Preparation of polysiloxane oligomers bearing benzoxazine side groups and tunable properties of their thermosets

A new pathway for the preparation of polysiloxane oligomers bearing benzoxazine side groups were reported via the hydrolysis and co‐polycondensation of benzoxazinyl siloxane (SBZ) with dimethyldiethoxysilane (DEDMS). The structures of SBZ and oligomers were characterized by Fourier transform infrared spectroscopy (FTIR) and nuclear magnetic resonance (NMR) spectroscopy. The average molecular weights of the obtained oligomers were estimated from size exclusion chromatography and ¹H‐NMR to be in the range of 2000–4000. The oligomers gave transparent films by casting in THF solution. The films were further thermally treated to produce crosslinked films via the ring opening polymerization of benzoxazine side group. The effects of siloxane content on polymerization behavior, glass transition temperature, and mechanical properties of the polybenzoxazine thermosets were investigated. Tensile test of the films revealed that the elongation at break increased with increasing siloxane content. The elongation at break of poly(I‐50) was up to 12.1%. Dynamic mechanical analysis of the thermosets showed that the T_gs were in the range of 119–165°C. Thermogravimetic analysis also revealed a better thermal stability as evidenced by the 5% weight loss temperatures in the range of 363–390°C. © 2014 Wiley Periodicals, Inc. J. Appl. Polym. Sci. 2014 , 131, 40960.     

Silacyclobutane-functionalized cyclosiloxanes as photoactive precursors for high thermal stability,low dielectric constant and low dielectric loss polymers

Low dielectric photoactive materials have significant potential as components in future microelectronics. Although a number of photosensitive groups have been used to construct photopatternable materials, it remains challenging to introduce these groups into polymer chains via facile yet controlled polymerization techniques. The present work demonstrates the synthesis of a new class of photoactive cyclosiloxane monomers having hybrid siloxane-carbosilane main chains. These compounds can be cured by applying ultraviolet radiation and heat to promote the reaction of the silacyclobutene units and form hyper-cross-linked cyclosiloxanes. The cured resins show high thermal stability (with T_5% values in the range of 460–550°C), low dielectric constants (2.36–2.76 at 10 MHz) and low dielectric losses (10⁻³ at 10 MHz). Thus, these polymers could possibly be used as high-performance dielectric materials.     

Synthesis,characterization, and dielectric properties of polymers functionalized with coumarone and diethanolamine

A series polymers of the poly(4‐{[bis(2‐hydroxyethyl)amino]methyl}‐2‐oxo‐2H‐chromen‐7‐yl‐2‐methylpropanoate), P(CIMMAOC)‐DEA, were synthesized by modification of poly(4‐(chloromethyl)‐2‐oxo‐2H‐chromen‐7‐yl‐2‐ethylpropanoate), P(CIMMAOC), with diethanolamine (DEA). All polymers were structurally characterized by FTIR, ¹H NMR, UV–vis, and Fluorescence spectra. The electronic features of the polymer, such as lowest unoccupied molecular orbital (LUMO) and highest occupied molecular orbital (HOMO) energies and electrostatic potential (ESP), and the vibrational frequencies were computed by the Becke3–Lee–Yang–Parr (B3LYP) functional using 3–21G* basis set. Dielectric measurements for P(CIMMAOC) and P(CIMMAOC)‐DEA were performed by means of an impedance analyzer as a function of frequency and temperature. It was found that the dielectric constant values decreased in the applied frequency range. The values of dielectric constant increased with a rise in concentrations of DEA in polymer for all temperatures. Dielectric constants of P(CIMMAOC) and P(CIMMAOC)‐DEA (60%) were calculated as 3.93 and 12.29 at 1 kHz, respectively. © 2015 Wiley Periodicals, Inc. J. Appl. Polym. Sci. 2015 , 132, 42164.     

Antifouling ultrafiltration membrane fabricated from poly (arylene ether ketone) bearing hydrophilic hydroxyl groups

A new kind of membrane formation polymer, cardo poly(arylene ether ketone) bearing hydrophilic hydroxyl groups (PEK‐OH) was synthesized from the biphenol monomer 2‐(2‐hydroxyethyl)‐3, 3‐bis (4‐hydroxyphenyl)‐isoindolin‐1‐one (PPH‐OH), and 4, 4′‐difluorodiphenylketone. PEK‐OH asymmetric ultrafiltration membranes were prepared using the immersion coagulation phase inversion method. The PEK‐OH membrane prepared using the optimized conditions exhibited a pure water flux of 516 ± 18 L·m^?2·h^?1 and a 99.1 ± 1.4% rejection of bovine serum albumin (BSA) at an operating pressure of 0.1 MPa. The contact angle of PEK‐OH membrane was 66.0 ± 2.4 lower than these of the PEK‐C membrane (87.0 ± 2.8°, prepared from polymer PEK‐C under the same membrane formation condition as PEK‐OH membrane) and the UE50 membrane (84.0 ± 1.6°, a commercial PES ultrafiltration membrane). The amount of BSA protein adsorbed to the PEK‐OH membrane under static condition was measured to be 3.12 μg·cm^?2, which was greatly lower than that of 88.71 μg·cm^?2 and 74.40 μg·cm^?2 for the PEK‐C and the UE50 ultrafiltration membranes, respectively. Under dynamic filtration of BSA experiments, the PEK‐OH ultrafiltration membrane showed a 78.3% water flux recovery ratio, while only a 39.7% for the PEK‐C membrane and 46.5% for UE50 membrane were detected in the first cycle. After three cycles of BSA and LYZ filtration, the flux recovery ratio of PEK‐OH ultrafiltration membrane changed to be stable at 75% and 73%, while that of PEK‐C and UE50 ultrafiltration membranes remained declining gradually. Thus, hydrophilic PEK‐OH improves antifouling membrane property. © 2015 Wiley Periodicals, Inc. J. Appl. Polym. Sci. 2016 , 132, 42809.     

Mechanical,dielectric, and thermal properties of fluorosilicone rubber composites filled with silica/multiwall carbon nanotube hybrid fillers

In this work, hybrid fillers consist of modified silica (SiO₂) and multiwalled carbon nanotube (MWCNT) were used to improve the mechanical, dielectric, and thermal properties of fluorosilicone (FSR) composites via a direct mechanical mixing method. With the increase of CNT loading in SiO₂/CNT hybrid loading ratio, the tensile properties, dielectric constant, electrical conductivity, and thermal properties all increase without a sharp sacrifice of flexibility. The dielectric constant of FSR-S15/C5 achieved 7,370 @1 kHz, which is about four orders of the FSR-S20, and the dielectric loss remains as low as 0.676 @1 kHz. Therefore, the linkage of SiO₂ and FSR chains not only enhances the interfacial interaction between the fillers and FSR matrix but also decreases the agglomeration of the fillers in matrix. What is more, modified SiO₂ and CNT were designed as the effective hybrid filler to improve the performance of the polymeric matrix through synergic effect.     

Mechanical,thermal, and dielectric properties of SiCf/SiC composites reinforced with electrospun SiC fibers by PIP

Electrospun unidirectional SiC fibers reinforced SiC_f/SiC composites (e-SiC_f/SiC) were prepared with ∼10% volume fraction by polymer infiltration and pyrolysis (PIP) process. Pyrolysis temperature was varied to investigate the changes in microstructures, mechanical, thermal, and dielectric properties of e-SiC_f/SiC composites. The composites prepared at 1100 °C exhibit the highest flexural strength of 286.0 ± 33.9 MPa, then reduced at 1300 °C, mainly due to the degradation of electrospun SiC fibers, increased porosity, and reaction-controlled interfacial bonding. The thermal conductivity of e-SiC_f/SiC prepared at 1300 °C reached 2.663 W/(m∙K). The dielectric properties of e-SiC_f/SiC composites were also investigated and the complex permittivities increase with raising pyrolysis temperature. The e-SiC_f/SiC composites prepared at 1300 °C exhibited EMI shielding effectiveness exceeding 24 dB over the whole X band. The electrospun SiC fibers reinforced SiC_f/SiC composites can serve as a potential material for structural components and EMI shielding applications in the future.     

Synthesis and characterization of unsaturated polyester/carborundum composites

Two unsaturated polyesters, one based on phthalic anhydride PE_P and the other based on isophthalic acid PE_I, were synthesized. The chemical structure of the two polyesters was characterized by IR and ¹H and ¹³C NMR spectroscopy. The effect of styrene concentration on the curing of polyesters was also studied. It has been found that the percent of polyester/styrene (70/30 wt %) gave the highest percent of curing. Different concentrations of carborundum (0–70 wt %) were used to prepare polyester composites. A comparative study was done on the properties of the two prepared polyesters PE_P and PE_I and their composites in term of their thermal, mechanical, electrical, and physical properties. The results indicate that the polyester based on isophthalic acid (PE_I) and its composites gave higher compressive strength values and lower water absorption than those based on phthalic anhydride (PE_P). The presence of carborundum improved the thermal stability than the cured polyesters and electrical properties. © 2012 Wiley Periodicals, Inc. J. Appl. Polym. Sci., 2013     

Miscibility,UV resistance,thermal degradation,and mechanical properties of PMMA/SAN blends and their composites with MWCNTs

Poly(methyl methacrylate)/poly(styrene‐co‐acrylonitrile) (PMMA/SAN) blends, with varying concentrations, were prepared by melt‐mixing technique. The miscibility is ensured by fixing the acrylonitrile (AN) content of styrene acrylonitrile (SAN) as 25% by weight. The blends were transparent as well. The Fourier transform infrared spectroscopic (FTIR) studies did not reveal any specific interactions, supporting the well accepted ‘copolymer repulsion effect’ as the driving mechanism for miscibility. Addition of SAN increased the stability of PMMA towards ultraviolet (UV) radiations and thermal degradation. Incorporation of even 0.05% by weight of multi‐walled carbon nanotubes (MWCNTs) significantly improved the UV absorbance and thermal stability. Moreover, the composites exhibited good strength and modulus. However, at higher concentrations of MWCNTs (0.5 and 1% by weight) the thermo‐mechanical properties experienced deterioration, mainly due to the agglomeration of MWCNTs. It was observed that composites with 0.05% by weight of finely dispersed and well distributed MWCNTs provided excellent protection in most extreme climatic conditions. Thus, PMMA/SAN/MWCNTs composites can act as excellent light screens and may be useful, as cost‐effective UV absorbers, in the outdoor applications. © 2016 Wiley Periodicals, Inc. J. Appl. Polym. Sci. 2016 , 133, 43628.     

Poly‐2‐[(4‐methylbenzylidene)amino]phenol: Investigation of thermal degradation and antimicrobial properties

A new polyphenol (poly‐2‐[(4‐methylbenzylidene)amino]phenol) (P(2‐MBAP)) containing an azomethine group was synthesized by oxidative polycondensation reaction of 2‐[(4‐methylbenzylidene)amino]phenol (2‐MBAP) with NaOCl, H₂O₂, and O₂ oxidants in an aqueous alkaline medium. The structures of 2‐MBAP and P(2‐MBAP) were characterized by UV‐vis, FT‐IR, and ¹H NMR spectra. While the monomer decomposed completely up to 350°C and 57.2% of the polymer decomposed up to 1000°C. The thermal degradation of P(2‐MBAP) was also supported by the Thermo‐IR spectra recorded in the temperature range of 25–800°C. Electrical conductivity of the polymer was observed to increase 10⁸ fold after doping with I₂. Antimicrobial activities of the P(2‐MBAP) and 2‐MBAP against Sarcina lutea, Enterobacter aerogenes, Escherichia coli, Enterococcus feacalis, Klebsiella pneumoniae, Bacillus subtilis, Candida albicans, and Saccharomyces cerevisiae were also investigated. The number average molecular weight (M_n), weight average molecular weight (M_w) and polydispersity index (PDI) of the polymers were determined by gel permeation chromatography (GPC). © 2014 Wiley Periodicals, Inc. J. Appl. Polym. Sci. 2015 , 132, 41758.     

Curing characteristics,kinetics, and thermal properties of multifunctional fluorene benzoxazines containing hydroxyl groups

In this article, 9, 9-bis (4-aminophenyl)-2, 7-dihydroxy-fluorene (BADHF) was synthesized using methylsulfonic acid as catalyzer by direct condensation. Two kinds of novel multifunctional benzoxazine monomers containing fluorenyl groups and hydroxyl groups (MB-FH) were obtained from the chemical reaction of BADHF, salicylaldehyde, paraformaldehyde, and ethanolamine (or diethyleneglycolamine) through the adoption of o-hydroxy-benzylamine method and one-step Mannich condensation reaction method. In the traditional three-step synthesis method, the double bond reduction process took 8–12 h, but in this article, it only took 15 min. The structures of MB-FH monomers and their intermediates were characterized by Fourier transform infrared spectroscopy (FTIR), ¹H nuclear magnetic resonance (¹H NMR). The curing behaviors, curing kinetics, and thermal properties of MB-FH monomers were tested by using a dynamic rheometer, differential scanning calorimeter (DSC), FTIR, dynamic mechanical analysis (DMA), and thermogravimetric analyzer (TGA). The curing induction time can be apparently shortened by the introduction of hydroxyl groups into benzoxazine monomers, and it can catalyze the ring-opening polymerization of oxazine rings at lower temperatures, and improve the interaction of hydrogen bonds in the structure of polybenzoxazine.     

Epoxy/benzoxazinyl POSS nanocomposite resin with low dielectric constant and excellent thermal stability

Benzoxazinyl modified polyhedral oligomeric silsesquioxane (BZPOSS) is successfully synthesized and used to prepare nanocomposites with bisphenol A type epoxy resin (E51). The differential scanning calorimetry results showed the curing peak temperature of E51/BZPOSS blend decrease to 242°C, suggesting the high catalytic activity of BZPOSS to the polymerization of E51. The scanning electron microscope micrographs of poly(E51/BZPOSS)s and silicon element distribution maps given by EDS both demonstrated homogeneous dispersion of BZPOSS. Dielectric properties tests confirmed the dielectric constant can be reduced by the introduction of BZPOSS, which is attributed to the nano-pores from the cage structure of POSS. When 20 wt% BZPOSS was added, the dielectric constant decreased to 2.28 at 1 MHz. Meanwhile, DMA and TGA results indicated the thermal stability and heat resistance of poly(E51/BZPOSS)s at high temperature increased with the increase of BZPOSS, which is due to the increase of the crosslinking density and the change of crosslinking structure of copolymer.     

Preparation,property characterization and UV‐converting application of poly(conjugated azomethine‐urethane)/hydroxyl polyacrylate resin

A functional polyurethane coating with ultraviolet (UV) rays converting ability of changing higher energy UV rays into lower ones was prepared from poly(conjugated azomethine‐urethane) (CAUP) reacting with hydroxyl polyacrylate resin (HPAR). As an oligomeric isocyanate, CAUP was prepared in a reaction of toluene‐2,4‐diisocyanate with N,N′‐bis(4‐hydroxyl‐3‐methoxybenzylidene)‐o, m or p‐diaminobenzene that was synthesized from vanillin and o‐phenylenediamine or m‐phenylenediamine or p‐phenylenediamine. Fourier transform infrared spectroscopy, ¹H‐NMR, UV–vis, and fluorescence spectra were used to characterize those synthesized products and HPAR/CAUP films. UV‐converting abilities of HPAR/CAUP films had been demonstrated by natural exposure to ageing and the fluorescence emission spectra of HPAR/CAUP films and CAUP solutions. Red‐shift phenomena in the fluorescence emission spectra were due to molecule aggregations and stacks caused by intramolecular and intermolecular interactions such as hydrogen bonding effects. Dynamic mechanical thermal analysis and thermogravimetric analysis techniques were employed to study their mechanical and thermal properties of HPAR/CAUP films. The films exhibited excellent mechanical properties and owned high glass transition temperatures over 97.0°C, and their maximum thermal degradation temperatures were about 176.0°C. © 2013 Wiley Periodicals, Inc. J. Appl. Polym. Sci., 2013     

Polyimide hollow glass microspheres composite films with low dielectric constant and excellent thermal performance

Nowadays, polyimide (PI) with low dielectric constant is expected to be widely applied in microelectronics. For this reason, hollow glass microspheres (HGM) modified by silane coupling agent KH-550 (K-HGM), a series of HGM/PI and K-HGM/PI composite films with excellent thermal performance, hydrophobic and low dielectric constant were fabricated by in situ polymerization. The effect of HGM/K-HGM content on the properties of composite films was studied. The superior heat resistance of HGM can improve the thermal performance of composite films. Due to silane coupling agent KH-550, K-HGM exhibits a good interfacial compatibility with PI matrix and forms an interfacial adhesion region. With the HGM loading of 6%, comparing with pure PI films, the glass transition temperatures (T_g) of composite films were dramatically increased by 32.3°C. Especially, the low dielectric constant of 2.21 and dielectric loss of 0.0059 at 1 MHz were obtained for the PI/K-HGM composite film with addition of 8 wt%. Thus, PI/K-HGM composite films show more excellent performance. The current work provides a promising solution for fabrication of PI with low dielectric constant and superior thermal performance that may be applied in microelectronics industry.     

Structural effects of pendant groups on thermal and electrical properties of polyimides

Two series of aromatic polyimides containing various‐sized alkyl side groups were synthesized by thermal imidization of the poly(amic acid)s prepared from the polyaddition of benzophenonetetracarboxylic dianhydride and hexafluoro‐isopropylidene bis(phthalic anhydride) with 4,4′‐methylenedianiline, 4,4′‐methylene‐bis(2,6‐dimethylaniline), 4,4′‐methylene‐bis(2,6‐diethylaniline), and 4,4′‐methylene‐bis(2,6‐diisopropylaniline). The extent to which alkyl substitutes affect the thermal properties of polyimides was examined by differential scanning calorimetry, thermomechanical analyzer, and thermogravimetric analysis techniques. The analytical results demonstrated that the incorporation of alkyl moieties causes a moderate increase in the coefficient of thermal expansion and a slight decrease in thermal stability. Notably, all polymers had a decomposition temperature exceeding 500°C. The glass transition temperature increases markedly when hydrogen atoms at ortho positions on aniline rings are replaced with methyl groups, but decreases with growing alkyl side group size. The dielectric measurements show that the polymer possessing a large alkyl side group would have the lower dielectric value. © 2006 Wiley Periodicals, Inc. J Appl Polym Sci 100: 4672–4678, 2006     

Studies on thermal degradation kinetics and dielectric properties of polyether imide foam/nanosilica-based nanocomposites

ABSTRACT

In this paper, polyether imide (PEI) having properties such as a high glass transition temperature of 216°C, high heat resistance, high flame resistance, low smoke generation and a high melting point within the range of 400°C, having low thermal conductivity and low dielectric constant was chosen to be a polymeric foam. Water vapor-induced phase separation method was used to prepare PEI foams. PEI foams were reinforced with nano-silica (weight 1, 3 and 5%) in order to alter the dielectric properties, thermal conductivity and degradation kinetics of foamed polymer. The tested samples showed a reduction in dielectric constant than that of solid PEI but at a higher loading, it showed a higher value due to threshold percolation and a reduction in thermal conductivity was observed for foamed PEI. From thermogravimetric analysis, we can conclude that PEI with 3% filler loading showed better thermal stability compared to other PEI foam compositions.     

Sb‐intercalated layered double hydroxides–poly(vinyl chloride) nanocomposites: Preparation,characterization, and thermal stability

In this study, a novel ‐intercalated layered double hydroxide (Sb‐LDH) was prepared by simultaneous recovering of LDH structures and intercalation of into LDH layers. The prepared Sb‐LDH composites remain the hydrotalcite structure with layered geometry and show higher thermal property than that of LDH. When applied to poly(vinyl chloride) (PVC) composites, Sb‐LDH showed limited thermal stability for PVC at the early stage of thermal and thermooxidative degradation processes. However, Sb‐LDH could retard the thermal cracking of the carbonaceous conjugated polyene of PVC which may hinder further degradation, and the moderate amount of Sb‐LDH (1, 2, and 5 wt %) in PVC resin can retard the process of decarbonation and enhance char formation. Sb‐LDH also promoted the transparency of PVC but darkened the color. With the advantages of transparency promotion, high temperature resistance, and long‐term stability, the prepared Sb‐LDH is a potential thermal stabilizer for PVC resins. © 2015 Wiley Periodicals, Inc. J. Appl. Polym. Sci. 2015 , 132, 42524.     

Synthesis and characterization of novel low‐dielectric cyanate esters. II

A novel cyanate ester, 2,6‐dimethyl phenol dipentene cyanate ester (DPCY), was successfully synthesized from cyanogen bromide with 2,6‐dimethyl phenol dipentene novolac, which was synthesized from dipentene and 2,6‐dimethyl phenol. For the purpose of increasing the mobility of residual DPCY during the final stage of curing and achieving a complete reaction of cyanate groups, a small quantity of a monofunctional cyanate ester, 4‐tert‐butyl phenol cyanate ester, was added to DPCY to form a cyanate ester copolymer. The thermal properties of the cured cyanate ester resins were studied by dynamic mechanical analysis, dielectric analysis, and thermogravimetric analysis. These data were compared with those of the commercial bisphenol A cyanate ester system. The cured modified cyanate ester exhibited a dielectric constant of 2.59–2.50, a dissipation factor of 0.0055–0.0089, and moisture absorption of 0.91–1.17%; these values were all lower than those of the as‐cured bisphenol A dicyanate system. © 2004 Wiley Periodicals, Inc. J Appl Polym Sci 95: 369–379, 2005     

Hyperbranched-polysiloxane-based hyperbranched polyimide films with low dielectric permittivity and high mechanical and thermal properties

A series of hyperbranched polysiloxane (HBPSi)-based hyperbranched polyimide (HBPI) films with low dielectric permittivity and multiple branched structures are fabricated by copolymerizing 2,4,6-triaminopyrimidine (TAP) with 4,4′-(hexafluoroisopropylidene)diphthalic anhydride, 4,4′-diaminodiphenyl ether, and HBPSi via the two-step polymerization method. The dielectric permittivity of HBPSi hyperbranched polyimide films decreases with increasing TAP fraction, namely, from 3.28 for sample PI-1 to 2.80 for PI-4, mainly owing to the enlarged free volume created by the incorporation of multiple branched structures. Moreover, HBPSi HBPI possesses desirable solubility and good mechanical properties and thermal stability. PI-4 not only has low dielectric permittivity (2.80, 1 MHz), excellent solubility (soluble in several common organic solvents), and remarkable thermal properties (glass-transition temperature of 273 °C, 5% weight loss temperature of 498 °C in N₂ and 486 °C in O₂), but it also demonstrates admirable mechanical properties with a tensile strength of 103 MPa, elongation at break of 7.3%, and a tensile modulus of 2.16 GPa. HBPSi HBPI might have potential applications in interlayer dielectrics and other microelectronics fields. © 2019 Wiley Periodicals, Inc. J. Appl. Polym. Sci. 2019 , 136, 47771.     

Synthesis,characterization, and properties of a polyhedral oligomeric octadiphenylsulfonylsilsesquioxane

A novel polyhedral oligomeric octadiphenylsulfonylsilsesquioxane (ODPSS) was synthesized from octaphenylsilsesquioxane and benzenesulfonyl chloride via a Friedel–Crafts reaction with a high yield. ODPSS was identified by Fourier transform infrared spectroscopy, ¹H‐NMR, ¹³C‐NMR, ²⁹Si‐NMR, matrix‐assisted laser desorption/ionization time‐of‐flight mass spectrometry (MALDI–TOF MS), wide‐angle X‐ray diffraction, and elemental analysis to be a kind of polyhedral oligomeric silsesquioxane of a T₈R₈ structure. ODPSS exhibited superior thermal stability according to thermogravimetric analysis. Its initial thermal decomposition temperature (T_onset) was at 491°C in air and 515°C in nitrogen. Thermal and mechanical properties of epoxy resin (EP) composites with ODPSS added were studied by differential scanning calorimetry and tensile testing. The results show that the incorporation of ODPSS at a low loading content not only improved the glass‐transition temperature of the EP composites but also enhanced their tensile strength. © 2014 Wiley Periodicals, Inc. J. Appl. Polym. Sci. 2014 , 131, 40892.     

Synthesis,characterization and dielectric properties of nickel-based polyoxometalate/polyurethane composites

The aim of this study was to synthesis, characterization and investigation of the influence of the polyoxometalate concentrations (1, 3, 5 and 10 wt%) on chemical, thermal, physical and morphological properties of nickel-based polyoxometalate/polyurethane composite (Ni-POM/PU) materials. Firstly, nickel-based polyoxometalate (Ni-POM) compound has been synthesized and characterized through various spectroscopic techniques. Synthesized Ni-POM compounds have been used for preparation of polyurethane composites as a reinforcement. Three different Ni-POM/PU composites containing Ni-POM were prepared by solution mixing and casting techniques. The chemical structure and morphology of prepared Ni-POM/PU composite samples were confirmed by Fourier transform infrared spectroscopy (FTIR), elemental analysis and SEM techniques. Effects of Ni-POM on thermal stability, glass transition temperature, optical transparency, hydrophilicity and physical properties of polyurethane composites were examined. Thermal stabilities and glass temperatures of the materials have been checked by differential thermal analysis (DTA), thermogravimetric analysis (TGA) and differential scanning calorimeter (DSC). The SEM results confirmed the highly porous structure and the formation of Ni-POM structures in the polymer matrix. Synthesized composites showed high chemical stability, good processability, and low Tg values. The dielectric properties of the prepared Ni-POM/polyurethane composites were also investigated at room temperature. These results displayed that the dielectric constant of the POM/polyurethane composites decreased with the increase of the Ni-POM content in polymeric matrix.