GaAlAs/GaAs双异质结发光管中的深能级

本文用DLTS谱仪和单脉冲瞬态电容技术测量了光通信用GaAlAs/GaAs双异质结发光管中的深能级,对有源区掺Si和掺Ge的相同结构器件,均测得有多子陷阱存在,其能级位置分别为E_C—E_D≈0.29eV和E_T—E_V≈0.42eV。比较了外延系统中氧含量变化对有源区掺Si器件深能级的影响,以及有源区EL图象中的DSD与深能级关系,结果表明外延系统中氧含量对深能级有明显影响,而EL图象中DSD的出现率与深能级无明显关系。     

γ辐照对InGaAsP/InP双异质结发光管特性的影响

本文研究了γ辐照对光通信用1.3μm InGaAsP/InP双异质结发光管特性的影响,结果表明:在辐照剂量1×10~5—1×10~7rad范围内,辐照前后器件的光功率和电带宽未发生明显变化;当辐照剂量>1×10~7rad后,器件的光功率下降,电带宽上升。器件在辐照前后的l-V特性和EL图象未发生变化。用少子寿命的变化度(τ/τ_0)讨论了有关结果。     

掺Mn基区InGaAsP/InP双集电区异质光敏晶体管

为了用液相外延法制出高速、高增益异质光敏晶体管,采用了新型的双集电区结构,并且采用Mn作为p型掺杂剂,以代替常用的Zn或Cd制作p~+-n~-集电结.制出的台面型HPT的典型光增益为144;在 80 ps Gaussian光脉冲作用下,其输出脉冲上升时间为 400ps.半峰宽为1.2ns.     

InGaAsP/InP准平面异质结双极晶体管及其与光器件的集成

本文采用计算机辅助分析等方法,讨论了InGaAs/InP异质结双极晶体管(HBT)结构参数与其性能的关系.在此基础上,提出了一种准平面、双集电区HBT,及其相应的制作工艺.初步测试了器件的性能,就其与材料质量的关系作了讨论.文章还提出和制作了一种采用这种HBT为电子器件的光电子集成电路(OEIC).     

在InGaAsP/InP双异质结构中的光弹效应及其对侧向光的限制作用

从理论上计算了厚度为110nm的W0.95Ni0.05金属薄膜应变条在InGaAsP/InP双异质结构中形成的应力场分布,及由应力场分布引起的折射率变化.在W0.95Ni0.05金属薄膜应变条下半导体中0.2-2μm深度范围内,由应变引起条形波导轴中央的介电常数ε相应增加2.3×10-1-2.2×10-2(2μm应变条宽)和1.2×10-1-4.1×10-2(4μm应变条宽).同时,测量了由W0.95Ni0.05金属薄膜应变条所形成的InGaAsP/InP双异质结光弹效应波导结构导波的近场光模分布.从理论计算和实验结果两方面证实了InGaAsP/InP双异质结光弹效应波导结构对侧向光具有良好的限制作用.     

在InGaAsP/InP双异质结构中的光弹效应及其对侧向光的限制作用

从理论上计算了厚度为 110 nm的 W0 .95 Ni0 .0 5 金属薄膜应变条在 In Ga As P/ In P双异质结构中形成的应力场分布 ,及由应力场分布引起的折射率变化 .在 W0 .95 Ni0 .0 5 金属薄膜应变条下半导体中 0 .2— 2μm深度范围内 ,由应变引起条形波导轴中央的介电常数 ε相应增加 2 .3× 10 - 1— 2 .2× 10 - 2 (2 μm应变条宽 )和 1.2× 10 - 1— 4.1× 10 - 2(4μm应变条宽 ) .同时 ,测量了由 W0 .95 Ni0 .0 5 金属薄膜应变条所形成的 In Ga As P/ In P双异质结光弹效应波导结构导波的近场光模分布 .从理论计算和实验结果两方面证实了 In Ga As P/ In P     

InGaAsP／InP系选择性刻蚀技术

比较了用于ＩｎＧａＡｓＰ／ＩｎＰ系的几种腐蚀液的选择性刻蚀效果并给出了最佳选择性刻蚀条件。     

Elastic and plastic contributions to X-ray Line broadening of InGaAsP/InP Heterostructures

The coherency state of MOCVD grown InGaAsP/InP double-heterostructure wafers was examined and their effects on the structural properties were determined in this study. Lattice mismatches were measured using {511} asymmetric and (400) symmetric x-ray reflections. The chemical lattice misfit and the elastic strain were also calculated. Misfit dislocations were examined by both x-ray topography and photoluminescence imaging. The x-ray full width at half maximum (FWHM) varied with the degree of mismatch. The largest FWHM was obtained for samples containing the misfit dislocations. It was found that FWHM is influenced not only by the plastic deformation, but also by the elastic strain. To model the dependence of the FWHM, the radius of curvature was measured, and its contribution to the x-ray line broadening was calculated. Also, the contribution from misfit dislocations was taken into account. This model assumes that the dislocations are planar and interact weakly with each other. Good agreement between measured and calculated values was obtained. Thus, it is concluded that the major contribution to x-ray line broadening ofelastically strained sample is the lattice curvature induced by misfit strain, and that the dominant factor affecting x-ray FWHM ofplastically deformed sample is lattice relaxation induced by misfit dislocation.     

A novel processing technique to fabricate planar InGaAsP/InP electroabsorption waveguide modulators

A novel processing technique has been developed to fabricate planar electroabsorption waveguide modulators in compound semiconductor heterostructures. The lateral confinement of light is achieved by introducing controllable, reproducible, and stable stresses into semiconductor heterostructures using WNi surface stressor stripes, which also serve as electrodes for the waveguide modulators. Self-aligned helium implantation is employed to achieve electrical isolation using the Stressors as the templates for the ion masks. An increase as large as 33000 times has been obtained in the dc resistance between the neighboring waveguide modulators 25 μm apart. Propagation loss of 1.7 dB/cm is observed in the photoelastic waveguides at a wavelength of 1.53 μm following the He implantation. A post-implant thermal annealing at 310°C for 40 min increases the dc resistance between the neighboring devices to the maximum value, and at the same time reduces the optical loss to its value before ion implantation (less than 1 dB/cm). Using a combination of the photoelastic effect and helium implantation, planar InGaAsP/InP Franz-Keldysh-effect waveguide modulators 430 μm long with a 10 dB extinction ratio at 3 V for the TM mode have been fabricated. Planar electroabsorption quantum-confined Stark effect waveguide modulators have also been demonstrated. This planar device processing technique may prove valuable in future photonic integrated circuit technology.     

InGaAsP／InP异质结构材料组分及结构的XPS测定

采用Ｘ射线光电子能谱（ＸＰＳ）对ＩｎＧａＡｓＰ／ＩｎＰ异质结构ＭＯＣＶＤ外延晶片作了表面薄层元素、组分定性、定量和深度分布分析。利用ＸＰＳ组分定量数据与带隙和组分量数据与晶体常数的经验公式计算带隙、晶格常数和失配率，并与光压谱（ＰＶＳ）测定的带隙值和Ｘ射线双晶衍射（ＤＣＤ）测定的失配率作了比较，比较结果是满意的。实验和分析表明，在研究ＭＯＣＶＤ外延膜材料表面组分和表面点阵结构方面。     

全固源分子束外延生长InP和InGaAsP

在国产分子束外延设备的基础上 ,利用新型三温区阀控裂解源炉 ,对 In P及 In Ga As P材料的全固源分子束外延 (SSMBE)生长进行了研究。生长了高质量的 In P外延层 ,表面缺陷密度为 65cm- 2 ,非故意掺杂电子浓度约为 1× 1 0 16cm- 3.In P外延层的表面形貌、生长速率及 p型掺杂特性与生长温度密切相关 .研究了 In Ga As P外延材料的组分特性 ,发现在一定温度范围内生长温度对 族原子的吸附系数有较大影响 .最后得到了晶格匹配的 In0 .56Ga0 .4 4 As0 .94 P0 .0 6材料 ,低温光致发光谱峰位于 1 50 7nm,FWHM为 9.8me V.     

1．55μm InGaAsP／InPDH激光器中的0．95μm发光带与Auger复合

报道了在１．５５μｍＩｎＧａＡｓＰ／ＩｎＰ激光器中发现的０．９５μｍ波长高能发光峰的一系列实验结果，并通过分析肯定了ＩｎＧａＡｓＰ有源区的Ａｕｓｅｒ复合是造成载流子向两侧ＩｎＰ限制层漏泄的主要原因，也是影响１．５５μｍＩｎＧａＡｓＰ／ＩｎＰＤＨ激光器Ｔ０值的主要因素。