InGaN-GaN MQW LEDs with Si treatment

Surface morphologies of the metal-organic chemical vapor deposition-grown p-GaN layers with and without Si treatment were investigated by atomic force microscope and scanning electron microscope. It was found that Si treatment resulted in a much rougher sample surface due to the formation of a thin Si/sub x/N/sub y/ layer. It was also found that forward voltage of the Si-treated InGaN-GaN light-emitting diode (LED) was slightly higher than that of conventional LED without Si treatment. However, it was also found that such Si treatment could also result in a much larger LED output intensity.     

InGaN-GaN MQW LEDs with current blocking layer formed by selective activation

Selective activation technique was used to define a semi-insulating current-blocking layer underneath the p-pad of InGaN-GaN multiple-quantum-well light-emitting diodes (LEDs). The output power of the LEDs at 20 mA was increased 10% because less current was injected underneath the opaque p-pad.     

InGaN/GaN MQW双波长LED的MOCVD生长

利用金属有机物化学气相淀积(MOCVD)系统生长了InGaN/GaN多量子阱双波长发光二极管(LED).发现在20 mA正向注入电流下空穴很难输运过蓝光和绿光量子阱间的垒层,这是混合量子阱有源区获得双波长发光的主要障碍.通过掺入一定量的In来降低蓝光和绿光量子阱之间的垒层的势垒高度,增加注入到离p-GaN层较远的绿光有源区的空穴浓度,从而改变蓝光和绿光发光峰的强度比.研究了蓝光和绿光量子阱间垒层In组分对双波长LED的发光性质的影响.此外,研究了双波长LED发光特性随注入电流的变化.     

The ESD protection characteristic and low-frequency noise analysis of GaN Schottky barrier diode with fluorine-based plasma treatment

In this work, the electrostatic discharge (ESD) protection of Schottky diode with fluorine-based plasma treatment is proven by transmission-line pulse (TLP) measurement. And the low-frequency noise (LFN) is used to determine the activation energy (E_a) of a GaN Schottky diode with plasma treatment. This experiment compares the Schottky diode with CF₄ and CHF₃ plasma treatment, respectively with a standard Schottky diode to determine the characteristics and to assess the low-frequency noise and the ESD protection ability.     

低温生长n型氮化镓插入层提高LED抗静电能力

在这篇论文里,我们通过在InGaN/GaN 多量子阱和n型氮化镓层中间插入一层低温生长的n型氮化镓显著提高了LED的抗静电能力。通过引入低温生长的氮化镓插入层使得LED抗击穿电压超过4000V的良品率从9.9%提升到74.7%。低温生长的氮化镓插入层作为后续生长的多量子阱的缓冲层,释放了量子阱中的应力并且改善了量子阱的界面质量。另外,我们证明了在氮气气氛下生长低温氮化镓插入层对于LED抗静电能力的改善要强于氢气气氛,同时也进一步证明低温插入层对量子阱中应力的释放有利于提高LED的抗静电能力。光电测试结果表明,在引入低温nGaN缓冲层后,LED的电学特性并没有衰退,并且LED的光输出功率提高了13.9%。     

Temperature dependence of performance of InGaN/GaN MQW LEDs with different indium compositions

The temperature dependence of performance of InGaN/GaN multiple-quantum-well (MQW) light-emitting diodes (LEDs) with different indium compositions in the MQWs was investigated. With increasing In composition in the MQWs, the optical performance of the LEDs at room temperature was increased due to an increase in the localized energy states caused by In composition fluctuations in MQWs. As the temperature was increased, however, the decrease in output power for LED with a higher In composition in the MQWs was higher than that of LED with a lower In composition in the MQWs. This could be due to the increased nonradiation recombination through the high defect densities in the MQWs resulted from the increased accumulation of strain between InGaN well and GaN barrier.     

Improved ESD properties by combining GaN-based light-emitting diode with MOS capacitor

An InGaN/GaN light-emitting diode (LED) combined with a metal–oxide semiconductor (MOS) capacitor has been fabricated for high electrostatic discharge (ESD) protection. By connecting a MOS capacitor in parallel with the GaN-based LED, a level of defense against the ESD is significantly strengthened from 200 to 1900 V of human body mode (HBM), which corresponds to 6- to 7-fold enhancement in the ESD robustness of LEDs.     

Improvement of near-ultraviolet InGaN-GaN light-emitting diodes through higher pressure grown underlying GaN layers

The 410-nm near-ultraviolet (near-UV) InGaN-GaN multiple quantum-wells light-emitting diodes (LEDs) with low-pressure-grown (200 mbar) and high-pressure-grown (400 mbar) Si-doped GaN underlying layers were grown on c-face sapphire substrates by metal-organic vapor phase epitaxy. Increasing the growth pressure during the initial growth of the underlying n-type GaN epilayers of the near-UV InGaN-GaN LEDs was found to reduce the amount of threading dislocations that originated from the GaN-sapphire interfaces. The electroluminescence intensity of LEDs with underlying GaN layers grown at a higher pressure was nearly five times larger than that of LED with layers grown at lower pressure. Additionally, two-order reduction of leakage current was also induced for the LEDs grown at a higher pressure.     

On-chip ESD protection design by using polysilicon diodes in CMOSprocess

A novel on-chip electrostatic discharge (ESD) protection design by using polysilicon diodes as the ESD clamp devices in CMOS process is proposed in this paper. Different process splits have been experimentally evaluated to find a suitable doping concentration for optimizing the polysilicon diodes for both on-chip ESD protection design and the application requirements of the smart-card ICs. The secondary breakdown current (It2) of the polysilicon diodes under the forward- and reverse-bias conditions has been measured by the transmission-line-puIse (TLP) generator to investigate its ESD robustness. Moreover, by adding an efficient VDD-to-VSS clamp circuit into the IC, the human-body-model (HBM) ESD robustness of the IC with polysilicon diodes as the ESD clamp devices has been successfully improved from the original ~300 V to become ⩾3 kV. This design has been practically applied in a mass-production smart-card IC     

Design of edge termination for GaN power Schottky diodes

The GaN Schottky diodes capable of operating in the 300–700-V range with low turn-on voltage (0.7 V) and forward conduction currents of at least 10 A at 1.4 V (with corresponding forward current density of 500 A/cm²) are attractive for applications ranging from power distribution in electric/hybrid electric vehicles to power management in spacecraft and geothermal, deep-well drilling telemetry. A key requirement is the need for edge-termination design to prevent premature breakdown because of field crowding at the edge of the depletion region. We describe the simulation of structures incorporating various kinds of edge termination, including dielectric overlap and ion-implanted guard rings. Dielectric overlap using 5-μm termination of 0.1–0.2-μm-thick SiO₂ increases the breakdown voltage of quasi-vertical diodes with 3-μm GaN epi thickness by a factor of ∼2.7. The use of even one p-type guard ring produces about the same benefit as the optimized dielectric overlap termination.     

InGaN/GaN多量子阱蓝光LED的p-GaN盖层的MOCVD生长研究

利用金属有机物化学气相淀积（MOCVD）生长了InGaN／GaN多量子阱（MQW）蓝光发光二极管（LED）,研究了不同Cp2Mg流量下生长的p-GaN盖层对器件电学特性的影响。结果表明,随着Cp2Mg流量的提高,漏电流升高,并且到达一临界点会迅速恶化;正向压降则先降低,后升高。进而研究相同生长条件下生长的p-GaN薄膜的电学特性、表面形貌及晶体质量,结果表明,生长p-GaN盖层时,Cp2Mg流量过低,盖层的空穴浓度低,电学特性不好;Cp2Mg流量过高,则会产生大量的缺陷,盖层晶体质量与表面形貌变差,使得空穴浓度降低,电学特性变差。因此,生长p-GaN盖层时,为使器件的正向压降与反向漏电流均达到要求,Cp2Mg流量应精确控制。     

Improved light-output power of GaN LEDs by selective region activation

A novel selective high resistivity region (SHRR) is created under the p-pad metal electrode of a normal GaN light emitting diode. In conventional designs, light generated under the opaque p-pad metal electrode is absorbed or reflected by the contact and lost. In the SHRR design, the area under the p-pad metal electrode is selectively given a higher resistance, reducing current flow and light generation under the contact. Under constant current testing, the current normally passing through the SHRR region is instead distributed over the visible (i.e., useful) area of the device, resulting in significantly increased light-output power and luminous efficiency.     

AlxGa1-xN/GaN肖特基二极管的高温特性

High-temperature characteristics of the metal/AlxGa1-xN/GaN M/S/S （M/S/S） diodes have been studied with current-voltage （I-V） and capacitance-voltage （C-V） measurements at high temperatures. Due to the presence of the piezoelectric polarization field and a quantum well at the AlxGa1-xN/GaN interface, the AlxGal-xN/GaN diodes show properties distinctly different from those of the AlxGa1-xN diodes. For the AlxGa1-xN/GaN diodes, an increase in temperature accompanies an increase in barrier height and a decrease in ideality factor, while the AlxGa1-xN diodes are opposite. Furthermore, at room temperature, both reverse leakage current and reverse breakdown voltage are superior for the AlxGa1-xN/GaN diodes to those for the AlxGa1-xN diodes.     

High-temperature characteristics of AixGa1-xN/GaN Schottky diodes

High-temperature characteristics of the metal/AlxGa1_xN/GaN M/S/S (M/S/S) diodes have been studied with current-voltage (I-V) and capacitance-voltage (C-V) measurements at high temperatures. Due to the presence of the piezoelectric polarization field and a quantum well at the AIxGa1_xN/GaN interface, the AIxGa1_xN/GaNdiodes show properties distinctly different from those of the AIxGa1_xN diodes. For the AIxGa1_xN/GaN diodes, an increase in temperature accompanies an increase in barrier height and a decrease in ideality factor, while the AIxGa1_xN diodes are opposite. Furthermore, at room temperature, both reverse leakage current and reverse break-down voltage are superior for the AIxGa1_xN/GaN diodes to those for the AIxGa1_xN diodes.     

Improved 634 nm MQW AlGaInP LEDs performance with novel tensile strain barrier reducing layer

Light-emitting diodes (LEDs) under long-term or high-current operating undergo significant performance change and degradation with time. Thus a novel Ga/sub x/In/sub 1-x/ P tensile strain barrier reducing (TSBR) structure is grown between window and cladding layers of multi-quantum-well-AlGaInP LEDs. The TSBR (/spl sim/ 150 AGa/sub x/In/sub 1-x/P) film is of lattice size and valence band energy intermediate between those of window and cladding layers, thus reducing band offset. Experimental characterization shows significant decrease in device forward bias, dynamic resistance and junction heating, with strong improvement in power output degradation for the high current region. Various compositions of Ga/sub x/In/sub 1-x/P TSBR are fabricated, aged at dc 50 mA, and tested at nonradiative and radiative current levels. Optimal Ga/sub x/In/sub 1-x/P composition is determined. Two separate power output degradation mechanisms are noted and discussed. In sum, the TSBR layer appears a highly successful design for improved power efficiency, reliability and global lifetime behavior of an LED-type device.     

双极晶体管和肖特基二极管改进技术

设计进步及封装技术的改进使开发优化的分立半导体器件成为可能,例如低饱和电压晶体管及超低正向压降肖特基整流二极管。此类新器件可满足当争电子产品在散热、效率,空间占用和成本方面的高要求．对于便携式电池供电设备(如笔记本电脑、数码相机)及汽车中的负载切换和电源系统,此粪新器件是首选的解决方案。     

Nitride-based MQW LEDs with multiple GaN-SiN nucleation layers

Nitride-based light emitting diodes (LEDs) separately prepared with a conventional single low-temperature (LT) GaN nucleation layer and multiple GaN-SiN nucleation layers were both prepared. It was found that we could reduce defect density and thus improve crystal quality of the GaN-based LEDs by using multiple GaN-SiN nucleation layers. With a 20-V applied reverse bias, it was found that the reverse leakage currents measured from the LED with a single LT GaN nucleation layer and the one with 10-pair GaN-SiN nucleation layers were 1.5/spl times/10/sup -4/ and 2.5/spl times/10/sup -6/ A, respectively. It was also determined that we could use the multiple GaN-SiN nucleation layers to enhance the output intensity of near ultraviolet (UV) LEDs and to improve the reliability of nitride-based LEDs.     

Nitride-based LEDs with MQW active regions grown by different temperature profiles

Nitride-based light-emitting diodes (LEDs) with multiple quantum-well active regions were separately prepared by metal-organic vapor phase epitaxy in different temperature profiles. Compared with conventional samples, the reduced reverse leakage current and improved electrostatic discharge characteristics of the LEDs can both be achieved using temperature ramping and temperature cycling methods. However, using the temperature ramping may degrade the optical properties of devices due to desorption of In atoms and/or impurity incorporation. With an emission wavelength of 465 nm, the 20-mA output powers measured were 5.5, 6.0, and 7.9 mW for temperature ramping LED, conventional LED, and temperature cycling LED, respectively.     

Effects of silicone coating degradation on GaN MQW LEDs performances using physical and chemical analyses

This work presents a physics of failure (POF) methodology coupling failure signatures with physico-chemical analyses. The aim is to work out electro-optical failure signatures located in packaged InGaN/GaN Multiple Quantum Wells Light Emitting Diodes (MQW LEDs). Electrical and optical characteristics performed after accelerated ageing tests (30 mA/85 °C/1500 h), confirm a 65% drop of optical power and an increase of one decade of leakage current spreading at the silicone oil/chip interfaces. Through measurements of silicone coating fluorescence emission spectra, we demonstrate that the polymer enlarges the LED emission spectrum and shifts central wavelength. This shift is related to silicone oil spectral instability and the central wavelength of packaged LED appears to be temperature insensitive. In this paper, we discriminate the degradation of bulk silicone oil responsible for optical losses from the polymer/chip interface inducing larger leakage current.