不同柔性衬底上CdS薄膜退火前后的性能比较

采用磁控溅射法分别在柔性PI衬底、柔性AZO衬底和柔性ITO衬底上制备CdS薄膜,并在干燥空气中以CdCl2为源380℃退火,分别研究了不同柔性衬底及退火工艺对CdS薄膜形貌、结构和光学性能的影响。研究结果表明:退火前在不同柔性衬底上的CdS薄膜形貌依赖于衬底类型,退火后CdS薄膜的晶粒再结晶,晶粒度增大明显,且不再依赖于衬底类型。不同柔性衬底上CdS薄膜均为立方相和六角相的混相结构,退火后,六角相比例增大,薄膜的结晶质量提高。透过率退火后改善明显,其中,在柔性AZO衬底上的CdS薄膜透过率超过80%。     

不同方法及衬底类型对CdS多晶薄膜性能的影响

采用化学水浴法和磁控溅射法分别在AZO、FTO、ITO透明导电玻璃衬底上制备了CdS薄膜,利用扫描电镜、XRD以及透射光谱等测试手段,研究了两种制备方法对不同衬底生长CdS薄膜形貌、结构和光学性能的影响.研究结果表明,不同方法制备的CdS薄膜表面形貌均依赖于衬底的类型,水浴法制备的CdS薄膜晶粒度较大,表面相对粗糙.不同方法制备的CdS薄膜均为立方相和六角相的混相结构,溅射法制备的多晶薄膜衍射峰清晰、尖锐,结晶性较好.水浴法制备的CdS薄膜透过率整体低于溅射法,但在短波处优势明显.     

原位退火对磁控溅射制备的ZnS薄膜微结构和发光性能的影响

采用射频磁控溅射技术在玻璃衬底上制备了系列ZnS薄膜,利用X射线衍射仪(XRD)、扫描电子显微镜(SEM)和荧光分光光度计研究了Ar气氛中300～500℃原位退火对薄膜微结构和发光性能的影响.结果表明,退火温度对ZnS薄膜的结晶性能和晶粒大小的影响不大,但会显著影响其发光特性.低温退火处理的薄膜的PL谱具有多个发光峰,...     

退火条件对射频磁控溅射法制备YIG薄膜性能的影响

本文采用射频磁控溅射法在硅基片上沉积YIG薄膜,主要研究了退火条件对YIG薄膜性能的影响。研究结果表明在750oC退火4小时制备的薄膜性能最好,其饱和磁化强度可达到185.9emu/cm3,远大于YIG块材的Ms(139emu/cm3)。此外,其磁性与Fe2+相关。     

退火对射频磁控溅射氧化锌薄膜性能的影响

采用射频磁控溅射技术在SiO2/Si上淀积高c轴取向的ZnO薄膜,在氧气和氩气的混合气氛、不同温度(400~900℃)下进行快速热退火处理。利用X-射线衍射(XRD)、原子力显微镜(AFM)、扫描电镜(SEM)和透射电镜(TEM)对薄膜结构、形貌与界面状态性能进行了分析。研究结果表明,ZnO薄膜的晶粒尺寸随着退火温度的升高而增大,衍射峰强度增强,峰位随之偏移;SEM分析显示薄膜呈柱状生长,表现出较好的c轴取向性;TEM分析表明ZnO与下电极Pt是呈共格生长,晶格匹配很好。     

退火处理对磁控溅射制备Ga掺杂ZnO薄膜性能的影响

采用磁控溅射法在普通玻璃上制备了Ga掺杂ZnO(GZO)薄膜,研究了退火处理对GZO薄膜组织结构、表面形貌及光电性能的影响,并利用扫描电子显微镜、X射线衍射仪、紫外分光光度计、四探针测试仪等对GZO薄膜的表面形貌、晶体结构、透光率及电阻率等进行测量与表征。结果表明:400~800℃退火对GZO薄膜的生长方式影响较小,所制薄膜均在(002)晶向沿c轴择优取向,退火温度对薄膜表面形貌影响较大,退火温度为600℃时,薄膜表面致密、平整,结晶质量最好,薄膜的透光率超过95%,电阻率最低为4.9×10~(-4)?·cm。     

退火对不同基底上氧化钒薄膜电阻的影响

采用直流磁控溅射的方法分别在普通玻璃与硅片上制备了氧化钒薄膜,在大气及真空氛围下分别对样品采取了退火处理,测量了退火前后薄膜的电阻,结合样品的XRD图谱进行了分析。结果表明,在普通玻璃和硅片上均得到了V2O5薄膜。经过大气氛围退火处理后,薄膜的结晶度明显增强,硅片上薄膜的电阻明显变小,而玻璃基底上的薄膜电阻变化则不明显。在温度升高的过程中,Si片上薄膜电阻变化范围为56～0.54MΩ。而经过真空退火处理的薄膜其电阻均发生改变,升温过程中,玻璃基底与Si片上薄膜的电阻变化范围分别为52～16MΩ、4.3～0.46MΩ,说明经过退火后硅片上沉积的薄膜具有较好的电学性能。     

低温磁控溅射制备CdS薄膜的结构和光学特性

用磁控溅射的方法在透明导电氧化物衬底上制备了CdS薄膜,制备时的衬底温度为30~200℃.X射线衍射测试结果表明在这一条件下制备的CdS薄膜是六角纤锌矿的多晶结构.扫描电子显微镜结果显示薄膜具有较好的晶体质量,这一结论也和拉曼光谱、紫外-可见吸收光谱、光致发光光谱的结果一致.拉曼光谱显示CdS薄膜内部的压应力随着制备温度的提高而增大.     

用磁控溅射和退火方法制备AlSb多晶薄膜

采用磁控溅射法在玻璃衬底上制备Al/Sb预制多层薄膜,然后将Al/Sb预制多层薄膜在退火炉中退火得到AlSb多晶薄膜.用X射线衍射(XRD)法测薄膜结构;用扫描电镜(SEM)测薄膜Al/Sb成分比,结果表明AlSb多晶薄膜具有单一的晶相、均匀的结构,以及粒径大约20nm的晶粒.根据电导率(lnσ)与温度(T)的关系得到电导激活能为0.21和0.321eV,为制备出适用于太阳电池的AlSb多晶薄膜奠定了一定的技术基础.     

中频交流磁控溅射制备AZO薄膜及退火工艺

以锌铝合金为靶材,采用工业生产设备,用中频交流磁控溅射法在玻璃衬底上制备出了铝掺杂氧化锌(AZO)透明导电薄膜,研究了氩氧比、退火温度、退火时间对薄膜结构、光学和电学性能的影响。结果表明,氩气和氧气体积流量比为3:1时常温下得到薄膜的方阻值最低,400℃真空退火1 h后薄膜可见光平均透过率由84.0%上升到86.7%,方阻值由5 000Ω/□下降到108Ω/□。     

Photoelectric properties of ITO thin films deposited by DC magnetron sputtering

As anti-reflecting thin films and transparent electrodes of solar cells,indium tin oxide（ITO） thin films were prepared on glass substrates by DC magnetron sputtering process.The main sputtering conditions were sputtering power,substrate temperature and work pressure.The influence of the above sputtering conditions on the transmittance and conductivity of the deposited ITO films was investigated.The experimental results show that, the transmittance and the resistivity decrease as the sputtering power increases from 30 to 90 W.When the substrate temperature increases from 25 to 150℃,the transmittance increases slightly whereas the resistivity decreases.As the work pressure increases from 0.4 to 2.0 Pa,the transmittance decreases and the resistivity increases.When the sputtering power,substrate temperature and work pressure are 30 W,150℃,0.4 Pa respectively,the ITO thin films exhibit good electrical and optical properties,with resistivity below 10^-4Ω·cm and the transmittance in the visible wave band beyond 80%.Therefore,the ITO thin films are suitable as transparent electrodes of solar cells.     

用直流磁控溅射法制备的ＩＴＯ薄膜的光电性能研究

用直流磁控溅射法将ＩＴＯ薄膜制备在玻璃基片上以作为太阳电池的透明电极。通过改变溅射功率、基片温度和工作气压来研究它们对所沉积的ITO薄膜的透过率和电导率的影响。实验结果表明：当溅射功率从30W增加到90W时,薄膜的透过率和电阻率都将减小;当基片温度从25℃ 增加到 150℃时,透过率稍微有点增大但电阻率减小;当工作气压从0.4Pa 增大到2.0Pa时,透过率减小,但电阻率增大。因此,在溅射功率为30W、基片温度为150℃、工作气压为0.4Pa 时,ITO薄膜有比较好的光电性能,其电阻率小于10-4 Ω•cm ,在可见光波段的透过率大于80%,适合于作为太阳电池的透明电极。     

衬底温度对磁控溅射生长HMGZO薄膜特性的影响

为适应高效Si基薄膜太阳电池对宽光谱透明导电 薄膜的需求,采用磁控溅射技术 生长了不同衬 底温度氢化作用下Ga和Mg共掺杂ZnO(HMGZO)透明导电氧化物(TCO)薄膜。研究了不同衬底温 度(200～280 ℃)对HMGZO薄膜 结晶特性及光电特性的影响。实验结果表明,制备的HMGZO薄膜均为具有六角纤锌矿结构的 多晶薄膜,呈 现(002)晶面择优生长。随着衬底温度的升高,薄膜中Mg含量逐渐增加,并且薄膜表面新型 锥状结构趋于 致密和均匀化。在各元素含量和结晶质量的共同影响下,其电阻率随着温度的升高从6．70×10－4 Ω·cm增加至7．63×10－4 Ω·cm。所有薄膜在可 见光区域(380～800 nm)的透过率均在80%以上,由于载流子共振吸收的作用,近红外区域的 透过率有所下降。MgO扩展带隙的作用和 Burstein-Moss(BM)效应的影响共同促进了薄膜光学带隙E_g展 宽,使得E_g达到了3.75 eV。当衬底温度为280 ℃ 时,薄膜方块电阻为4.91 Ω/sq,电阻率为7.63×10－4 Ω·cm,光电性能指数ΦTC值达0.022 Ω－1。     

Microstructure and optoelectronic properties of gallium- titanium-zinc oxide thin films deposited by magnetron sputtering

Gallium-titanium-zinc oxide(GTZO) transparent conducting oxide(TCO) thin films were deposited on glass substrates by radio frequency magnetron sputtering. The dependences of the microstructure and optoelectronic properties of GTZO thin films on Ar gas pressure were observed. The X-ray diffraction(XRD) and scanning electron microscopy(SEM) results show that all the deposited films are polycrystalline with a hexagonal structure and have a preferred orientation along the c-axis perpendicular to the substrate. With the increment of Ar gas pressure, the microstructure and optoelectronic properties of GTZO thin films will be changed. When Ar gas pressure is 0.4 Pa, the deposited films possess the best crystal quality and optoelectronic properties.     

Effect of thickness on optoelectrical properties of Nb-doped indium tin oxide thin films deposited by RF magnetron sputtering

Niobium-doped indium tin oxide （ITO:Nb） thin films are prepared on glass substrates with various film thicknesses by radio frequency （RF） magnetron sputtering from one piece of ceramic target material. The effects of thickness （60-360 nm） on the structural, electrical and optical properties of ITO: Nb films are investigated by means of X-ray diffraction （XRD）, ultraviolet （UV）-visible spectroscopy, and electrical measurements. XRD patterns show the highly oriented （400） direction. The lowest resistivity of the films without any heat treatment is 3.1×10^-4 Ω·cm^-1, and the resistivity decreases with the increase of substrate temperature. The highest Hall mobility and carrier concentration are 17.6 N·S and 1.36×10²¹ cm^-3, respectively. Band gap energy of the films depends on substrate temperature, which varies from 3.48 eV to 3.62 eV.     

Thermal conductivity of AlN thin films deposited by RF magnetron sputtering

Aluminum nitride (AlN) film, which is being investigated as a possible passivation layer in inkjet printheads, was deposited on a Si (1 0 0) substrate at 400 °C by radio frequency (RF) magnetron sputtering using an AlN ceramic target. Dependence on various reactive gas compositions (Ar, Ar:H₂, Ar:N₂) during sputtering was investigated to determine thermal conductivity. The crystallinity, grain size, and Al–N bonding changes by the gas compositions were examined and are discussed in relation to thermal conductivity. Using an Ar and 4% H₂, the deposited AlN films were crystalline with larger grains. Using a higher nitrogen concentration of 10%, a near amorphous phase, finer morphology, and an enhanced Al–N bonding ratio were achieved. A high thermal conductivity of 134 W/mk, which is nine times higher than that of the conventional Si₃N₄ passivation film, was obtained with a 10% N₂ reactive gas mixture. A high Al–N bonding ratio in AlN film is considered the most important factor for higher thermal conductivity.     

直流磁控溅射制备非晶硅薄膜的研究

非晶硅薄膜（a-Si）是目前重要的光敏材料,在很多领域得到广泛应用。直流磁控溅射具有工艺简单．沉积温度低等优点,是制备薄膜的一种重要技术。采用直流磁控溅射工艺在玻璃基板上沉积薄膜,并对样品进行了退火处理。研究了沉积速率与溅射功率的关系。结果表明薄膜的沉积速率与溅射功率近似有线性关系。利用X射线衍射（XRD）对薄膜进行了分析鉴定,结果表明溅射的薄膜是非晶硅薄膜。利用扫描电子显微镜（SEM）对非晶硅薄膜的表面形貌进行了观察和分析,与X射线衍射测试的结果一致。所以．利用直流磁控溅射工艺能在常温下能快速制备出良好的非晶硅薄膜。     

直流磁控溅射制备非晶硅薄膜的研究

非晶硅薄膜(a-Si)是目前重要的光敏材料,在很多领域得到广泛应用.直流磁控溅射具有工艺简单,沉积温度低等优点,是制备薄膜的一种重要技术.采用直流磁控溅射工艺在玻璃基板上沉积薄膜,并对样品进行了退火处理.研究了沉积速率与溅射功率的关系.结果表明薄膜的沉积速率与溅射功率近似有线性关系.利用X射线衍射(XRD)对薄膜进行了分析鉴定,结果表明溅射的薄膜是非晶硅薄膜.利用扫描电子显微镜(SEM)对非晶硅薄膜的表面形貌进行了观察和分析,与X射线衍射测试的结果一致.所以,利用直流磁控溅射工艺能在常温下能快速制备出良好的非晶硅薄膜.     

射频磁控溅射制备钛酸锶钡薄膜的研究进展

综述了射频磁控溅射制备钛酸锶钡(BST)薄膜的国内外研究动态,详细阐述了溅射工艺参数(电极、溅射气压、氧分压、温度)对BST薄膜微结构和电性能的影响,提出了射频磁控溅射制备BST薄膜中亟待解决的问题。