工作实践,对电路设计中元器件的使用性、失效原因进行了分析、总结,并提出了提高电子元器件使用可靠性的建议。     

浅谈电子元器件的二次筛选

元器件二次筛选指的是当元器件生产厂商进行的筛选不能满足用户应用要求时,由使用方或其委托单位在元器件生产厂商筛选基础上进行的筛选,是对元器件生产厂商筛选工作的补充和验证。二次筛选是针对不同的失效模式,进行一些试验以剔除早期失效产品,能够有效地提高系统的整体可靠性,因而使用十分广泛。本论文首先介绍二次筛选的原因及其适用范围,进而提出质量控制的概念、四种常用的元器件的二次筛选方法以及其发展方向。     

电路设计中元器件的使用可靠性

元器件的使用可靠性是整机可靠性的关键和基础.结合工作实践,对电路设计中元器件的使用可靠性、失效原因进行了分析、总结,并提出了提高电子元器件应用可靠性的建议.     

国家某重点工程使用的电子元器件可靠性分析

1 引言有关部门曾先后组织对国家某重点工程使用的仿制电子元器件的可靠性进行了摸底试验.初步摸清了这些要求具有高可靠性的试制品的可靠性水平,并分析了失效原因,有针对性地提出了改进措施。电子元器件可靠性摸底试验由质量考核和失效考核组成.其中质量考核是依据本工程有关技术条件要求进行交收、例行试验和寿命试验的;失效率水平考核是按GB1772—79作五级(部分六级)额定条件进行寿命试验的.考虑该系统有长期贮存的特点,故增加了一项高温贮存试验.     

失效分析结果在元器件可靠性设计中的应用

本文从阐述失效分析的主要任务和电子元器件可靠性设计的基本概念入手，探讨了失效分析与元器件可靠性设计之间的关系，介绍了如何根据不同的失效模式采取相应的可靠性设计技术的基本方法，并用实例说明了失效分析结果在促进电子元器件可靠性设计技术的深入研究和工程应用，以及提高产品可靠性方面所起的重要作用。     

失效电子元器件分析方法

介绍了一种电子元器件失效分析方法,给出了失效器件失效的统计要素,并对失效要素进行分析、研究失效模式与失效机理,找出失效原因,找到生产过程中的薄弱环节,制定相应措施,及时有效预防器件的再次失效,提高电子元器件的使用可靠性,进而提高整机可靠性,以较小的质量成本获取较高的经济效益,避免产品出现重复性问题,最终达到控制质量成本的目的。     

电子元器件失效模式影响分析技术

在元器件中进行失效模式影响分析(FMEA)技术研究和应用的基础上,论述了适合元器件的失效模式、机理影响分析(FMMEA)技术,在国内首次将FMMEA技术应用到元器件的基础上,研制了FMMEA技术分析软件,为元器件的研制和使用中控制或消除相关的失效模式及机理,提高产品质量和可靠性提供了一个新的方法和思路。     

PCBA失效原因分析

对长期在沿海地区使用的某电表的PCBA上的部分元器件出现腐蚀现象的原因进行了分析,通过分析发现,该PCBA上的部分元器件被腐蚀是由于三防工艺不当、 电化学腐蚀、 银迁移和卤素污染造成的.对各种失效现象的机理进行了详细的解释,并提出了相应的改进意见,对于该产品可靠性和使用寿命的提高具有一定的指导意义.     

探究电子信息工程技术的发展及保障途径

随着快速发展的社会经济,我国科学技术水平显著提升,在人们的日常生活中对电子产品的依赖程度不断加深,在各个行业和领域中都广泛的应用了各种电子信息技术.为了实现电子信息工程技术的顺利发展,就必须加强保障,这样才能够实现其顺利发展.本文主要是从电子信息工程技术的发展方向以及保障电子信息工程技术发展的有效途径这两个方面对电子信息工程技术做出了详细的分析和研究,这样不仅仅能够帮助确定电子信息工程技术正确的发展方向,加快提高电子信息工程技术水平和质量,同时也能够为电子信息工程技术的发展营造出安全、良好的发展环境,保证其得到有效发展,更好的发挥出电子信息工程技术的有效作用.     

微波真空电子器件磁控管的失效率模型

以磁控管现场使用数据和失效模式为基础,根据真空电子器件失效率或平均寿命等可靠性指标的考核方法,对新版（ＧＪＢ２９９Ｂ）电子设备可靠性预计手册中的失效率模型与旧版（ＧＪＢ２９９Ａ）进行了验证对比。结果表明,新版比旧版更接近实际,而且其预计精度也有明显提高,新版所建立的失效率数学模型可以满足工程的实际要求。     

Combining vibration test with finite element analysis for the fatigue life estimation of PBGA components

The study develops a methodology that combines the vibration failure test, finite element analysis (FEA), and theoretical formulation for the calculation of the electronic component’s fatigue life under vibration loading. A specially designed plastic ball grid array (PBGA) component with built-in daisy chain circuits is mounted on a printed wiring board (PWB) as the test vehicle for the vibration test. It is then excited by a sinusoidal vibration whose frequency equals the fundamental frequency of the test vehicle and tested until the component fails. Because the solder balls are too small for direct measurement of their stresses, FEA is used for obtaining the stresses instead. Thus, the real displacements in the vibration test are then inputted to the FEA model when performing the stress analysis. Consequently, the stress versus failure cycles (S–N) curve is constructed by correlating both the obtained stresses on the solder balls and the number of failure cycles in the vibration test. Furthermore, the Miner’s rule is applied in calculating the fatigue damage index for those test components when failed. Finally, a formula for the prediction of the component failure cycle is deduced from all these procedures studied. It is also examined later by firstly predicting the fatigue failure cycle of a component and then conducting a vibration test for the same component for the verification purposes. The field test results have proven to be consistent with predicted results. It is then believed that the methodology is effective in predicting component’s life and may be applied further in improving the reliability of electronic systems.     

现代电子信息工程的关键技术分析及应用

电子信息工程技术是实现现代社会建设以及发展的基础,其研究重点在于信息的获取、处理以及分析。将电子信息工程应用于各行各业,有利于提升行业现代化水平。文中对电子信息工程进行了介绍,对电子信息工程的关键技术进行了分析,并对电子信息工程的应用策略进行了详细探究。     

A review of board level solder joints for mobile applications

The reliability of electronics under drop-shock conditions has attracted significant interest in recent years due to the widespread use of mobile electronic products. This review focuses on the drop-impact reliability of lead-free solder joints that interconnect the integrated circuit (IC) component to the printed circuit board (PCB). Major topics covered are the physics of failure in drop-impact; the use of board level and component level test methods to evaluate drop performance; micro-damage mechanisms; failure models for life prediction under drop-impact; modelling and simulation techniques; and dynamic stress–strain properties of solder joint materials. Differential bending between the PCB and the IC component is the dominant failure driver for solder joints in portable electronics subjected to drop-impact. Board level drop-shock tests correlate well with board level high speed cyclic bending tests but not with component level ball impact shear tests. Fatigue is the micro-damage mechanism responsible for the failure of solder joints in the drop-shock of PCB assemblies and the fatigue strength of solder joints depends strongly on the strain rate, test temperature, and the sequence of loading. Finally, tin-rich lead-free solders exhibit significantly higher strain rate sensitivity than eutectic SnPb solder.     

几种电子元器件长期储存的失效模式和失效机理

通过对几种元器件长期储存期间的失效进行分析,探讨了这几种元器件的失效模式及其失效机理。     

Sensitivity analysis of simplified Printed Circuit Board finite element models

Many items of electronic equipment are subjected to harsh vibrations during their lifetime, these vibrations can damage electronic components and potentially risk total device failure. One approach to assess this risk is to compare the predicted vibration response of the Printed Circuit Board against a vibration level that is experimentally determined to produce component failure. Theoretically the vibration response can be determined using a simplified model of the PCB, where the components are modelled using a “smeared” approach; however, the error due to using such a simplified approach has not yet been defined. This paper shows a process to calculate the errors produced by such simplification techniques and derives factors of safety that can be used for all future vibration response models, using these factors ensures that future predictions do not underestimate the real response. Additionally, the errors depends on several other values besides the simplification technique, namely the Printed Circuit Board properties and the component: type, location and density. To account for these factors the process will use a sensitivity analysis approach to consider many possible design cases, this approach involves the creation of a large number of randomly created cases, all with different input values and giving different factors of safety. In this way the statistics of the factor of safety can be built up, giving much greater confidence in the results and insight into the drivers of the modelling error.     

Failure mechanism models for ductile fracture

This tutorial illustrates design situations where ductile fracture of some components can compromise system performance, thereby acting as an overstress failure mechanism. Analytic (physics-of-failure) methods, based on continuum fracture mechanics principles, are presented to design against such failures. Examples illustrate the use of these models in practical design situations in mechanical engineering and electronic packaging. The design equations are based on continuum mechanics rather than on molecular micromechanics, and can be implemented in an engineering design environment. The associated stress analysis of ten requires numerical finite-element techniques. The methods for material-property characterizations have matured appreciably over the past 40 years and are specified in engineering handbooks     

IEC TR62380可靠性预计通用模型分析

分析了国外典型电子元器件数据手册——IEC TR 62380《电子组件,PCBs和设备的可靠性预计通用模型》,并简要介绍了该预计手册中电子元器件的可靠性预计模型和方法.分析结果表明,模型直接考虑了环境的影响,并以设备任务剖面的热循环代替了难以评价的环境因子;在部件失效率中包含了与部件焊接相关的故障.