An efficient fully bio‐based reactive diluent for epoxy thermosets: 2‐[(Oxiran‐2‐ylmethoxy) methyl] furan versus a petroleum‐based counterpart

Furfuryl alcohol and bio‐based epichlorohydrin were used to prepare a fully bio‐based reactive diluent, 2‐[(oxiran‐2‐ylmethoxy) methyl] furan (FOM). After spectral characterization, FOM was blended with epoxy resin, diglycidylether bisphenol A (DGEBA), at different ratios for reducing the viscosity. For a comparison, Cardura (one of the most common commercial reactive diluents), was separately incorporated to DGEBA. Amine‐curing process of the blends was recorded by FTIR and DSC. Similar trends of curing progression for DGEBA containing the reactive diluents were observed. Thermogravimetric analysis and dynamic mechanical thermal analysis, mechanical (hardness, adhesion, and stress–strain) and morphological properties were also investigated to study characteristics of the epoxy matrices formulated with FOM or Cardura. It was concluded that FOM could be considered as an efficient reactive diluent in formulations of polymer composites, structural adhesives and surface coatings based on epoxy resins. © 2017 Wiley Periodicals, Inc. J. Appl. Polym. Sci. 2017 , 134, 44957.     

Modeling the chemorheological behavior of epoxy/liquid aromatic diamine for resin transfer molding applications

The analysis of the chemorheological behavior of an epoxy prepolymer based on a diglycidylether of bisphenol‐A (DGEBA) with a liquid aromatic diamine (DETDA 80) as a hardener was performed by combining the data obtained from Differential Scanning Calorimetry (DSC) with rheological measurements. The kinetics of the crosslinking reaction was analyzed at conventional injection temperatures varying from 100 to 150°C as experienced during a Resin Transfer Molding (RTM) process. A phenomenological kinetic model able to describe the cure behavior of the DGEBA/DETDA 80 system during processing is proposed. Rheological properties of this low reactive epoxy system were also measured to follow the cure evolution at the same temperatures as the mold‐filling process. An empirical model correlating the resin viscosity with temperature and the extent of reaction was obtained to carry out later a simulation of the RTM process and to prepare advanced composites. Predictions of the viscosity changes were found to be in good agreement with the experimental data at low extents of cure, i.e., in the period of time required for the mold‐filling stage in RTM process. © 2006 Wiley Periodicals, Inc. J Appl Polym Sci 102: 4228–4237, 2006     

Modified Cyclohexanone-Formaldehyde Resin as an Epoxy Resin Curing Agent

Cyclohexanone-formaldehyde (CHF) resin was brominated and the brominated CHF (BCHF) was then reacted with excess aromatic diamines. The aminated CHF resins designated as ACHFs (modified ketone resin) were characterized and then applied as epoxy resin curing agents. Thus, the curing of the commercial epoxy resin diglycidil ether of bisphenol-A (DGEBA) by ACHFs was monitored by differential scanning calorimetric (DSC), based on the the DSC scans, the glass fiber-reinforced composites of DGEBA-ACHF systems were prepared and characterized by chemical resistivity and mechanical properties.     

Curing kinetics study of an epoxy resin system for T800 carbon fiber filament wound composites by dynamic and isothermal DSC

Curing kinetics of DGEAC/DDM/DETDA/DGEB epoxy resin system was studied using dynamic and isothermal differential scanning calorimetry (DSC) for the preparation of T800 carbon fiber filament wound composites. In dynamic experiment, four kinds of epoxy resin systems were studied. Curing characteristics, such as curing range and curing temperatures of the epoxy resin system with mixed hardeners (DGEAC/DDM/DETDA), were found lying within those of the two epoxy resin systems with a single hardener (DGEAC/DDM, DGEAC/DETDA). The addition of reactive diluter (DGEB) caused increase in curing range and exothermic heat. In addition, the activation energies calculated by the isoconversional method of all four resin systems decreased to the minimum value in the early stage due to the autocatalytic role of hydroxyl groups in the curing reaction and then increased due to the increased viscosity and crosslink of epoxy systems. The addition of reactive diluter led to the decrease in activation energies on the initial stage (conversion = 0.1–0.3). In isothermal experiment, a series of isothermal DSC runs provided information about the curing kinetics of the DGEAC/DDM/DETDA/DGEB system over a wide temperature range. The results showed that the isothermal kinetic reaction of the epoxy resin followed an autocatalytic kinetic mechanism. The autocatalytic kinetic expression chosen in this work was suitable to analyze the curing kinetics of this system. © 2007 Wiley Periodicals, Inc. J Appl Polym Sci, 2008     

Phase Separation of Poly(ether sulfone imide) Modified Epoxy Resins

Amine terminated poly(ether sulfone imide) (PESI) with various imide and ethersulfone contents but similar polymer molecular weights were blended with diglycidyletherbisphenol-A (DGEBA) and cured with diaminodiphenylsulfone (DDS). The imide group, a tertiary amine, is a catalyst of the curing reaction of DGEBA with DDS, but it is poorly compatible with uncured epoxy resin. The ethersulfone group is not a catalyst of the curing reaction of DGEBA with DDS, but it has a similar chemical structure as DDS and is compatible with epoxy resin while it is at a low degree of curing. Since PESIs used in this study had similar molecular weights, increasing imide content of PESI would reduce ethersulfone content. The influence of imide and ethersulfone contents of PESI on the phase separation and curing reaction of DGEBA/DDS/PESI blend was investigated using differential scanning calorimetry (DSC), time-resolved light scattering (TRLS), and polarized optical microscopy (POM). Though the imide group has a catalysis effect on the curing reaction of DGEBA with DDS, however, its poor compatibility with epoxy resin retards the curing reaction. Our experimental results revealed the morphology of the cured blends and the curing behavior was a compromise result of catalysis and compatibility of PESI with epoxy resin.     

Layered silicate nanocomposites based on various high‐functionality epoxy resins: The influence of an organoclay on resin cure

The influence of an organically modified clay on the curing behavior of three epoxy systems widely used in the aerospace industry and of different structures and functionalities was studied. Diglycidyl ether of bisphenol A (DGEBA), triglycidyl p‐amino phenol (TGAP) and tetraglycidyl diamino diphenylmethane (TGDDM) were mixed with an octadecyl ammonium ion modified organoclay and cured with diethyltoluene diamine (DETDA). The techniques of dynamic mechanical thermal analysis (DMTA), chemorheology and differential scanning calorimetry (DSC) were applied to investigate gelation and vitrification behavior, as well as catalytic effects of the clay on resin cure. While the formation of layered silicate nanocomposite based on the bifunctional DGEBA resin has been previously investigated to some extent, this paper represents the first detailed study of the cure behavior of different high performance, epoxy nanocomposite systems.     

Cure kinetics and morphology of blends of epoxy resin with poly (ether ether ketone) containing pendant tertiary butyl groups

The cure kinetics and morphology of diglycidyl ether of bisphenol-A (DGEBA) epoxy resin modified with a poly (ether ether ketone) based on tertiary butyl hydroquinone (PEEK-T) cured with diamino diphenyl sulphone (DDS) were investigated using differential scanning calorimetry (DSC), scanning electron microscopy (SEM) and dynamic mechanical thermal analysis (DMTA). The results obtained from DSC were applied to autocatalytic and diffusion controlled kinetic models. The reaction mechanism broadly showed autocatalytic behaviour regardless of the presence of PEEK-T. At higher PEEK-T concentration, more diffusion controlled mechanism was observed. The rate of curing reaction decreased with increase in thermoplastic content and also with the lowering of curing temperature. The activation energies of the blends are higher than that of the neat resin. The blends showed a phase separated morphology. The dispersed phase showed a homogeneous particle size distribution. The T_g of the neat resin decreased with the decrease in cure temperature. Two T_g's corresponding to the epoxy rich and thermoplastic rich phases were observed in the dynamic mechanical spectrum. The storage modulus of 10 and 20 phr PEEK-T blends are found to be greater than the neat resin.     

Improvement of Elastic Modulus and Thermal Stability of Epoxy Resin Using New Curing Agents

New curing agents 2,5-diamino-1,3,4-thiadiazole (DATD) and N-(4-hydroxybenzal) N'(4′-hydroxyphenyl) thiourea (HHPT) were synthesised and characterized using FT-IR, 1H-NMR and 13C-NMR analysis. The curing reactions were studied for the epoxy resin diglycidyl ether of bisphenol-A (DGEBA) using new curing agents along with the conventional aromatic diamine 4,4′-diamino diphenyl methane (DDM) for comparison purpose. The curing profiles of DDM, DATD and DATD/HHPT towards DGEBA were examined by Differential Scanning Calorimetry (DSC). Elastic modulus and thermal stability of the cured resins were evaluated using DMA and TGA analysis. When compared with DDM and DATD, the DATD/HHPT curing system accelerated the curing rate due to the presence of phenol molecules in the HHPT. Furthermore, the DATD/HHPT-cured epoxy resin demonstrated higher elastic modulus along with better thermal stability.     

Epoxy resin containing the poly(sily ether): Preparation,morphology, and mechanical properties

The poly(sily ether) with pendant chloromethyl groups (PSE) was synthesized by the polyaddition of dichloromethylsilane (DCM) and diglycidylether of bisphenol A (DGEBA) with tetrabutylammonium chloride (TBAC) as a catalyst. This polymer was miscible with diglycidyl ether of bisphenol A (DGEBA), the precursor of epoxy resin. The miscibility is considered to be due mainly to entropy contribution because the molecular weight of DGEBA is quite low. The blends of epoxy resin with PSE were prepared through in situ curing reaction of diglycidyl ether of bisphenol A (DGEBA) and 4,4′‐diaminodiphenylmethane (DDM) in the presence of PSE. The DDM‐cured epoxy resin/PSE blends with PSE content up to 40 wt % were obtained. The reaction started from the initial homogeneous ternary mixture of DGEBA/DDM/PSE. With curing proceeding, phase separation induced by polymerization occurred. PSE was immiscible with the 4,4′‐diaminodiphenylmethane‐cured epoxy resin (ER) because the blends exhibited two separate glass transition temperatures (T_gs) as revealed by the means of differential scanning calorimetry (DSC) and dynamic mechanical analysis (DMA). SEM showed that all the ER/PSE blends are heterogeneous. Depending on blend composition, the blends can display PSE‐ or epoxy‐dispersed morphologies, respectively. The mechanical test showed that the DDM‐cured ER/PSE blend containing 25 wt % PSE displayed a substantial improvement in Izod impact strength, i.e., epoxy resin was significantly toughened. The improvement in impact toughness corresponded to the formation of PSE‐dispersed phase structure. © 2003 Wiley Periodicals, Inc. J Appl Polym Sci 89: 505–512, 2003     

Cure kinetics of an epoxy/liquid aromatic diamine modified with poly(ether imide)

The cure kinetics and mechanisms of an epoxy oligomer based on diglycidyl ether of bisphenol A (DGEBA), polymerized with a liquid aromatic diamine based on diethyl toluene diamine (DETDA 80), and its blends with poly(ether imide) (PEI) at concentrations of 0–15 wt % were studied with differential scanning calorimetry under dynamic and isothermal conditions. The kinetic analyses were performed with a phenomenological approach. The reaction mechanism of the blends remained the same as that of the neat epoxy. However, the addition of PEI had a marked effect on the cure kinetics in the DGEBA/DETDA 80 system. The rate of reaction decreased with an increase in the thermoplastic content. Diffusion control was incorporated to describe the cure behavior of the blends in the latter stages. Greater diffusion control was observed as the PEI concentration increased and the cure temperature decreased. Polymer blends based on this epoxy/liquid aromatic diamine had not been previously studied from a kinetic viewpoint. © 2005 Wiley Periodicals, Inc. J Appl Polym Sci 96: 660–672, 2005     

Miscibility,crystallization behavior and specific intermolecular interactions in thermosetting polymer blends of novolac epoxy resin and polyethylene glycol

Thermosetting polymer blends of novolac epoxy resin (EPN) and polyethylene glycol (PEG) were studied. The miscibility and crystallization behavior of the blends before curing reaction were investigated by polarized optical microscopy and differential scanning calorimetry (DSC). Overall uncured blend compositions were homogeneous in amorphous state. Single composition‐dependent glass‐transition temperature (T_g) for each blend could be observed, and the experimental T_g's of blends with EPN content ≥40 wt% could be explained well by the Gordon–Taylor equation. Thermal properties of blends cured with 4,4′‐diaminodiphenylmethane were also determined by DSC. The capability of PEG to crystallize in cured blends was different from that in uncured ones because of the topological effect of highly crosslinking structure. On the basis of Fourier transform infrared spectroscopy results, it was judged that there were intermolecular hydrogen‐bonding interactions between EPN and PEG in both cured and uncured blends. POLYM. ENG. SCI., 2008. © 2008 Society of Plastics Engineers     

Preformed microspherical inclusions for rheological control and physical property modification of epoxy resins

Epoxy microspheres, with average diameters in the order of 4–5 μm, were first produced as insoluble gel resulting from the reactions of a bisphenolic epoxy resin with an aromatic hardener in solution. They were then used as reactive flow modifiers and toughening agents for bisphenolic epoxy resins with same chemical composition. Thermal analysis, rheological measurements, and impact tests were performed to assess their ability to modify the viscosity of the uncured resin and to determine the effects on the cured resins with respect to the glass transition temperature and impact strength. Two similar epoxy systems modified with the addition of different amounts of microspheres preserve the glass transition temperature of the cured unmodified epoxy. The addition of microspheres is responsible for secondary transition. The addition of a small fraction of microspheres does not affect the reactivity of the epoxy resin, while the inclusion of a higher content leads to a noticeable reduction in the gel time of the epoxy systems, indicating that microspheres are not inert fillers. Finally, a limited enhancement of the toughness of the epoxy resin was observed, as a consequence of strong interactions between the matrix and the microspheres. © 2006 Wiley Periodicals, Inc. J Appl Polym Sci 100: 748–757, 2006     

Effect of microencapsulated curing agents on the curing behavior for diglycidyl ether of bisphenol A epoxy resin systems

Microcapsules containing a curing agent, 2‐phenyl imidazole (2PZ), for a diglycidyl ether of bisphenol A (DGEBA) epoxy resin were prepared by a solid‐in‐oil‐in‐water emulsion solvent evaporation technique with poly(methyl methacrylate) (PMMA) as a polymeric wall. The mean particle size of the microcapsules and the concentration of 2PZ were about 10 μm and nearly 10 wt %, respectively. The onset cure temperature and peak temperature of the DGEBA/2PZ–PMMA microcapsule system appeared to increase by nearly 30 and 10°C, respectively, versus those of the DGEBA/2PZ system because of the increased reaction energy of curing. The former could take more than 3 months at room temperature, whereas the latter was cured after only a week. The values of the reaction order (a curing kinetic parameter) for DGEBA/2PZ and DGEBA/2PZ–PMMA microcapsules were quite close, and this showed that the curing reactions of the two samples proceeded conformably. The curing mechanism was investigated, and a two‐step initiation mechanism was considered: the first was assigned to adduct formation, whereas the second was due to alkoxide‐initiated polymerization. The glass‐transition temperature of DGEBA/2PZ was 165.2°C, nearly 20°C higher than the glass‐transition temperatures of DGEBA/2PZ–PMMA microcapsules and DGEBA/2PZ/PMMA microspheres, as determined by differential scanning calorimetry measurements. © 2007 Wiley Periodicals, Inc. J Appl Polym Sci, 2008     

Rheology and curing characteristics of epoxy–clay nanocomposites

Diglycidyl ethers of bisphenol‐A (DGEBA) epoxy resin, filled separately with organoclay (OC) and unmodified clay (UC), were synthesized at room temperature and at high temperature (80 °C) by mechanical shear mixing. The room temperature curing (RTC) and high temperature curing (HTC) were carried out with the addition of triethylene tetramine (TETA) and diaminodiphenylmethane (DDM) curing agents respectively. The OC used was alkyl ammonium modified montmorillonite (MMT) and the UC was Na⁺‐MMT. X‐ray diffraction (XRD) and transmission electron microscopy (TEM) were used to study the structure and morphology of the nanocomposites. The influence of OC and UC particles on rheology and curing characteristics was studied. The rate of increase in viscosity was higher for OC‐filled resin than that of the UC‐filled resin. The curing study showed that the amine ions of the OC aided the polymerization process and favoured the curing at low temperature over the curing of unfilled epoxy resin. The tensile properties were enhanced for epoxy filled with OC particles rather than those filled with UC particles. Copyright © 2005 Society of Chemical Industry     

Epoxy toughening using low viscosity liquid diglycidyl ether of ethoxylated bisphenol‐A

Two new epoxy resins, diglycidyl ether of ethoxylated bisphenol‐A (BPA) with two and six oxyethylene units (DGEBAEO‐2 and DGEBAEO‐6) were synthesized and characterized. DGEBAEO‐6 was used to toughen the conventional epoxy resin diglycidyl ether of BPA (DGEBA). The blends of DGEBA with different amounts of DGEBAEO‐6 were cured by 4,4′‐diamino diphenylmethane (DDM), and their thermal and mechanical properties were examined. The DSC and DMA results presented that DGEBA/DGEBAEO‐6 blends exhibited a homogenous phase, and the glass transition temperature of the blends was inversely proportional to the content of DGEBAEO‐6. The impact strength of the cured blends was directly proportional to the content of DGEBAEO‐6, and reached five times higher than that of the neat DGEBA when 50 wt % DGEBAEO‐6 was used; the same impact strength was achieved for DDM‐cured DGEBAEO‐2. The viscosities of the blends decreased with increasing the DGEBAEO‐6 content, whereas the tensile and flexural strength and the thermal stabilities were not obviously affected. Scanning electron microscopic results confirmed that the plastic deformation inducing by the incorporated flexible oxyethylene units was responsible for the toughness improvement. © 2011 Wiley Periodicals, Inc. J Appl Polym Sci, 2012     

Synthesis,characterization, and polymerization of a novel benzoxazine based on diethyltoluenediamine

A novel aromatic diamine‐based benzoxazine monomer (PDETDA) was successfully prepared from diethyltoluenediamine (DETDA), phenol, and paraformaldehyde through a simple one‐step solvent‐less method. The structure of PDETDA was confirmed by FTIR, ¹H NMR, and ¹³C NMR. The curing behavior of PDETDA was studied by DSC, FTIR, and rheological measurement. The results showed that the alkyl substituents on the benzene ring in DETDA not only facilitated the synthesis of PDETDA by effectively hindering the formation of triazine network, but also endowed PDETDA with the advantage of low viscosity (1 Pa s at 90°C). However, steric hindrance of the substituents made PDETDA difficult to form a crosslinked network through ring‐opening polymerization, and therefore only oligomers and noncrosslinked polymers were obtained. The curing kinetics of PDETDA was studied by nonisothermal DSC, and the results revealed that the curing of PDETDA displayed autocatalytic characteristic. © 2015 Wiley Periodicals, Inc. J. Appl. Polym. Sci. 2015 , 132, 41920.     

Effect of wood on the curing behavior of commercial phenolic resin systems

Differential scanning calorimetry (DSC) was used to study the effect of wood on the curing behavior of two types of commercial oriented‐strand‐board phenolic resins. DSC analysis showed that the curing behavior of the core resin differed significantly from that of the face resin in terms of the peak shape, peak temperature, and activation energy. The addition of wood to the resins moved the two separated peaks in the DSC curves of the core resin adjacent to each other. It also accelerated the addition reactions in the curing processes of both the core and face resins. The two peaks in the DSC curves were the result of the high pH values of the resins. These two peaks became either jointed together or overlapped when the pH value of the resin was reduced. Wood also reduced the activation energies for both the core and face resins by decreasing the pH values of the curing systems. Moreover, the effects of wood on the curing behavior of the resins among the five species studied were similar. The lowest activation energy for a phenolic resin probably appeared at pH 10–11 under alkaline conditions. © 2004 Wiley Periodicals, Inc. J Appl Polym Sci 95: 185–192, 2005     

Blends of epoxy–amine resins with poly(phenylene oxide) as processing aids and toughening agents: I. Uncured systems

The effect of two different bisphenol‐A‐based diepoxides—nearly pure DGEBA340 and a DGEBA381 oligomer—and an aromatic diamine curative (MCDEA) on the solubility and processability of poly(phenylene oxide) (PPO) was studied. The solubility parameters of the diepoxies and the curative calculated from Fedors's method suggest miscibility of PPO with the components, and this was observed at the processing temperature; however, some of the blends were not transparent at room temperature, indicating phase immiscibility and/or partial PPO crystallization. The steady shear and dynamic viscosities of the systems agreed well with the Cox–Merz relationship and the logarithmic viscosities decreased approximately linearly with increasing amounts of DGEBA381, DGEBA340 or MCDEA, thus causing a processability enhancement of the PPO. The dynamic rheology of intermediate PPO:DGEBA compositions at 200 °C showed gel‐like behaviour. Dynamic mechanical analysis of blends with varying PPO:DGEBA ratios showed that the main glass transition temperature (T_g) of the blends decreased continuously with increasing epoxy content, with a slightly higher plasticizing efficiency being exhibited by DGEBA340 compared to DGEBA381. However, blends with 50 and 60 wt% PPO had almost identical T_g due to the phase separation of the former blends. The blends of MCDEA and PPO were miscible over the concentration range investigated and T_g of the blends decreased with increasing MCDEA concentration. © 2013 Society of Chemical Industry     

Synthesis and characterization of methacrylated star‐shaped poly(lactic acid) employing core molecules with different hydroxyl groups

A set of novel bio‐based star‐shaped thermoset resins was synthesized via ring‐opening polymerization of lactide and employing different multi‐hydroxyl core molecules, including ethylene glycol, glycerol, and erythritol. The branches were end‐functionalized with methacrylic anhydride. The effect of the core molecule on the melt viscosity, the curing behavior of the thermosets and also, the thermomechanical properties of the cured resins were investigated. Resins were characterized by Fourier‐transform infrared spectroscopy, ¹³C‐NMR, and ¹H‐NMR to confirm the chemical structure. Rheological analysis and differential scanning calorimetry analysis were performed to obtain the melt viscosity and the curing behavior of the studied star‐shaped resins. Thermomechanical properties of the cured resins were also measured by dynamic mechanical analysis. The erythritol‐based resin had superior thermomechanical properties compared to the other resins and also, lower melt viscosity compared to the glycerol‐based resin. These are of desired characteristics for a resin, intended to be used as a matrix for the structural composites. Thermomechanical properties of the cured resins were also compared to a commercial unsaturated polyester resin and the experimental results indicated that erythritol‐based resin with 82% bio‐based content has superior thermomechanical properties, compared to the commercial polyester resin. Results of this study indicated that although core molecule with higher number of hydroxyl groups results in resins with better thermomechanical properties, number of hydroxyl groups is not the only governing factor for average molecular weight and melt viscosity of the uncured S‐LA resins. © 2017 Wiley Periodicals, Inc. J. Appl. Polym. Sci. 2017 , 134, 45341.     

The effects of fillers and extenders on the cure properties of phenol–formaldehyde resin as determined by the application of thermal techniques

The techniques of dynamic mechanical thermal analysis (DMTA) and differential scanning calorimetry (DSC) were used to examine the effects of the addition of various fillers and extenders (clay, pecan shell flour, and wheat flour) on the curing mechanism of a phenolformaldehyde resol. The DMTA results indicated that the curing process was unaffected by any of the additives. The DSC thermograms showed a single exothermic peak that was not influenced to a great extent by the fillers or extenders. Comparison of viscosity measurements and gel time determinations showed slight differences in the physical properties of the uncured resins.