Modeling of polarization charge in N-face InGaN/GaN MQW solar cells

The present work reports on a theoretical study of spontaneous and piezoelectric polarization effects on the photovoltaic characteristics of InGaN/GaN multiple quantum well solar cells. More especially, it will prove that the use of heterostructures with N-face as a surface polarity can further improve the photovoltaic conversion. A new model including piezoelectric polarization is developed. In this paper, a part of simulation is also paid to analyze the dependence of the photocurrent density, the open circuit voltage, the output power and the efficiency versus the In composition and the number of quantum well units. As has been found, a maximum of energy conversion is expected to achieve 19 percent for optimum alloy composition. An attempt to explain the photovoltaic behavior of the solar cells in correlation of obtained results will be attempted.     

Planar 4H- and 6H-SiC p–n diodes fabricated by selective diffusion of boron

Graphite film was used as a protective and selective mask for realizing diffusion of boron in SiC. Secondary ion mass spectroscopy was employed to identify the diffusion profile in SiC. No significant difference between diffusion profiles in 4H-SiC and 6H-SiC was found. Planar p–n diodes with local p-type emitter regions were fabricated in 4H-SiC and 6H-SiC based on this process. The current density versus voltage (J–V) curves of the formed diodes exhibited good rectification characteristics. The 4H-SiC p–n diodes had much lower forward voltage drops and much less temperature dependence in comparison with 6H-SiC p–n diodes.     

380‐nm Ultraviolet Light‐Emitting Diodes with InGaN/AlGaN MQW Structure

In this paper, we demonstrate the capabilities of 380‐nm ultraviolet (UV) light‐emitting diodes (LEDs) using metal organic chemical vapor deposition. The epi‐structure of these LEDs consists of InGaN/AlGaN multiple quantum wells on a patterned sapphire substrate, and the devices are fabricated using a conventional LED process. The LEDs are packaged with a type of surface mount device with Al‐metal. A UV LED can emit light at 383.3 nm, and its maximum output power is 118.4 mW at 350 mA.     

Simulation and experimental results on the forward J–V characteristic of Al implanted 4H–SiC p–i–n diodes

In this work the forward J–V characteristics of 4H–SiC p–i–n diodes are analysed by means of a physics based device simulator tuned by comparison to experimental results. The circular devices have a diameter of 350 μm. The implanted anode region showed a plateau aluminium concentration of 6×10¹⁹ cm⁻³ located at the surface with a profile edge located at 0.2 μm and a profile tail crossing the n-type epilayer doping at 1.35 μm. Al atom ionization efficiency was carefully taken into account during the simulations. The final devices showed good rectifying properties and at room temperature a diode current density close to 370 A/cm² could be measured at 5 V. The simulation results were in good agreement with the experimental data taken at temperatures up to about 523 K in the whole explored current range extending over nine orders of magnitude. Simulations also allowed to estimate the effect of a different p⁺ doping electrically effective profile on the device current handling capabilities.     

红橙光InGaN/GaN量子阱的结构与光学性质研究

采用金属有机物化学气相沉积(MOCVD)技术生长了具有高In组分InGaN阱层的InGaN/GaN多量子阱(MQW)结构,高分辨X射线衍射(HRXRD)ω-2θ扫描拟合得到阱层In含量28%。比较大的表面粗糙度表明有很大的位错密度。室温下光致荧光(PL)研究发现该量子阱发射可见的红橙光,峰位波长在610 nm附近。变温PL(15～300 K)进一步揭示量子阱在低温下有两个发光机制,对应的发射峰波长分别为538 nm和610 nm。由于In分凝和载流子的局域化导致的载流子动力改变,使得量子阱PL发光峰值随温度增加呈明显的"S"变化趋势。     

InGaN/GaN多量子阱蓝光LED电学特性研究

对不同温度(120～363 K)下InGaN/GaN多量子阱(MQW)结构蓝光发光二极管(LED)的电学特性进行了测试与深入的研究.发现对数坐标下I-V特性曲线斜率随温度变化不大.分别用载流子扩散-复合模型和隧道复合模型对其进行计算,发现室温下其理想因子远大于2,并且随着温度的下降而升高;而隧穿能量参数随温度变化不大.这说明传统的扩散-复合载流子输运模型不再适用于InGaN/GaN MQW蓝光LED.分析指出由于晶格失配以及生长工艺的制约,外延层中具有较高的缺陷密度和界面能级密度,导致其主要输运机制为载流子的隧穿.     

InGaN/GaN LEDs with a Si-doped InGaN/GaN short-period superlattice tunneling contact layer

Nitride-based light-emitting diodes (LEDs) with Si-doped n⁺-In_0.23Ga_0.77N/GaN short-period superlattice (SPS) tunneling contact top layer were fabricated. It was found that although the measured specific-contact resistance is around 1 × 10⁻² Ω-cm² for samples with an SPS tunneling contact layer, the measured specific-contact resistance is around 1.5×10⁰ Ω-cm² for samples without an SPS tunneling contact layer. Furthermore, it was found that one could lower the LED-operation voltage from 3.75 V to 3.4 V by introducing the SPS structure. It was also found that the LED-operation voltage is almost independent of the CP₂Mg flow rate when we grow the underneath p-type GaN layer. The LED-output intensity was also found to be larger for samples with the SPS structure.     

408nm InGaN/GaN LED的材料生长及器件光学特性

通过提高InGaN量子阱结构的生长温度,降低量子阱In组分的掺入效率,提高InGaN/GaN量子阱结构生长质量,缩短LED输出波长等手段,实现了紫光LED高效率输出.采用高分辨率X射线双晶衍射、扫描隧道显微镜和光致发光谱技术研究了高温生长InGaN/GaN多量子阱的结构和光学特性.封装后的300μm×300μm LED器件在20mA的注入电流下输出功率为5.2mW,输出波长为408nm.     

408nm InGaN/GaN LED的材料生长及器件光学特性

通过提高InGaN量子阱结构的生长温度,降低量子阱In组分的掺入效率,提高InGaN/GaN量子阱结构生长质量,缩短LED输出波长等手段,实现了紫光LED高效率输出.采用高分辨率X射线双晶衍射、扫描隧道显微镜和光致发光谱技术研究了高温生长InGaN/GaN多量子阱的结构和光学特性.封装后的300μm×300μm LED器件在20mA的注入电流下输出功率为5.2mW,输出波长为408nm.     

InGaN/GaN多量子阱蓝光LED的p-GaN盖层的MOCVD生长研究

利用金属有机物化学气相淀积（MOCVD）生长了InGaN／GaN多量子阱（MQW）蓝光发光二极管（LED）,研究了不同Cp2Mg流量下生长的p-GaN盖层对器件电学特性的影响。结果表明,随着Cp2Mg流量的提高,漏电流升高,并且到达一临界点会迅速恶化;正向压降则先降低,后升高。进而研究相同生长条件下生长的p-GaN薄膜的电学特性、表面形貌及晶体质量,结果表明,生长p-GaN盖层时,Cp2Mg流量过低,盖层的空穴浓度低,电学特性不好;Cp2Mg流量过高,则会产生大量的缺陷,盖层晶体质量与表面形貌变差,使得空穴浓度降低,电学特性变差。因此,生长p-GaN盖层时,为使器件的正向压降与反向漏电流均达到要求,Cp2Mg流量应精确控制。     

InGaN/GaN多量子阱纳米线发光二极管制备及研究

用SiO2纳米图形层作为模板在以蓝宝石为衬底的n-GaN单晶层上制备了InGaN/GaN多量子阱纳米线,并成功实现了其发光二极管器件(LED).场发射扫描电子显微镜(FESEM)的测量结果表明,InGaN/GaN多量子阱纳米线具有光滑的表面形貌和三角形的剖面结构.室温下阴极射线荧光谱(CL)的测试发现了位于461 nm...     

InGaN/GaN multi-quantum-well-based light-emitting and photodetective dual-functional devices

In this study, we fabricated and characterized an InGaN/GaN multi-quantum-well (MQW)-based p-n junction photodetector (PD) for voltage-selective light-emitting and photo-detective applications. The photode-tector exhibits a cutoff wavelength at around 460nm which is close to its electroluminescence (EL) peak position. The rejection ratio was determined to be more than three orders of magnitude. Under zero bias, the responsivity of the device peaks at 371 nm, with a value of 0.068 A/W, corresponding to a 23% quantum efficiency.The overall responsivity gradually rises as a function of reverse bias, which is explained by the enhanced photocarrier collection efficiency.     

AlGaN/GaN/InGaN对称分别限制多量子阱激光器的优化设计

采用一维传递矩阵法模拟计算了AlGaN/GaN/InGaN对称分别限制多量子阱激光器(发射波长为396.6nm)的波导特性.以光限制因子、阈值电流密度和功率效率作为优化参量,获得激光器的优化结构参数为:3周期量子阱In0.02Ga0.98N/In0.15Ga0.85N(10.5nm/3.5nm)作为有源层,90nm In0.1Ga0.9N为波导层,120周期Al0.25Ga0.75N/GaN(2.5nm/2.5nm)为限制层.     

AlGaN/GaN/InGaN对称分别限制多量子阱激光器的优化设计

采用一维传递矩阵法模拟计算了AlGaN/GaN/InGaN对称分别限制多量子阱激光器(发射波长为396.6nm)的波导特性.以光限制因子、阈值电流密度和功率效率作为优化参量,获得激光器的优化结构参数为:3周期量子阱In0.02Ga0.98N/In0.15Ga0.85N(10.5nm/3.5nm)作为有源层,90nm In0.1Ga0.9N为波导层,120周期Al0.25Ga0.75N/GaN(2.5nm/2.5nm)为限制层.     

Low dark current and internal gain mechanism of GaN MSM photodetectors fabricated on bulk GaN substrate

Metal-semiconductor-metal ultraviolet photodetectors are fabricated on low-defect-density homoepitaxial GaN layer on bulk GaN substrate. The dislocation density of the homoepitaxial layer characterized by cathodoluminescence mapping technique is ∼5 × 10⁶ cm⁻². The photodetector with a high UV-to-visible rejection ratio of up to 1 × 10⁵ exhibits a low dark current of <2 pA at room temperature under 10 V bias. The photo-responsivity of the photodetector gradually increases as a function of applied bias, resulting in a photodetector quantum efficiency exceeding 100% at above medium bias. The photo-responsivity also shows a dependence on the incident optical power density and illumination conditions. The internal gain mechanism of the photodetector is attributed to photo-generated holes trapped at the semiconductor/metal interface as well as high-field-induced image-force lowering effect.     

High‐Sensitivity p–n Junction Photodiodes Based on PbS Nanocrystal Quantum Dots

Chemically synthesized nanocrystal quantum dots (NQDs) are promising materials for applications in solution‐processable optoelectronic devices such as light emitting diodes, photodetectors, and solar cells. Here, we fabricate and study two types of p‐n junction photodiodes in which the photoactive p‐layer is made from PbS NQDs while the transparent n‐layer is fabricated from wide bandgap oxides (ZnO or TiO₂). By using a p–n junction architecture we are able to significantly reduce the dark current compared to earlier Schottky junction devices without reducing external quantum efficiency (EQE), which reaches values of up to ～80%. The use of this device architecture also allows us to significantly reduce noise and obtain high detectivity (>10¹² cm Hz^1/2 W^?1) extending to the near infrared past 1 μm. We observe that the spectral shape of the photoresponse exhibits a significant dependence on applied bias, and specifically, the EQE sharply increases around 500–600 nm at reverse biases greater than 1 V. We attribute this behavior to a “turn‐on” of an additional contribution to the photocurrent due to electrons excited to the conduction band from the occupied mid‐gap states.     

GaN p–n junction diode formed by Si ion implantation into p-GaN

²⁸Si⁺ implantation into Mg-doped GaN, followed by thermal annealing in N₂ was performed to achieve n⁺-GaN layers. The carrier concentrations of the films changed from 3×10¹⁷ (p-type) to 5×10¹⁹ cm⁻³ (n-type) when the Si-implanted p-type GaN was properly annealed. Specific contact resistance (ρ_c) of Ti/Al/Pt/Au Ohmic contact to n-GaN, formed by ²⁸Si⁺ implantation into p-type GaN, was also evaluated by transmission line model. It was found that we could achieve a ρ_c value as low as 1.5×10⁻⁶ Ω cm² when the metal contact was alloyed in N₂ ambience at 600 °C. Si-implanted GaN p–n junction light-emitting diodes were also fabricated. Electroluminescence measurements showed that two emission peaks at around 385 and 420 nm were observed, which could be attributed to the near band-edge transition and donor-to-acceptor transition, respectively.     

Simulation of submicrometer metal–semiconductor–metal ultraviolet photodiodes on gallium nitride

Ultrafast metal–semiconductor–metal ultraviolet photodetectors on GaN with 0.3-μm finger width and spacing were fabricated and packaged with a specially designed fast circuit. The assembly was simulated using a distributed circuit approach with optical illumination at λ = 270 nm. The results from simulations showed a 30-ps response time at a low illumination level. At high illumination, the response time increases significantly due to the space-charge screening effect. This is the first theoretical simulation report of this effect in ultrafast ultraviolet photodetectors on GaN. Comparison of simulations and measurements was made in a wide range of optical energies, and a close agreement was achieved with a single energy-scaling factor.     

InGaN/GaN multiple quantum well green light-emitting diodes prepared by temperature ramping

High-quality InGaN/GaN multiple-quantum well (MQW) light-emitting diode (LED) structures were prepared by a temperature-ramping method during metal-organic chemical-vapor deposition (MOCVD) growth. Two photoluminescence (PL) peaks, one originating from well-sensitive emission and one originating from an InGaN quasi-wetting layer on the GaN-barrier surface, were observed at room temperature (RT). The observation of high-order double-crystal x-ray diffraction (DCXRD) satellite peaks indicates that the interfaces between InGaN-well layers and GaN-barrier layers were not degraded as we increased the growth temperature of the GaN-barrier layers. With a 20-mA and 160-mA current injection, it was found that the output power could reach 2.2 mW and 8.9 mW, respectively. Furthermore, it was found that the reliability of the fabricated green LEDs prepared by temperature ramping was also reasonably good.     

生长停顿改善MOCVD生长InGaN/GaN多量子阱的特性

利用金属有机物化学气相淀积(MOCVD)生长了InGaN/GaN多量子阱(MQWs)结构,研究了生长停顿对InGaN/GaN MQWs特性的影响.结果表明,采用生长停顿,可以改善MQWs界面质量,提高MQWs的光致发光(PL)与电致发光(EL)强度;但生长停顿的时间过长,阱的厚度会变薄,界面质量变差,不仅In组分变低,富In的发光中心减少,而且会引入杂质,致使EL强度下降.