力电耦合载荷作用下铁电陶瓷破坏行为的云纹干涉方法研究

本文介绍了如何用云纹干涉法实时地观察铁电陶瓷在力载荷和电载荷共同作用下裂尖的破坏行为．测量了三点弯试验中由电场和应力集中导致的裂尖的变形场．对变形的云纹图分析表明：当极化方向与裂纹扩展方向一致，且都与电场方向垂直，裂尖附近的正应变随电场的增加而增加，应变集中现象比较突出，电场促进和加速了裂纹的扩展．     

基于数字散斑相关方法测定Ⅰ型裂纹应力强度因子

提出了一种通过数字散斑相关方法测定金属材料Ⅰ型裂纹尖端位置和应力强度因子的实验方法.实验采用疲劳试验机对含Ⅰ型缺口的Cr12MoV钢试件预制裂纹,通过数字散斑相关方法测试试件在三点弯曲加载条件下裂纹的扩展过程及裂尖区域的位移场.将位移场数据代入裂尖位移场方程组,采用牛顿-拉普森方法求解含未知参量的裂尖非线性位移场方程组,计算裂尖位置和应力强度因子.实验结果表明,采用该方法可以准确地测定金属材料Ⅰ型裂纹应力强度因子、裂尖位置及裂纹扩展长度,解决了以往研究中因不能准确测定裂纹尖端位置,而无法准确计算Ⅰ型裂纹裂尖断裂参数的难题,揭示了金属材料裂纹扩展过程中应力强度因子演化特征.     

基于三维数字图像相关的低周疲劳试验研究

为研究三点弯曲试件在低周疲劳载荷作用下,裂纹萌生、扩展与循环周期间的关系以及裂纹区域位移与应变场的变化规律,由万能试验机及数字循环加载控制系统对三点弯曲试件施加循环周期载荷。两组CCD和试验机同步采集记录系列交变载荷作用下试件裂纹周边区域的数字散斑图像及载荷,应用三维数字图像相关(Digital image correlation,DIC)技术计算裂纹尖端区域的位移及应变场。通过对裂尖区域位移、主应变等的分析,获得裂纹扩展长度与扩展率等的变化规律。     

可压缩粘弹性材料Ⅱ型动态扩展裂纹尖端场

为了研究粘性效应作用下的动态扩展裂纹尖端渐近场,建立了可压缩粘弹性材料II型动态扩展裂纹的力学模型,推导了可压缩材料Ⅱ型动态扩展裂纹的本构方程.在稳态蠕变阶段,弹性变形和粘性变形同时在裂纹尖端场中占主导地位,应力和应变具有相同的奇异量级r-1/(n-1).通过渐近分析求得了裂纹尖端应力、应变和位移分离变量形式的渐近解,并采用打靶法求得了裂纹尖端应力、应变和位移的数值结果,给出了应力、应变和位移随各种参数的变化曲线.数值计算表明,弹性变形部分的可压缩性对Ⅱ型裂尖应力场影响甚微,而对应变场和位移场影响较大.裂尖场主要受材料的蠕变指数n和马赫数M的控制.当泊松比ν =0.5时,可以退化为不可压缩粘弹性材料Ⅱ型动态扩展裂纹.     

复合材料断裂力学参量的实验测定

本文采用三维云纹干涉仪同步测量含裂纹复合材料弯曲板的面内位移场及离面位移场，并对离面位移场云纹图进行计算机自动采集和处理，编制了云纹数字图像处理软件。文中推导了正交异性复合材料弯曲问题的离面位移场表达式，得到了弯曲板裂纹尖端位移w与应力场强度因子K1的关系式。通过实测位移，结合裂尖位移场推导出应力强度因子K1值。     

蠕变材料Ⅱ型动态扩展裂纹尖端场

为了研究粘性效应作用下的动态扩展裂纹尖端渐近场,建立了蠕变材料Ⅱ型动态扩展裂纹的力学模型,在稳态蠕变阶段,弹性变形和粘性变形同时在裂纹尖端场中占主导地位,应力和应变具有相同的奇异量级,即(σ,ε)∝r-1/(n-1)。通过渐近分析求得了裂纹尖端应力、应变和位移分离变量形式的渐近解,并采用打靶法求得了裂纹尖端应力、应变的数值结果,数值计算表明,裂尖场主要受材料的蠕变指数n和马赫数M的控制。通过对裂纹尖端场的渐近分析,从应变角度出发,提出了蠕变材料Ⅱ型动态扩展裂纹的断裂判据。     

采用显微网格法研究韧性材料平面应力状态下裂尖附近的应变场

用显微网格数字图象处理方法，测量了韧性材料平面应力条件下Ｉ型单边裂纹尖端附近的应变场。实验结果表明：在裂尖两侧存在与裂纹方向夹角约为５０°的大变形带。最大应变位于离裂尖一定距离的大变形带上，随着载荷增加，最大应变的位置逐渐靠近裂纹尖端。应变峰值轨迹线在裂纹顶端呈放射状，载荷增加时，应变峰值的轨迹线位置并不改变。     

层状压电陶瓷致动器中力电耦合场奇异性的数值分析

首先推导了不同压电材料界面裂纹尖端处的扇形区域内包含基本方程、裂纹面D-P边界条件和交界面处边界条件的弱形式。通过假设力电耦合位移场(位移和电势)与到裂纹尖端距离的(λ 1)次方成正比,可以得到一个分析压电材料裂纹尖端处力电耦合场奇异性的特殊的一维有限元列式。该一维有限元列式只需对扇形区域在角度方向上离散,最后的总体方程为一个关于λ的二次特征根方程。探讨了层状压电陶瓷致动器中可能出现奇异力电耦合场的部位的裂纹面边界条件及交界面处边界条件,进而将该一维有限元法进行推广,用于研究了这些部位的力电耦合场的奇异性。通过数值算例与相应的精确解的比较表明该方法是正确的,而且仅用很少单元就可以得到非常精确的结果。     

压剪载荷作用下界面裂纹尖端场的研究

建立了弹性-幂律蠕变双材料界面裂纹准静态扩展的力学模型，求得了裂纹尖端应力、应变和位移场分离变量形式的解及其数值结果；讨论了材料性能参数对裂纹尖端场的影响；计算和分析了界面裂纹的摩擦效应，并且得出了给定条件下裂尖场的轮廓图形．     

云纹干涉反转倍增法及其在微电子组件变形场测量中应用

本文提出并介绍了云纹干涉反转倍增法，该方法将光学载波、反转剪切、富立叶变换倍增技术巧妙地结合于云纹干涉光路中。利用载波频率，把带载波的云纹干涉变形图在富立叶变换系统中进行条纹倍增，而试样变形信息也倍增了相同倍数，将云纹干涉的测量灵敏度又提高了一个数量级。在实验中实现了１６倍倍增，即位移测量灵敏度由０．４μｍ提高到０．０２５μｍ（虚栅频率１／２４００）。将这一方法用于测量热载下金属Ｎｉ膜／ＺｒＯ２陶瓷基界面裂纹尖端面内位移场，分析裂尖位移奇异性。实验表明：热载作用下，膜／基组件界面裂纹尖端的位移奇异性具有指数奇异特性，其奇异性指数与膜／基材料，界面层特性等有关     

组件裂尖变形场的云纹显微倍增研究

将云纹干涉法与显微、倍增技术相结合，发展了一种位移场云纹条纹显微倍增方法．对该方法进行了严格的理论推导和精确的实验验证，并用该方法对热载下微电子模拟组件的层间裂纹尖端位移场和奇异性进行了实验研究     

瓷修复体界面断裂行为的模拟实验研究

本文利用云纹干涉法和云纹干涉－－有限元混合法，对瓷修复体的模拟双材料模型界面断裂问题进行了实验研究。用云纹干涉和数字错位云纹干涉法测量带边裂纹的双材料四点简支梁在剪切作用下界面表面的剪应变分布及界面两侧局部表面的位移场，实验表明，由于界面两两侧材料力学性质不同，表现出界面剪切断裂问题的非称性和裂尖附近复合型断裂的特点；用云纹干涉法和有限元法相结合的混合法对粘接界面角点应力奇异性进行研究，并对角点附近应力应变场作了分析，得到了应力奇异指数与边界楔角，载荷的关系，证明了用界面应力强度因子Kf来描述界面端部区域应力分布的公式，并得到了双材料界面端部区域的应力应变分布情况。本文的实验结果为进一步研究口腔金瓷修复体界面的优化设计提供了基础，同时也说明云纹干涉法对于双材料界面断裂行为的研究是有效的。     

An experimental analysis of displacement field of mixed mode crack

In this paper, the characteristic properties ofv (y-direction displacement) field surrounding the tip of a mixed mode crack are studied. These properties can be used to evaluate the rigid body rotation of the crack tip, theK _I SIF and the ratio ofK _II SIF toK _I.The authors employ a film to record the displacement information based on the technique of moire interferometry with sticking films. By using the data taken from the moire pattern and treating them with the damping least square method, all of the parameters of the crack can be obtained accurately.     

Experimental analysis for singularities in crack normal to bimaterial interface

Three kinds of the model of crack normal to the bimaterial interface are studied by an experimental method. The highly sensitive moire interferometry technique is employed to obtain the displacement fields near the crack tip. The singularities of the three kinds of model are determined and analyzed by the experimental method and compared and discussed.     

垂直界面裂纹断裂力学问题的实验研究

用实验方法研究了具有垂直界面方向裂纹的界面断裂力学问题．根据实验结果对裂尖区域的奇异性性质、角位移分布、应力强度因子等进行了分析，并将实验结果与理论结果进行了比较和讨论     

Study on fracture behavior of ferroelectric ceramics under combined electromechanical loading by using a moiré interferometry technique

This paper discusses an in situ observation of fracture behavior around a crack tip in ferroelectric ceramics under combined electromechanical loading by use of a moiré interferometry technique. The deformation field induced by the electric field and the stress concentration near the crack tip in three-points bending experiments was measured. By analysis of the moiré images it is found that under a constant mechanical load, the electric field almost has no effect on the crack extension in the case that the directions of the poling, electric field and crack extension are perpendicular to each other. When the poling direction is parallel to the crack extension direction and perpendicular to the electric field, the strain decreases faster than that calculated by FEM with and without electrical loading as one goes away from the crack tip. In addition, as the electric field intensity increases, the strain near the crack tip increases, and the strain concentration becomes more significant. The project supported by the National Natural Science Foundation of China (10132010, 10025209, 10232023)     

A STUDY OF J-INTEGRAL OF THE ORTHOTROPIC COMPOSITE MATERIAL

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Measurement of the strain field near a crack tip in polymethylmethacrylate by holographic interferometry

An experimental method has been developed for the detailed, real-time study of the strain field near a crack tip in any transparent material. This method combines holography and interferometry to measure the field of averaged transverse strain in a sheet specimen under inplane loading. It is shown that the solution for an edge crack in a semi-infinite sheet based on two-dimensional linear elastic theory can be applied to the finite-width polymethylmethacrylate specimen. This solution is observed to become less valid as the crack tip is approached due to the breakdown of the plane-stress assumption. This effect is evaluated for a range of thicknesses from much less to much more than the crack length.     

云纹干涉条纹倍增方法研究

本文将云纹干涉法与载波法、倍增技术相结合,提出一种位移场和应变场云纹干涉条纹倍增方法,该方法使得云纹干涉法测量灵敏度提高四倍以上。文中对该方法给出了严格的理论推导和实验验证。     

Measurement of three-dimensional Mode-I stress intensity factor using multiple embedded grid moire technique

Multiple embedded grid moire and strain gage techniques are used to calculate the variation in Mode-I stress intensity factor throughout the thickness of ASTM E-399 standard compact tension specimens of Merlon polycarbonate. The specimen grids near the crack tip on the surface and in the interior were recorded for the unloaded condition and for various loaded states using high resolution photographic techniques. Optical processing produced moire patterns from which the change in the crack opening displacement could be determined. From the information about the crack opening displacement in the region of the crack tip, the Mode-I stress intensity factor was calculated for various interior planes and on the surface of the specimen. The stress intensity factor was found to be higher in the midplane than on the surface, and it causes crack initiation to start at the midplane.